- Capable of manufacturing various types of cable assemblies, including MIL-DTL-38999, D-Sub, and other military-grade connectors - Expertise in both internal and external cable assembly configurations - In-house testing capabilities for electrical characteristics, including insulation resistance, dielectric withstand voltage, and continuity - Equipped with dedicated facilities and specialized equipment for cable assembly production and testing

• Contacts • Backshells / protective caps • Solders sleeves / splices • In-line junctions • Identification labels • Wire terminals

SNT Motiv created the 'K Series', the strongest infantry firearm boasting the highest accuracy and destructive power, through pure independent technology development, and is fulfilling its mission of national security as the first line of independent national defense.

Learn more about Tronair's technical manuals, troubleshooting, maintenance schedules, and products - plus our 3 authorized service centers located in Europe, 2 in Asia and 1 in North America allow our customers close and convenient locations to have any Tronair equipment repaired and tested.

EMCORE’s exclusive photonic integrated chip (PIC) technology delivers improved reliability and repeatability. The precision non-ITAR GEO-FOG 3D Dual features two GNSS antennas on a fixed PTK baseline to offer increased heading, pitch, and roll accuracy for static and dynamic applications where a single antenna system can be problematic. This dual antenna INS is the best choice for systems requiring heading at start-up or in low dynamic conditions. Highlights Data rate 10x faster than other available systems Cutting-edge sensor fusion for dependable, precise navigation in a full array of applications and conditions Six degrees of freedom (DoF) IMU with integrated gyros and accelerometers Technology Details Photonic Integrated Chip Technology EMCORE’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s even more reliable and delivers superior repeatability unit-to-unit. With three of these integrated photonic gyros at its core, the P-1750 IMU enables the GEO-FOG to provide the safe, accurate performance autonomous platforms demand. Learn More DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. GEO•FOG Manager The GEO•FOG Manager is ideal when integrating EMCORE’s GEO•FOG 3D and GEO•FOG 3D Dual INS. Learn More Developer’s Kit for Rapid Integration The KVH FOG/IMU Developer’s Kit includes easy-to-use software to accelerate your IMU and FOG integration, development, and interface efforts.

Model-Based Systems Engineering (MBSE) is a methodology that integrates design, analysis, and verification activities throughout the system lifecycle using architecture models. By modeling requirements, functions, structure, and behavior, MBSE supports consistent and informed decision-making. Ansys SAM (System Architecture Modeler) supports the latest system modeling language, SysML v2, and enables both graphical and textual modeling, real-time collaboration, and model management. Ansys ModelCenter integrates various engineering tools and builds automated workflows, enabling what-if simulations and trade studies. By connecting architecture models with simulation models, it supports consistent design analysis and requirements validation using a single source of truth (ASoT).

It is equipped with advanced multi-sensor payloads such as EO/IR and LiDAR, enabling precise data collection in diverse environments. The drone is optimized for tasks ranging from infrastructure inspection to tactical surveillance. Its versatility allows operators to adapt quickly to different mission requirements with a single platform.

Spring probes are designed to optimize performance in high reliability, multicycle applications. Smiths Interconnect’s spring probes are compliant which makes them ideal for blind mate applications as they self correct for x, y, z, rotational and angular misalignment of the target. Offered in compressed heights less than 2 mm and utilized on pitches as tight as 0.4 mm, they are well suited for high density, board-to-board, battery contact and high frequency applications. Mixed signals and functionality can be designed into a single connector.