Wing shells, side shells and fuselage sections are usually made of carbon fibre composites and glued together during the production process. With many components, a groove or an open edge remains after the bonding process, which must be filled or sealed. A modified two-component epoxy resin is often mixed and then applied manually. This often entails long production times and complex quality controls. Equally high material costs due to the processing of materials from cartridges. ViscoTec defies short pot life and materials that are difficult to handle: Thanks to a coherent overall system from material removal to material application, this process can be automated. The two components are taken separately from cartridges, hobbocks or drums and fed via hose lines to a two-component dosing system. Only at the very end of the process they are mixed in a static mixing tube and applied to the substrate (e.g. via a nozzle). The process is controlled and monitored by pressure sensors.

Battlefield's Quick Disconnect technology is a leader in the UAV industry, and is now expanding expanding into ground defense vehicles. With over one million hours of successful flight time, Battlefield's quick disconnects have proven exceptional reliability even in extreme environments. EnduroLink by Battlefield has become the global standard UAV quick disconnects, widely applied across small to mid-sized UAV platforms worldwide. Fully customizable integrated design is available, including materials, size, and various end connect options even in the most demanding conditions.

The extended range of products offered through AMA is also reflected in the range of services provided. Each company has its own processing capabilities which vary from business to business. In essence, the collective capability of AMA embodies the latest technology to meet the needs of any specific metal processing requirement, including but not limited to: Cutting shape cutting milling surfacing sawing drilling guillotining waterjet cutting USI testing heat-treating or re-tempering forgings machining to near net shape

With a proven track record of innovation, quality and reliability, Microchip continues to evolve as the foremost supplier of semiconductors to the aerospace and defense market. Our rapidly-expanding portfolio of highly-integrated technology supports the most demanding requirements for space, aviation and defense microelectronics. From radiation-hardened, space-grade solutions to advanced military and commercial aviation electronics, we've leveraged our expertise and product knowledge to build applications-based solution platforms that reduce integration risk, improve productivity and speed time to market. - More than 60 years of space flight heritage with products qualified to the highest government, DLA, NASA and ESA standards - Proven innovation, quality and reliability on aerospace platforms over the past 20 years - Legacy of trusted, reliable and cyber-secure supply chain for defense microelectronics

- 1 channel - Up to 100 FBG sensors - Up to 50 kHz sampling frequency

Designed and suitable for a wide range of missions. It is light and ruggedized and its multi-purpose capability provides freedom of action for the commander in all environments.

Engineering Design Assistance Material Research & Development Manufacturing

- Installed on the fuselage or tail to provide flash lighting in a location that does not impede the visibility of position lights - The reflector rotates in an arc. - Flash Rate : 40 to 100 times per minute [cycle] - Effective Intensity : FAA FAR 29.1401 - SAE ARP 5825A