High impedance D-Sub connectors are designed to ground the outer shield of a twinax or quadrax contact directly to the shell of the connector. A multi-finger ground spring fixed around the shell provides a multi-point contact engagement that affords superior EMI shielding. The end result is an extremely low contact resistance when measured from the contact outer body to the connector flange, ensuring minimal RF noise and high durability of over 500 mating cycles.

Small wind power systems and component components Durability technologies: Composites - nacelle, blades, corrosion protection Stability technology: and wind speed control (electrical) + tail folding (mechanical) High-efficiency system: Direct-drive PMSG - slotless, blades, coefficient of power (Cp): 0.429 MPPT (Maximum Power Point Tracker) : Maximum power following control Web monitoring: Real-time monitoring Easy to maintain and install Quality Assurance: More than 3 years System certification: New and renewable energy facility certification, new product (NEP), excellent product designation by the Public Procurement Service - Korea's first Element parts certification: generator, inverter-CE, blade static load test, demonstration test completed Annual average wind speed of 4.5m/s or more

EMCORE’s exclusive photonic integrated chip (PIC) technology delivers improved reliability and repeatability. The precision non-ITAR GEO-FOG 3D Dual features two GNSS antennas on a fixed PTK baseline to offer increased heading, pitch, and roll accuracy for static and dynamic applications where a single antenna system can be problematic. This dual antenna INS is the best choice for systems requiring heading at start-up or in low dynamic conditions. Highlights Data rate 10x faster than other available systems Cutting-edge sensor fusion for dependable, precise navigation in a full array of applications and conditions Six degrees of freedom (DoF) IMU with integrated gyros and accelerometers Technology Details Photonic Integrated Chip Technology EMCORE’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s even more reliable and delivers superior repeatability unit-to-unit. With three of these integrated photonic gyros at its core, the P-1750 IMU enables the GEO-FOG to provide the safe, accurate performance autonomous platforms demand. Learn More DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. GEO•FOG Manager The GEO•FOG Manager is ideal when integrating EMCORE’s GEO•FOG 3D and GEO•FOG 3D Dual INS. Learn More Developer’s Kit for Rapid Integration The KVH FOG/IMU Developer’s Kit includes easy-to-use software to accelerate your IMU and FOG integration, development, and interface efforts.

국내 최초로 GaN MMIC HPA 개발을 통한 레이다 탐지용 TR Module 개발로 핵심기술을 확보 하였으며 S ~ Ka대역 주파수 범위에 최적화된 다양한 제품을 개발, 생산하고 있습니다.

Microchip Technology Incorporated is a leading provider of smart, connected and secure embedded control solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs, which reduce risk while lowering total system cost and time to market. The company's solutions serve more than 120,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. Welcome to Microchip, we hope to partner with you on a future project. We believe together we can accomplish anything.

Hydration port 2" Padded lumbar support Internal retention straps PALS webbing for MOLLE attachment Drag handle Antimicrobial/FR treated padded spacer mesh Top Front Exterior Pocket : 12.5" H x 9" W x 2.75" D Bottom Front Exterior Pocket : 10.5" W x 7.5" H x 2.75" D External Side Pockets : 11" H x 6.5"” W x 1.5" D Mesh Pockets : 10" H x 8" W & 7" H x 12.5" W Cubic Liters : 47.83L Dim. : 25" H x 13" W x 9" D Composition Material : 500D Cordura® + ARAMID / PV® Colors: MC (MultiCam) BMC (Black MultiCam) BK (Black) RG (Ranger Green) CYT (Coyote Brown)

KNF offers high qualified Aluminium products used in a wide range of markets around the world. *No.1 Stockholding & Qualified Aluminium Supplier *A1XXX/A2XXX/A3XXX/A5XXX/A6XXX/A7XXX Series and more *Business Areas: Aerospace & Defense / Semiconductor & Display / Marine & Silo / Automotive & EV Battery / Others

Kappa’s Armor Eye product family of advanced rugged camera solutions offers maximum flexibility for customized and program-specific DVE and SAS designs and integrations. The high-performance rugged vision solutions can be specifically configured according to the vehicle type and the mission tasks. We offer affordable Entry Level (EL) and very sensitive and wide dynamic High Quality (HQ) camera products. Benefit from our project-specific flexibility to adapt view angles and DRI performance for the best operational performance, day- and night 24/7. Turnkey Solution - DVE- und SAS Systems with DVU - Digital Video Distribution Unit DVE systems with up to two cameras can be built as direct camera-monitor systems (CMS). For the integration of a larger number of cameras, our advanced VDU represents the signal processing core for all Kappa’s turnkey AE DVE & SAS systems. This high-speed and digital FPGA based processing core offers multiple HD-SDI camera inputs and several HD-SDI outputs for lowest system latency performance glass-to-glass. Additional control and H.264 IP streaming interfaces greatly increase the VDU flexibility and enable information sharing between vehicles. Controlled by the crew or the gearbox switch, the VDU processes the selected camera channels, mixes and scales multiple camera information, performs driver assistance and tactical overlays of text and icons, and fi nally routes the selected view data to the respective output for display on the cockpit monitors. Best in class signal processing techniques and scaling algorithms guarantee the low latency generation of crisp and sharp images even under severe difficult ambient light conditions. Day & Night Vision (VIS/LWIR), image fusion, near-zero latency, scalable solutions up to 360° surround-view, adaptable FoV.