ORSKOREA’s high frequency grinding spindles, operating at speeds up to 120,000 rpm—the highest level in Korea—are engineered for ultra-precision and durability in critical defense and aerospace applications. In addition to belt-driven, built-in motor, hydrostatic, and hydrodynamic types widely used in semiconductor and precision equipment, our spindles are customized to deliver the exact speed and power output required by customers. With over 25 years of expertise in repairing and retrofitting leading Japanese, German, and Swiss brands such as TOYO, KOYO, OKUMA, GMN, and Fischer, and with multiple proprietary patents including joint developments with Schaeffler Korea, ORSKOREA ensures proven reliability. These spindles are ideal for machining high-value defense components such as armored vehicle gears, drone actuators, aircraft engine parts, multispectral sensor housings, and advanced optical or communication devices, supporting the competitiveness of both defense and civilian manufacturers.

QPL certification is a system in which the US government guarantees the quality only for products that have passed strict local company inspections made of 150 tests and verifications under the supervision of the US government. Yeonhab Precision obtained the certification in Asia for the first time after 10 years of application. In particular, with the successful QPL registration for the first time in Asia, Yeonhab Precision is the first and only company in Asia which got the qualification of marking “MS” with the title of “Korea’s first MIL-DTL connector”. We will provide customers with the best products as we have the sense of the pride of developing the QPL certified connector with our own technology in Korea.

In addition to honeycomb potting, sandwich components often also have to be sealed and thus reinforced in the edge areas. For this purpose, similar or even identical filling materials are used as those used for filling the honeycombs themselves. Namely, core and edge filling compounds with very low density, which is achieved by enriching the material with hollow spheres. With our dosing technology, this process can also be automated. The 1-component or 2-component materials are processed gently – without changing their material properties. The material application can be fully automated or semi-automated. Thanks to pulsation-free dispensing, the best results can be achieved with the minimum of effort. This allows you to reduce production times while optimizing production processes at the same time.

The AI Inspection Rover is capable of autonomous driving indoors and outdoors, obstacle avoidance, high-resolution image acquisition, aircraft underbody inspection, and platooning. Its low-height design allows it to pass under the aircraft, and with its zero-turn function, it can execute missions more efficiently. Additionally, it can drive slopes of up to 10° and overcome bumps of up to 30mm.

The SBC3612D is a rugged 3U VPX single board computer aligned with the compute-intensive SOSA profile, delivering high-performance processing with the Intel® Xeon® D-2775TE 16-core processor and flexible expansion capabilities. • Supports up to 64GB DDR4 SDRAM and 480GB NAND Flash (NVMe SSD) • Offers 100GbE and 10/25GbE data plane and control plane support • Features the Xilinx® Zynq® UltraScale+™ MPSoC FPGA for enhanced security

Product Information Frequency signal generator for small target detection High-frequency resolution design and frequency conversion function using DDS method main performance Frequency: Ku-Band ~ Ka-Band Very Small Size, Pulse Mode Output Level: -5dBm min Spurious: -30dBc min Harmonic: -40dBc min Phase Noise: High Performance Frequency Sensibility: 50ppm max Port isolation: 50dBc Min Applicable fields Applicable to ultra-small guided weapon tower system and small radar system

The SWE450S is a rugged 3U VPX fully managed Layer-2/3 Ethernet switch aligned with the compute-intensive SOSA profile, delivering high-performance 25/100 GbE switching and flexible I/O reconfiguration. • High-performance 2 Tbps switch fabric with wire-speed throughput • Front: up to 2x 100 GBASE-SR4 (MPO); Rear: 25/100 GbE KR4, 100/1000 BASE-T, USB-C, RS-232Reconfigurable fat-pipe to thin-pipe ports, speed downgrading capability • Dual-core ARM + OpenWare™ management, sanitization support • SOSA-aligned (SLT3), rugged air- & conduction-cooled options

· Proven combat ship developed based on the latest warships of the ROK Navy · Expanded VLS capacity for layered air-defense and strike missions · AI-driven CMS for faster threat assessment and multi-domain coordination · Unmatched growth potential for future naval missions with larger deck space and increased displacement