• Contacts • Backshells / protective caps • Solders sleeves / splices • In-line junctions • Identification labels • Wire terminals

The KX2-2046 is an X-band high-power MMIC amplifier fabricated on the GaN-on-SiC process. It operates from 8.0 – 10.5 GHz and typically provides 20W saturated output power with power-added efficiency of 46%. The KX2-2046 can support military and commercial radar systems. It is matched to 50Ω with integrated DC blocking capacitors on both RF input and output ports. The KX2-2046 is 100% DC and RF tested on-wafer. It is available in chip form. **Key Features** - Frequency Range: 8.0-11.5GHz - Small Signal Gain: 26dB - High Pout: 20W - High PAE: 46% - DC bias: Vd=28V @Idq=0.3A - Pulsed Vg: PW=100µs, DC=10% - Chip size: 2.95x1.66x0.1mm  

ORSKOREA’s high frequency grinding spindles, operating at speeds up to 120,000 rpm—the highest level in Korea—are engineered for ultra-precision and durability in critical defense and aerospace applications. In addition to belt-driven, built-in motor, hydrostatic, and hydrodynamic types widely used in semiconductor and precision equipment, our spindles are customized to deliver the exact speed and power output required by customers. With over 25 years of expertise in repairing and retrofitting leading Japanese, German, and Swiss brands such as TOYO, KOYO, OKUMA, GMN, and Fischer, and with multiple proprietary patents including joint developments with Schaeffler Korea, ORSKOREA ensures proven reliability. These spindles are ideal for machining high-value defense components such as armored vehicle gears, drone actuators, aircraft engine parts, multispectral sensor housings, and advanced optical or communication devices, supporting the competitiveness of both defense and civilian manufacturers.

Yuan Thor platform serves as the computational core for autonomous systems. Powered by NVIDIA® Jetson Thor™ (128GB LPDDR5X, 2560 CUDA cores, 96 Tensor cores), it delivers up to 2070 FP4 TFLOPS of AI performance for real-time sensor fusion, data analytics, and edge decision-making. Thor supports 16× MIPI CSI-2 cameras, audio in/out, CAN Bus, UART, I²C, SPI, and GPIO, enabling precise, low-latency responses for robotics, industrial automation, and autonomous vehicles.

MPS Microsystems offers a complete range of high precision ball screws for positioning less than 5 µm. Mostly custom-made, these screws ensure smooth and uniform movement resulting from the high precision of their thread, achieved by grinding. Our ball screws are made exclusively of stainless steel and are fitted with double nuts to allow fine adjustment of the axial play. Moreover, an optional ogival thread can provide a higher static and dynamic load capacity. Thanks to a large number of options, we can ensure that the ball screw meets your technical and quality needs. The following parameters can be personalized: lubricant (grease, oil, dry lubrication, no lubrication), customized screw ends, shape and external dimensions of the nut and screw, multiple nuts on the same screw, left-hand thread, thread length, specific axial play, special surface treatment, and more.

The SC-HPCRTM is a Rear Transition Module (RTM) designed to extend the I/O functionality of the HPC2812 high-performance computing board. It can be mounted on the rear side of the VPX backplane to enhance system connectivity and I/O flexibility. Since the HPC2812 board consists of two computing nodes, the SC-HPCRTM provides dedicated interfaces for each node, including Ethernet, USB, MMCX, and Mini-HDMI ports, ensuring optimal data communication and display output performance in mission-critical embedded systems.

The GRA117S is a rugged 3U VPX SOSA-aligned video graphics and GPGPU card delivering high-performance AI and graphics with the NVIDIA RTX™ 5000 and PCIe Gen-4 connectivity. • NVIDIA RTX™ 5000 (Ada Lovelace) GPU: 16 GB GDDR6 ECC, 9,728 CUDA/76 RT/304 Tensor Cores • PCIe Gen-4 interface, AV1/H.264/H.265 codecs, GPUDirect RDMA • Rugged design: conformal coating, air- & conduction-cooled, −40–71 °C range • SOSA slot profiles 14.6.11 & 14.6.13 compliant • Windows/Linux drivers, CUDA/CUDA-X/OpenCL support

Low Size, Weight and Power (SWaP) at only 297g. Up to 100 TOPS GPU by NVIDIA® Jetson Orin™ NX Supports multiple camera and sensor interfaces 2x GbE and 2x USB3 for RGB/ Infrared/ hyperspectral cameras and lidar/ radar 2x GMSL2 for HDR/ 3D cameras Built-in UART and CAN to interact with flight controller 1x M.2 2230 for storage and 4G/5G communication ready Supports 4S-14S drone battery pack Compatible GMSL2 cameras with pre-built drivers