The NSP-8 is IMSAR’s most powerful radar. It is capable of advanced Synthetic Aperture Radar (SAR), Moving Target Indication (MTI), and Magnitude Change Detection (MCD). When paired with an airborne server, it can even produce SAR Motion Video (SMV). IMSAR adds value to its exceptional engineering with a production time much faster than industry standard. The NSP-8 is designed for durability and thoroughly tested with a Mean Time Before Failure (MTBF) of over 2,000 hours. Additionally, it’s weatherized for optimal performance over land and sea. With this sensor, IMSAR’s users can understand the bigger picture.

Powered by NVIDIA® Jetson AGX Orin™ SoM bundled with JetPack 5.1.1 Powered by NVIDIA® Jetson AGX Orin™ Industrial bundled with JetPack 6.0 Rugged -25°C to 70°C fanless operation (JAO32/ JAO64) - No throttling at 55°C with JAO64 MAXN Mode Rugged -40°C to 75°C fanless operation (JAOi) - No throttling at 50°C with JAOi MAXN Mode IP66 waterproof and dustproof Support 8x GMSL2 automotive cameras via FAKRA Z connectors (NRU-230V-AWP) 4x PoE+ GbE and 1x 10GBASE-T via M12 X-coded connectors 2x isolated CAN 2.0, 1x RS232, and 1x isolated RS485 via M12 A-coded connectors 1x system monitoring port by automotive-grade MCU 8V to 48V wide-range DC input with built-in ignition power control Compatible GMSL2 cameras with pre-built drivers

Inserts are used in the aerospace industry in lightweight sandwich panels and are then bonded. The panels can then be screwed or various components can be fastened. However, the manual process has several disadvantages: Enormous expenditure of time for the manual filling of several thousand inserts, high material waste due to relaxation of the material, and high material costs through the use of cartridges. ViscoTec can map the filling process automatically. The dispensing process is absolutely precise. A significant amount of material can thus be saved. In addition, material can be supplied from large containers, which in turn lowers purchase prices. Another important advantage: As a rule, no new specifications have to be made since no changes are made to the actual process.

Two-lug nutplate with bracket-retained nut element for FOD-critical applications where nut replaceability is desired but nut element retainer clips are not permitted. Supplied with integral elastic installation fixture. Fixture simplifies nutplate installation by providing bondline clamp-up and maintenance of concentricity with the fastener hole, ensuring full availability of nut float and protection of threads from adhesive.

It is equipped with advanced multi-sensor payloads such as EO/IR and LiDAR, enabling precise data collection in diverse environments. The drone is optimized for tasks ranging from infrastructure inspection to tactical surveillance. Its versatility allows operators to adapt quickly to different mission requirements with a single platform.

Digital mission engineering tools connect every stage of the engineering product lifecycle, from initial design to operation. They enable reality-based 3D simulation across multi-domain environments such as air, space, land, and sea by incorporating high-resolution terrain, satellite orbits, RF and radar systems, and sensor environments to accurately replicate real mission conditions. With accurate dynamics-based physical models at the core, these tools provide quantitative analysis of relative positioning between systems, changes in altitude and attitude, line-of-sight availability, and communication link status. Users can predict and evaluate mission elements such as sensor operations, communication links, platform maneuvers, and orbit optimization through scenario-based simulations.

This pouch is designed to store mission-essential equipment during operations. It provides efficient storage for magazines, IFAKs, radios, and other critical gear. Hesed Korea’s tactical pouches are constructed from durable 500D Cordura fabric and feature modular compatibility for attachment to plate carriers.

The SBC6511 Rugged Single Board Computer(SBC) from Abaco Systems features the new high performance, highly integrated Intel® Xeon® E processor (‘Coffee Lake Refresh’). Powered by Intel® Xeon® W processors, offering robust computational power. • Supports up to 64 GB DDR4 SDRAM with ECC and up to 256 GB (or in some variants up to 480 GB) NVMe SSD storage • Offers high-throughput networking: Dual 40 GbE data-plane (KR4 “fat pipes”) • Features the Xilinx® Zynq® UltraScale+™ MPSoC FPGA (ZU7EG) for enhanced security