The NSP-5 is an all-weather, multimode, Ku-band radar designed to fly on Group 3-4 Unmanned Airborne Systems (UAS). Its low-Size, Weight, and Power (SWaP) design means ample room for other onboard sensors, such as Electro-Optical and Infrared (EO/IR) cameras. This means users can understand the bigger picture. The NSP-5 is capable of performing spot and stripmap Synthetic Aperture Radar (SAR) and Magnitude Change Detection (MCD), as well as Moving Target Indication (MTI) collections in a variety of maritime and land environments in all weather conditions. This includes smoke, fog and other obscurations where the operators do not have a clear view of the terrain below them. The NSP-5 has a proven track record of reliability and has a recommended maintenance interval of 2,000 hours. Additionally, the modular design makes the NSP-5 easy to integrate onto most platforms.

Tescan AMBER integrates BrightBeam™ field-free SEM optics with the Orage™ Ga⁺ FIB and fully automated lamella workflows. Designed for versatility, it supports inverted and planar sample prep, nanoprototyping, and gentle final polishing across a wide range of material types.

1. 용도 : 전원발생장치에 의해 생성된 전력을 공급받아 필요한 전원을 일정하게 공급하는 장치 2. 기능 : 정격출력 10kW, 3상 220V 공급 3. 관련 장비/체계 분야 : 30밀리 자주대공포(비호복합), 단거리지대공무기(천마) 4. 관심 협업 분야 / 목표시장(국가) - 전차ㆍ장갑차 그 밖의 전투기동장비 / 국내 방위산업시장 및 해외 (미국, 멕시코, 프랑스, 이스라엘, 인도네시아, 말레이시아, 아랍에미리트, 유엔국 등) 5. 기타사항 - 영구자석 기반 발전기 기술 및 고효율 에너지변환 기술(특허보유) - 국방규격화 완료, 해외수출 경쟁력 제품

Large Area Display Head Unit is included in avionics equipments used in the cockpit of an aircraft. Its wide screen vision development implements Full Glass Cockpit in aircraft. It also provides processing with more efficient yet less complicated circumstance with maximum 4 external input video signals Options that can be provided are - 20"x8" LCD Glass, LCD Module and Entire LAD system unit

In addition to honeycomb potting, sandwich components often also have to be sealed and thus reinforced in the edge areas. For this purpose, similar or even identical filling materials are used as those used for filling the honeycombs themselves. Namely, core and edge filling compounds with very low density, which is achieved by enriching the material with hollow spheres. With our dosing technology, this process can also be automated. The 1-component or 2-component materials are processed gently – without changing their material properties. The material application can be fully automated or semi-automated. Thanks to pulsation-free dispensing, the best results can be achieved with the minimum of effort. This allows you to reduce production times while optimizing production processes at the same time.

The TAC-450 FOG offers exceptional performance in bias stability, scale factor, and angle random walk, and is available in nine configurations to solve the most challenging design projects. The TAC-450 FOG is ideal for air, land, or maritime stabilization and pointing applications. Due to its versatility, and accurate, reliable output, it can also be utilized in navigation, guidance, and control systems. Highlights Designed for maximum ease of integration with housed or unhoused (for OEM configurations) options Available in nine configurations to solve the most challenging design projects Exceptional performance in bias stability, scale factor, and angle random walk 1-, 2-, or 3-axis configuration, each employing the world’s smallest precision FOG Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.

The SCXMC-HDLC card operates through the XMC interface of the SBC and provides real-time communication for control and status data based on synchronization signals. It supports serial communication via the SBCRTM’s Micro D-sub 37-pin connector using a standard D-sub 9-pin interface, allowing long-distance transmission through LVDS signaling. With four transmit/receive channels, it achieves 1–8 Mbps per channel and delivers low-latency performance of less than 40 µs for real-time operations. A device driver program is required for operation, and the Linux driver can be downloaded from Seedcore’s product page. Drivers for other operating systems can be developed upon request. This module is deployed in the L-SAM multi-function radar system, enabling fast and reliable control data communication across mission-critical components.

Plane Windows are used as substrates for a variety of applications, such as laser window, output couplers, beamsplitters, beam combiners, mirrors, dichroic filters and plate polarizers. Considerations in selecting window substrates include transmission range, absorption coefficient, incident laser power density and environmental factors such as pressure, temperature, moisture, abrasion and corrosion. Plane Windows listed under UV / VIS / NIR substrates are specified for applications involving coating wavelengths 193nm ≤ λ〈2.0 μm. Units for these substrates are given in mm. Plane Windows listed under IR substrates are specified for applications involving coating wavelengths λ≥ 2.0 μm. Units for these substrates are given in inches. Refer to the THIN FILM COATINGS section for information on coatings that can be applied to these substrates.