Side shells, wing shells and fuselage structures are made of CFK, GFK, aluminium or organic sheets and get connected during production. Sealants are used to seal the connection surfaces. These are usually two-component polysulphides, which have to be applied in different geometries. Typical applications are: Fillet sealings, oversealings, interface sealings and seal caps. Due to their properties, polysulfides require very low pressure and shear handling. The compressibility of the fillers contained in the medium requires a high level of expertise and a coherent overall system from material removal to application. With manual application, long production times and high material ejection have a negative influence on the complete process. Complex quality standards are required due to the risk of human error. With the in-house developments of the vipro-DUOMIX from ViscoTec, this process can be depicted fully automatically. The individual nozzle design is also adapted to each application. The result is a controlled dosage in compliance with the specifications and at the same time the highest repeat accuracy.

Machine vision system Factory automation Medical imaging systems Robot eyes

- Lens cover device: protects the lens from stones and other foreign objects - Manual opening/closing device: allows manual operation in case the automatic mechanism fails due to foreign object blockage or freezing

At trade shows around the world, Kallman’s flagship service, the Partnership Pavilion, is America’s full-service, business-to-business headquarters; the on-site hub of the U.S. and Canadian export community. The Partnership Pavilion covers Aerospace; Defense; Maritime; Medical; Mining; Oil & Gas; and Food industries. The Pavilion presents the perfect platform for business, maximizing U.S. and Canadian exhibitor exposure and creating a networking forum. Prime exhibit space & quality designs: Built on the idea that an organized group of exhibitors is easier to find than stand-alone booths scattered throughout a show, the USA and Canada Partnership Pavilions always attracts a crowd. Professional Amenities and Staff: Every USA and Canada Partnership Pavilion is staffed by an experienced event team dedicated to your success. Whether you need a liaison to the organizers, tech support, a contractor, caterer, translator, printer, or help tracking down a shipment... we’re here to help. Exclusive events and programs: As an exhibitor you have exclusive access to all Partnership Pavilion events; including our Opening Ceremony and Ribbon-Cutting, off and on-site hospitality receptions, business and market insight briefings, and special presentations.

Magnetic sensors (Hall effect) for air and land applications fly by wire

AASM Hammer™ is an all-weather smart air-to-surface weapon with an extended stand-off capacity. AASM Hammer™ sets new standards in Close Air Support missions as well as deep strike missions with its family of warheads and guidance kits. One system for all strike missions AASM Hammer™ is compatible with different standard bomb bodies (125, 250, 500 and 1000 kg). Autonomous and insensitive to jamming, this weapon system can be launched from low altitude, over rough terrain. Modularity at the heart of all your needs Interoperable and modular, AASM Hammer™ covers all the tactical requirements of air forces thanks to different guidance kits: - INS / GPS - INS / GPS / IR - INS / GPS / laser

Designed to deliver the highest level of performance, the non-ITAR TAC-450-360 IMU includes our exclusive photonic integrated chip (PIC) technology. The high-performance TAC-450-360 IMU is designed for applications in which high bandwidth, low latency, and low drift are critical. The TAC-450-360 IMU is integrated with inertial-grade accelerometers and three axes of magnetometers to provide the high accuracy levels that leading autonomous and manned platforms demand. Highlights Designed for ease of integration with flexible interface settings and programmable message outputs Excellent performance in critical applications and the specs that matter most Improved SWaP plus robust performance and survivability Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.

The PolarFire FPGA and PolarFire SoC families already deliver the industry’s best thermal and power efficiency in the mid-range segment. Optimized for deploying systems with high-compute performance in small form factors, the families have reduced the size and weight of power-constrained systems in applications including industrial imaging, robotics, AI-enabled medical systems and smart defense and aerospace systems.