Our PIT systems are built to withstand the toughest weather conditions and meet international aviation standards. Our versatile configurations are tailored to your operational needs - from compact access units to advanced pop-up mechanisms. PIT system types: MINIPIT Hatch Systems – Compact and simple underground solution for smaller aprons or light traffic zones. Standard Hatch PIT Systems – Durable and reliable access pits for electrical, fuel, and IT systems under the apron. Pop-Up PIT Systems – Mechanized lifting PIT system for convenient and fast surface access when needed. Each system offers specific advantages depending on the scale, type of aircraft, and regional standards of your operations.

Powerful AI Capabilities On-prem LLM and RAG-based AI for fast and accurate information access Voice command support for hands-free control Optimized AR Technology VIRNECT View for AR visualization of work manuals VIRNECT Make for easy content creation and distribution

The world’s first satellite dedicated to blue carbon monitoring, launched in January 2025. Equipped with an AI-powered onboard processor, BlueBON processes electro-optical data directly in orbit, reducing latency and eliminating the need for energy-intensive ground-based processing. This establishes a new model for sustainable, application-driven EO missions.

Winchester Interconnect Micro, formerly known as Ulti-Mate Connector, designs and manufactures a broad range of precision engineered Micro D Connectors that are designed to be environmentally sealed, making them suitable for a wide range of applications. They can operate in temperatures ranging from -55°C to 125°C, with high-temperature versions available for more extreme environments (indicated by "HT" in the product name). These connectors come with 9 to 100 contacts and adhere to the MIL-DTL-83513 standard. And, leading manufacturer for high density, lightweight Nano connectors available in 9 to 51 contacts, these connectors cater to various applications. As a QPL qualified supplier for MIL-DTL-32139 product.

From multi-mission remotely piloted aircraft to sustainment, training, and support services.

Interconnect Wire Harness and Cable Assemblies are the connectivity backbone of electronic systems. Fabricated in a factory setting, build-to-print wire harness assemblies enable the OEM manufacturer to reduce the time and expense of in situ interconnection of electronic devices used in complex air, sea, land and space applications.

KMC Series includes high-density board to board and board to wire interconnect solutions available in multiple configurations from 26 to 162 positions with a 0.5mm contact diameter and is widely used in harsh environments. Space grade/ESA/ESCC qualified are also available.

The Aerospace & Defense Team's Business Service Providers (BSP) Directory is designed to help U.S. aerospace & defense companies identify professional service providers to assist them in the assessment, completion, and/or financing of an export transaction.