AquaShieldIR key benefits: Water repellency: creates a water-repellent surface on IR imaging lenses, preventing water droplets from adhering. This feature ensures clarity and visibility, even in rainy or foggy conditions. Enhanced visibility in wet conditions: by repelling water droplets, AquaShieldIR™ enables IR imaging lenses to perform optimally in wet conditions. Improved Image Quality: thanks to the preventions of water droplets and contaminants from adhering to the lens surface, resulting in improved image quality.

Collects data from various sensors within the aircraft system, converts it into the required format, and transmits it to the mission computer or flight control computer. Converts control commands received from the mission computer or flight control computer and relays them to sensors and other peripheral devices. Supports system control functions, monitors the status of key systems, and provides feedback. Achieves 70% cost competitiveness compared to equivalent-performance products. - x2 MIL-STD-1553B - x2 UART (RS-422/485) - x24 Analog input interfaces - x8 Analog output interfaces - x64 Discrete input interfaces - x40 Discrete output interfaces - Size : 270 x 270 x 62.2mm - Weight : 2.5Kg - Power : MIL-STD-704F (28VDC, 10W) - Environment : MIL-STD-810G - EMI/EMC : MIL-STD-461G

Lock Ring & Braid & Backshell

Original compact design and long-term production know-how. System reliability and overall competitiveness.

Developed in 2002 as a single-soldier, short-range, anti-tank weapon system, we continue to work with soldiers to provide the weaponry needed to succeed. Backed by nearly two decades of experience, the resurgence of the tank in battle validates our expertise in this field. It’s the same old story – and David still beats Goliath.

DIVE (Digital Interactive Virtual Environment) is a GIS-based smart construction management platform jointly developed by ZYX Technology and Korea Expressway Corporation. Designed to meet the growing demand for intelligent infrastructure solutions, DIVE provides real-time integration, monitoring, and analysis of all location-based construction data. By consolidating diverse sources such as design drawings, land maps, aerial imagery, BIM data, drone footage, and CCTV into a single platform, DIVE enables comprehensive, on-site visibility and control. From large-scale infrastructure to complex tunnel projects, all key information can be accessed and compared in real time, allowing for smarter, faster, and more accurate decision-making. The main dashboard provides a live overview of each project site, including tasks, equipment, workers, events, and safety issues. With its daily work management feature, site managers can view exact personnel and equipment allocations for each zone, improving efficiency and minimizing risk. DIVE also supports seamless integration with tunnel monitoring systems, offering real-time access to excavation status, geotechnical sensors, and worker presence inside the tunnel. This ensures enhanced safety and process transparency in high-risk environments. Drone integration further strengthens site management by providing up-to-date aerial visuals, reducing blind spots and enabling rapid response to field changes. In addition, the platform links design drawings with cadastral maps to streamline permitting, track construction progress, and manage change orders with geographic accuracy. Whether you're building roads, tunnels, or complex infrastructure, DIVE empowers construction teams with a powerful digital environment to manage the entire project lifecycle.

EMCORE’s SDI170 IMU is designed as a performance-compatible inertial system that is form, fit, and functional with a legacy RLG-based IMU product, but with superior overall performance, versatility, and a significantly higher MTBF (Mean Time Before Failure) rating over ruggedized environments. The tactical performance of the SDI170 IMU is based on EMCORE’s mature, proven, dependable and accurate quartz MEMS inertial sensor technology in our SDI500 tactical-grade IMU. EMCORE’s quartz technology enables repeatable high-volume production of precisely machined sensor structures combined with the inherent large signal output and thermal stability of quartz materials. The SDI170 IMU is designed for demanding, mission-critical, rugged environments and ideal for continuous use applications with no wear-out components, highly linear accelerometer performance and longer life compared to competing alternatives. It is constructed with EMCORE’s latest generation quartz gyros, quartz accelerometers, and high-speed signal processing to achieve outstanding precision performance. The solid-state quartz sensors and hermetically sealed IMU construction provide reliable MTBF and a 20-year operating and storage life. Continuous Built-in Test (BIT), configurable communications protocols, electromagnetic interference (EMI) protection and flexible input power compatibility make the SDI170 IMU easy to use in a wide range of higher-order integrated commercial and defense system applications.

Today, space satellites are moving away from RF Analog based payloads providing low speed telecommunication signaling, to a new Digital Transparent Processor architecture for high throughput satellites. Those architectures increase the demand for rugged and higher speed connectivity. To meet those industry needs, Smiths Interconnect has developed the NXS Series, an advanced high speed, high density interconnect to provide next generation data on demand. Equipped with the Hypertac® hyperboloid contact technology the NXS system can withstand data rate application up to 50 Gbps (per channel) requirements, including extreme levels of vibration, shock and climatic testing above 2100 g. The NXS Series is designed in a robust construction with 4 or 12 high speed quadrax (dual-twinax) modules. The recent EMI Flange addition provides the extra benefit of reducing electromagnetic interference. Each ultra-high density quadrax module contains 2 dual twinax at 100 Ω each pair. It is blind mateable, hot pluggable, with ultra-low mating forces and low outgassing materials. In addition, the solderless PCB mount design reduces the customer’s risk and cost of ownership. The connector is mounted after reflow and has no impact on nearby components.