HyperStac RX Series is a Z axis interconnection solution designed for all types of micro-electronics applications requiring reliable and compact packaging solutions. The Hyperstac RX Series meets the needs of the Defence, Avionics and Space electronics applications.

ORSKOREA’s centerless grinding machines ensure stable accuracy and durability without the need for chucks or centers. By allowing workpieces to rotate freely between the grinding and regulating wheels, they deliver high-efficiency and uniform machining for shafts, pins, housings, and other cylindrical components used in aerospace, defense, and advanced automotive systems. Key Advantages • High productivity through fast, efficient multi-part processing • ±2μm precision and long-term repeatability • Versatility to handle components from small to large sizes • Hydrostatic slides and spindles minimizing heat and vibration • Proven stability for high-value part manufacturing such as engine components, battery cases, and optical housings By combining productivity, accuracy, and reliability, ORSKOREA’s centerless grinders significantly enhance competitiveness in both defense and civilian applications.

OptAI’s on-device LLM solution optimizes and compresses models for mobile NPUs such as Qualcomm Snapdragon and Samsung Exynos, enabling a broad spectrum of AI services including automatic note generation, real-time translation, question answering, and personal assistant features. Free from cloud dependency, it delivers seamless performance with high efficiency and ultra-low latency. With OptAI, your device evolves into a truly intelligent and personalized AI companion.

Additive manufacturing: - enables custom electronics cooling solutions, providing precise heat management, compact designs, and improved reliability for high-density electronic components. - battery coolers offer optimized thermal management, extending battery life, enhancing energy efficiency, and ensuring compact integration in electric vehicle systems. - allows for tailored cooling solutions for electric motors, improving heat dissipation, enhancing performance, and reducing system weight for efficient operation.

- 1 axis Fiber Optic Gyroscopes - Bias Repeatability: 0.1°/hr - Bias Stability: 0.02 °/h (1,000 sec) - Angle Random Walk: 0.005 °/√hr - Scale Factor Accuracy: 500 ppm - Operating Voltage: 5 V (1 A) - Interface: RS422 Weight: 1.0 kg EMC: MIL-STD-461E

Ultra-High Density: With a pin spacing of 0.025 inches, it achieves maximum miniaturization and lightweight design. Ultimate Reliability: Designed to ensure perfect signal integrity even in harsh environments. Durability: Boasts outstanding environmental resistance that meets military and aerospace standards.

This explosive detector, built on a photochemical sensor, is a security device that detects traces of explosives by sucking in the surrounding air. It is scheduled for trial application at APEC 2025.

EMCORE’s exclusive photonic integrated chip (PIC) technology delivers improved reliability and repeatability. The precision non-ITAR GEO-FOG 3D Dual features two GNSS antennas on a fixed PTK baseline to offer increased heading, pitch, and roll accuracy for static and dynamic applications where a single antenna system can be problematic. This dual antenna INS is the best choice for systems requiring heading at start-up or in low dynamic conditions. Highlights Data rate 10x faster than other available systems Cutting-edge sensor fusion for dependable, precise navigation in a full array of applications and conditions Six degrees of freedom (DoF) IMU with integrated gyros and accelerometers Technology Details Photonic Integrated Chip Technology EMCORE’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s even more reliable and delivers superior repeatability unit-to-unit. With three of these integrated photonic gyros at its core, the P-1750 IMU enables the GEO-FOG to provide the safe, accurate performance autonomous platforms demand. Learn More DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. GEO•FOG Manager The GEO•FOG Manager is ideal when integrating EMCORE’s GEO•FOG 3D and GEO•FOG 3D Dual INS. Learn More Developer’s Kit for Rapid Integration The KVH FOG/IMU Developer’s Kit includes easy-to-use software to accelerate your IMU and FOG integration, development, and interface efforts.