Taktic buckle system for quick connect & release Antibacterial/FR treated padded spacer mesh system Poly mesh cummerbund for increased ventilation XFrame® Dynamic Load Carrige® compatible Compatible with our entire accessories line Flush admin chest pocket with internal elastic straps PALS webbing for MOLLE attachment Zipper for DS Assaulter's Zip-On Back Panels QASM buckle system Increased structural integrity and reduced rear deformation Internal plate pocket retention straps accommodate several different plate thickness Soft armor included Composition Material: 500D Cordura® + ARAMID/PV® Size : Small / Medium : 8.5" x 11.5” -9.3" x 12.3" Plate Pocket Front Panel Area of Coverage : Length 13.25” Width 11" Large / XLarge : 10" x 13"- 10.9" x 13.8” Plate Pocket Front Panel Area of Coverage : Length 15" Width 12" Colors: MC (MultiCam) BMC (Black MultiCam) BK (Black) RG (Ranger Green) CYT (Coyote Brown)

Signaty X IR Helmet Strobe is a next‑generation, domestically developed IFF LED device. It features IR plus RGBW color LEDs (red, green, blue, white), all housed under a high‑strength polycarbonate dome. It supports multi‑wireless synchronization via short‑range communication, GPS/RTC, and mesh relay—enabling simultaneous use of RGB LED + IR or RGB LED + white LED, with up to 42 pattern synchronizations (expandable to 252) using 256‑bit encrypted data. Runtime reaches up to 130 hours (LED 130 h / IR 125 h) on a single AA battery. Built to MIL‑STD‑810G and KC standards, it ensures drop, dust, sand, immersion, and temperature resistance. Manufactured in Korea with domestic service support.

This product supports the following transmission standards. Designation Bit Rate ========== ========== CXP-1 1.250 Gbps CXP-2 2.500 Gbps CXP-3 3.125 Gbps CXP-5 5.000 Gbps CXP-6 6.250 Gbps CXP-12 12.500 Gbps The CXR-2C amplifies and transmits image signals from 1/2-channel CoaXPress cameras to a PC frame grabber. Typically, transmission matches the distance between the camera and the device. Transmission distance depends on the coaxial cable type, and due to significant variability, specific distances are not provided.

High density, lightweight signal connector specifically designed for applications where space and weight is at a premium for board to board interconnections. The HDLP series meets the requirement of space-constrained applications that require low mating force, a high number of mating cycles, low and stable contact resistance, and excellent fretting corrosion resistance.

We bring all our skills and expertise to bear in product development and in-service support in order to meet our customers' needs: 3D drawings and design Aeroelasticity Thermal, CFD analysis Static and dynamic analysis Electrical/hydraulic/mechanical system design Cost-optimized design, cost-benefit analysis Parametric experiment design Optimization techniques and algorithms Multiphysics modeling Concessions management: control plan, extension of concession, design engineering office, concession justification, impact analysis (FMECA, process/design change, etc.), definition of a repair program, updating of certifications Flight physics Configuration management Design, calculation and modeling Composite or metallic parts

The First & Only Autonomous AI Pilot Deployed Since 2018

Similar to a human pilot, Hivemind reads and reacts to the battlefield, and does not require GPS, waypoints, or comms to make decisions. Hivemind enables intelligent teams to perform missions ranging from room clearance with Novas, penetrating air defense systems with V-BATs, to dogfighting F-16s.

Intelligent Teaming

Shield AI’s synthetic environments combined with human-machine tactics and behaviors. Testing and learning in real physics simulations reduces engineering cycle times and enables rapid real-world deployment. Welcome to the defense metaverse.

Edge Autonomy

The aircraft uses sensors to create a map or world-view, the computer then tells the aircraft or autopilot where to go and what to do to execute its mission. No GPS, no waypoints, and no comms are needed for aircraft to accomplish their missions.

TESCAN SOLARIS X 2 extends FIB physical failure analysis capabilities to large-area applications, making deep cross-sectioning of advanced packaging devices, displays, MEMS, and optoelectronic devices more efficient. Featuring the new generation Mistral™ Xe Plasma FIB column, SOLARIS X 2 offers increased maximum ion beam current and a sharper ion beam profile across the full range, with significantly reduced beam tails. This allows operators to use higher milling and polishing currents, achieving superior surface quality comparable to conventional Plasma FIB, but with greater speed and precision.

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