The Series 23 SuperNine® advanced performance MIL-DTL-38999 connector series provides many of the technology advances exceeding MIL-DTL-38999 Series III. Higher mating cycles, integrated banding porch, PC Tail and standoff availability and crimp termination Hermetics are all part of the family.

Generates 2D electronic map images using a terrain database and transmits them to the mission computer via the ARINC-818 standard. Using Collins Aerospace's TERPROM software, enabling automatic terrain-following flight and terrain collision avoidance functions. - x2 Gigabit Ethernet - x1 MIL-STD-15583B - x4 Discrete Input - x2 Discrete Output - x4 ARINC-818 Transmit - 512GB Solid-State Disk (Digital Moving Map) - 64GB Solid-State Disk (TERPROM) - Size : 135.1x339.0x225.4 mm - Weight : 4.25Kg - Power : MIL-STD-704F (28VDC, 60W) - Environment: MIL-STD-810G - EMI/EMC: MIL-STD-461G

TESCAN SOLARIS X 2 extends FIB physical failure analysis capabilities to large-area applications, making deep cross-sectioning of advanced packaging devices, displays, MEMS, and optoelectronic devices more efficient. Featuring the new generation Mistral™ Xe Plasma FIB column, SOLARIS X 2 offers increased maximum ion beam current and a sharper ion beam profile across the full range, with significantly reduced beam tails. This allows operators to use higher milling and polishing currents, achieving superior surface quality comparable to conventional Plasma FIB, but with greater speed and precision.

Threaded bushing enables localized reinforcement of and attachment to panel structure. Supplied with disposable installation fixture. 1.25" Flange Diameter. SIZES: Imperial fine thread sizes from 10-32 (.190"-32) to 3/8-24 (.375"-24), Imperial coarse thread sizes from 8-32 (.164"-32) to 3/8-16 (.375"-16), and metric thread sizes from M5 to M8. 1.25" Flange Diameter. Grip lengths from 0.25" to 1.50". MATERIALS: Aluminum, 300 Series Stainless Steel, A-286 Stainless Steel, 316 Stainless Steel, and Titanium. Optional epoxy primer. FEATURES: Standard 1.25" diameter flange, 0.75" x 1.25" trimmed flange optional.

A REDCOM SVG system consists of one or more REDCOM Sigma® SVG-1200 units and a series of standard production General Dynamics Sectéra vIPer phones. Each REDCOM SVG-1200 can interface with up to 12 vIPer phones, which act as voice encryptors for TDM or VoIP voice networks. The encryptors allow any line, trunk, or conference port to conduct secure voice communications with any SCIP-capable device. If more than 12 secure talk paths are required, multiple SVG-1200 units may be networked together.

Versatile, high density 4 contact row connector solution for board to board and wire to board with built in coding and keying as well as ESA qualification. With a 0.6mm contact diameter, CMD connectors are available from 42 to 316 contact positions with dip solder and SMT soldering contact termination types.

Quapason™ is a high-performance vibratory gyroscope from Safran Electronics & Defense, combining the compactness of MEMS with the reliability of Fiber-Optic Gyroscopes (FOG). It delivers exceptional robustness, ultra-low noise, and high signal stability, making it ideal for stabilization and inertial navigation in harsh environments. Used in weapon turret stabilization, avionics, and artificial horizons, it has surpassed 140,000 units delivered, proving its reliability and precision across civil and military applications.

These units are very compact in size and weight is less than 400 kg. Units in this compartment can have rated output power up to 90 kVA. Units are fully compliant with the required parameters and are used as solid state units. EAC-series frequency converters are strictly compatible with all types of aircraft requiring output AC and confirm the international standards.