AI Navigation Algorithm Certus features Advanced Navigation’s revolutionary AI neural network sensor fusion algorithm. It was designed for control applications and has a high level of health monitoring and instability prevention to ensure stable and reliable data. High-Performance MEMS Certus contains high performance MEMS sensors that are put through Advanced Navigation’s intensive 8 hour temperature calibration process. This provides the highest accuracy possible from this sensor class and outputs consistent accuracy over the full temperature range from -40°C to 85°C. Dual Antenna RTK GNSS Certus contains a dual frequency RTK GNSS receiver that provides up to 1 cm accuracy positioning and supports all of the current and future satellite navigation systems, including GPS, GLONASS, GALILEO, BeiDou and QZSS. Dual antenna heading provides high accuracy heading that is not impacted by magnetic interference and has no motion requirements. Time Synchronization Certus contains a GNSS disciplined oscillator that can act as the primary time source within a distributed time system, enabling access to ultra-accurate system time using PTP or NTP network time sync. Certus also has a high-accuracy 1PPS and frequency output. Multi-Protocol Support Certus features multiple interfaces including Ethernet, CAN, RS232, RS422 and GPIOs. Certus supports all the industry standard protocols including NMEA 0183, NMEA 2000, TSS, PASHR, Simrad as well as a wide variety of proprietary protocols. It features a rich web UI and 256GB of internal logging.

Hermetic connectors are a special class of sealed Mil /Aero interconnect that incorporates glass-to-metal or other highly-engineered sealing technology. Hermetic seal connectors are specified for applications as divergent as submarines and orbiting satellites. They are deployed to resist moisture ingress in underground applications and to withstand pressure differentials in vacuum chambers, laboratory equipment and commercial and military aircraft. Hermetic seal connectors, such as the MIL-DTL-38999 Series I, II, III and IV supplied by Glenair, are principally designed for use in military aerospace — in fact, the sealing requirement for connector hermeticity was originally driven by military electronic applications. But the products are equally at home in commercial applications such as oil-patch, logging equipment or medical devices.

Whether at the airport, in the aircraft or in the sky, we are redefining aviation for safer, more efficient flight. We're building the technology today to meet the needs of tomorrow's more information-driven and connected aviation ecosystem.

With a proven track record of innovation, quality and reliability, Microchip continues to evolve as the foremost supplier of semiconductors to the aerospace and defense market. Our rapidly-expanding portfolio of highly-integrated technology supports the most demanding requirements for space, aviation and defense microelectronics. From radiation-hardened, space-grade solutions to advanced military and commercial aviation electronics, we've leveraged our expertise and product knowledge to build applications-based solution platforms that reduce integration risk, improve productivity and speed time to market. - More than 60 years of space flight heritage with products qualified to the highest government, DLA, NASA and ESA standards - Proven innovation, quality and reliability on aerospace platforms over the past 20 years - Legacy of trusted, reliable and cyber-secure supply chain for defense microelectronics

Titanium Grade 1 Strip Titanium Grade 2 Bars-Sheets and Plates-Tubes and Pipes Titanium Grade 5 ELI Bars-Sheets and Plates Titanium Ti-6Al-7Nb Bars

This rocket nozzle featuring conformal cooling channels and isogrid ribbing was manufactured using EOS Copper CuCP, a pure copper material optimized for additive manufacturing. The production required approximately 72 hours, taking advantage of the exceptional thermal and electrical conductivity of pure copper to meet demanding aerospace performance requirements. As one of the few companies in Korea capable of performing metal additive manufacturing with pure copper, we provide advanced technical expertise and support OEM production as well as collaborative technology development projects with various industrial partners. The showcased component was designed by nTopology and demonstrates the synergy of advanced design optimization with state-of-the-art copper additive manufacturing.

Auto Assembly Jig For : Wing Bottom Panel A320 Project 50m (L) x 1.1m (W) x 3.6m (H )

GENASYS Ultra high-performance mixed signal test platforms deliver a no compromise functional test solution for satellite, airborne electronics, and other mission critical applications. The scalable architecture supports up to 4500 "any resource to any pin" interface test points and features best-in-class digital performance, with preconfigured Benchtop solutions addressing a broad spectrum of lower channel density applications.