Ultisense™ is Safran Vectronix’s line of high-performance OEM sensing modules, including ultra-compact Laser Rangefinders (LRF) and Digital Magnetic Compasses (DMC). Designed for seamless integration into military and civilian systems, they offer exceptional accuracy, ruggedness, and Swiss precision. LRF modules measure distances up to 30 km with ±1 m accuracy, while DMC modules provide azimuth accuracy down to 0.25°, even under extreme shock and environmental conditions.

The COX640AV embodies COX’s cutting-edge cooled MWIR imaging technology, delivering unparalleled performance for the most demanding applications. Its 640x512 resolution and 15μm pixel pitch InSb sensor achieve thermal sensitivity of less than 20mK, ensuring crystal-clear imaging for precise analysis. Capable of operating across a wide temperature range, the COX640AV supports multiple imaging modes and advanced processing functions including AGC, NUC, and customizable color palettes. This ensures adaptability to a variety of mission-critical environments such as defense, aerospace, scientific research, and industrial inspection. In addition to superior imaging quality, the COX640AV is designed for reliability and operational readiness. With rapid image stabilization after startup and robust construction, it performs consistently in harsh environments where stability is non-negotiable. Its combination of cooled MWIR precision, advanced processing features, and rugged design positions the COX640AV as a trusted solution for customers who require accuracy, speed, and durability. By integrating COX’s proprietary calibration expertise, it not only provides outstanding real-time imaging but also guarantees long-term reliability and service continuity.

Relief Valve ensures high flow rate compared to competitor market designs. Climb/Dive Valve is a pressure equalizing solution for enclosed volumes that experience pressure differential levels between the internal and external pressure values of the system. Ball Valve is very commonly used on UAV and land systems. It is available with high torque and low torque actuation. Materials, sizes, end connects customizable.

ALTERNATIVES TO: MS25271 / MS25395 / MS25267 / MS25269 / MS25273 / MS27418

Today, space satellites are moving away from RF Analog based payloads providing low speed telecommunication signaling, to a new Digital Transparent Processor architecture for high throughput satellites. Those architectures increase the demand for rugged and higher speed connectivity. To meet those industry needs, Smiths Interconnect has developed the NXS Series, an advanced high speed, high density interconnect to provide next generation data on demand. Equipped with the Hypertac® hyperboloid contact technology the NXS system can withstand data rate application up to 50 Gbps (per channel) requirements, including extreme levels of vibration, shock and climatic testing above 2100 g. The NXS Series is designed in a robust construction with 4 or 12 high speed quadrax (dual-twinax) modules. The recent EMI Flange addition provides the extra benefit of reducing electromagnetic interference. Each ultra-high density quadrax module contains 2 dual twinax at 100 Ω each pair. It is blind mateable, hot pluggable, with ultra-low mating forces and low outgassing materials. In addition, the solderless PCB mount design reduces the customer’s risk and cost of ownership. The connector is mounted after reflow and has no impact on nearby components.

Nara Space’s first standard nanosatellite for Earth observation constellations with 7 optical bands and 1.5 m GSD. Launched November 2023 to the 525 km of the orbit, it has 2 years Mission Lifetime.

Designed to deliver the highest level of performance, the non-ITAR TAC-450-360 IMU includes our exclusive photonic integrated chip (PIC) technology. The high-performance TAC-450-360 IMU is designed for applications in which high bandwidth, low latency, and low drift are critical. The TAC-450-360 IMU is integrated with inertial-grade accelerometers and three axes of magnetometers to provide the high accuracy levels that leading autonomous and manned platforms demand. Highlights Designed for ease of integration with flexible interface settings and programmable message outputs Excellent performance in critical applications and the specs that matter most Improved SWaP plus robust performance and survivability Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.

Sung Jin’s Nano Miniature Connector is applied twist pin for low engagement and separation force. Nano Miniature connector has a .025 inch contact space, and #30AWG, #32AWG of wire sizes are accepted. Innovative contact system that allows current of 1AMP ensures excellent electrical performance and characteristics. Sung Jin C&T’s Nano D miniature connector is designed to meet MIL-DTL-32139 standards and guarantees excellent mating performance and environment.