The ENS4000(Sub-6 5G Outdoor base station) is designed for outdoor services in the n79 (4.7GHz) band, providing coverage on the kilometer scale and enabling seamless private 5G service even in outdoor environments.

The static-dynamic mixer vipro-DUOMIX is perfectly suited for compressible, two-component materials – with very different viscosities, extreme mixing ratios and high-pressure sensitivity. The extended version with optimized mixing blocks for low-viscosity, and high-viscosity materials on either side brings a further advantage: It is ideally suited for materials that are difficult to mix – with different or identical viscosities. A modular design with five different dispenser sizes per side allows complete flexibility. And a wide range of mixing ratios from 1:1 to 100:1. The vipro-DUOMIX can be used for complex two-component applications in diverse industries such as automotive manufacturing, aerospace, or electronics. Irrelevant of whether it is for a dot dispensing, a bead application or for a potting application. Particularly in the production of aircrafts the static-dynamic mixer is used for honeycomb potting or for edge sealing. Special nozzles with adjustable bead width are available for this purpose. A wide range of two-component materials based on e.g., polyether, epoxy resin, silicone or polyurethane can be dispensed in all areas of application. Due to the parallel alignment of the dispensers, and due to a weight-optimized design, the vipro-DUOMIX is very compact – ideal for assembly in robotic cells or for automated applications.

In addition to honeycomb potting, sandwich components often also have to be sealed and thus reinforced in the edge areas. For this purpose, similar or even identical filling materials are used as those used for filling the honeycombs themselves. Namely, core and edge filling compounds with very low density, which is achieved by enriching the material with hollow spheres. With our dosing technology, this process can also be automated. The 1-component or 2-component materials are processed gently – without changing their material properties. The material application can be fully automated or semi-automated. Thanks to pulsation-free dispensing, the best results can be achieved with the minimum of effort. This allows you to reduce production times while optimizing production processes at the same time.

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EMCORE’s exclusive photonic integrated chip (PIC) technology delivers improved reliability and repeatability. The precision non-ITAR GEO-FOG 3D Dual features two GNSS antennas on a fixed PTK baseline to offer increased heading, pitch, and roll accuracy for static and dynamic applications where a single antenna system can be problematic. This dual antenna INS is the best choice for systems requiring heading at start-up or in low dynamic conditions. Highlights Data rate 10x faster than other available systems Cutting-edge sensor fusion for dependable, precise navigation in a full array of applications and conditions Six degrees of freedom (DoF) IMU with integrated gyros and accelerometers Technology Details Photonic Integrated Chip Technology EMCORE’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s even more reliable and delivers superior repeatability unit-to-unit. With three of these integrated photonic gyros at its core, the P-1750 IMU enables the GEO-FOG to provide the safe, accurate performance autonomous platforms demand. Learn More DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. GEO•FOG Manager The GEO•FOG Manager is ideal when integrating EMCORE’s GEO•FOG 3D and GEO•FOG 3D Dual INS. Learn More Developer’s Kit for Rapid Integration The KVH FOG/IMU Developer’s Kit includes easy-to-use software to accelerate your IMU and FOG integration, development, and interface efforts.

DIVE (Digital Interactive Virtual Environment) is a GIS-based smart construction management platform jointly developed by ZYX Technology and Korea Expressway Corporation. Designed to meet the growing demand for intelligent infrastructure solutions, DIVE provides real-time integration, monitoring, and analysis of all location-based construction data. By consolidating diverse sources such as design drawings, land maps, aerial imagery, BIM data, drone footage, and CCTV into a single platform, DIVE enables comprehensive, on-site visibility and control. From large-scale infrastructure to complex tunnel projects, all key information can be accessed and compared in real time, allowing for smarter, faster, and more accurate decision-making. The main dashboard provides a live overview of each project site, including tasks, equipment, workers, events, and safety issues. With its daily work management feature, site managers can view exact personnel and equipment allocations for each zone, improving efficiency and minimizing risk. DIVE also supports seamless integration with tunnel monitoring systems, offering real-time access to excavation status, geotechnical sensors, and worker presence inside the tunnel. This ensures enhanced safety and process transparency in high-risk environments. Drone integration further strengthens site management by providing up-to-date aerial visuals, reducing blind spots and enabling rapid response to field changes. In addition, the platform links design drawings with cadastral maps to streamline permitting, track construction progress, and manage change orders with geographic accuracy. Whether you're building roads, tunnels, or complex infrastructure, DIVE empowers construction teams with a powerful digital environment to manage the entire project lifecycle.

The SC-DSPRTM, a Seedcore Co., Ltd representative product, is a backplane transmission module that performs the I/O function of the DSP282A. When the DSP282A board is plugged into the motherboard(Backplane) in front of the Chassis, you can extend the I/O function of the board by plugging the SC-DSPRTM board into the back of the Backplane. The DSP282A board consists of two computing nodes. To support this, Ethernet, USB, MMCX, and mini-HDMI ports are allocated to each node, and synchronization signal input ports can also be used simultaneously on both nodes.

A compact EO/IR gimbal camera system designed for UAVs, unmanned surface vehicles, and defense platforms. The system integrates a QVGA/VGA-class LWIR thermal imager and a high-resolution EO camera within a stabilized gimbal, ensuring reliable performance in diverse environmental conditions. Optimized for ISR (Intelligence, Surveillance, Reconnaissance) missions, the system provides detection, recognition, and identification (DRI) capabilities with low-SWaP (Size, Weight, and Power) characteristics.