The N Series of mini modular, high density connectors offers a variety of combinations in a single connector frame. It employs a do-it-yourself system based on the building block principle, which allows users to select the connector design that meets their specific requirements through off-the-shelf components.

Wing shells, side shells and fuselage sections are usually made of carbon fibre composites and glued together during the production process. With many components, a groove or an open edge remains after the bonding process, which must be filled or sealed. A modified two-component epoxy resin is often mixed and then applied manually. This often entails long production times and complex quality controls. Equally high material costs due to the processing of materials from cartridges. ViscoTec defies short pot life and materials that are difficult to handle: Thanks to a coherent overall system from material removal to material application, this process can be automated. The two components are taken separately from cartridges, hobbocks or drums and fed via hose lines to a two-component dosing system. Only at the very end of the process they are mixed in a static mixing tube and applied to the substrate (e.g. via a nozzle). The process is controlled and monitored by pressure sensors.

The family of PBS TJ40 turbojet engines features a compact design and excellent thrust-to-weight ratio. The engines are available in several versions incl. the PBS TJ40-G2 with high electric power output. Its distinctive features include simple and compact design, low weight and plug & play solution (all components including ECU integrated in the engine body). The engine weighs only 3.6 kg and provides a maximum thrust of 425 N.

Building secure, robust and reliable electronic systems for aerospace and defense applications is critical. You can take advantage of our extensive expertise and technical support to reduce your integration risk and development time. Our development ecosystem includes IP licenses, a variety of demonstration and evaluation kits, reference designs, software, application notes and detailed documentation. Our team of engineering, sales, marketing, logistics and quality experts provide the specialized support that you need to solve your most difficult design challenges.

The Crane stands as a state-of-the-art Mid-Wave Infrared (MWIR) detector. This device features a 5-megapixel resolution in a 2560×2048 format with a fine 5μm pitch. It is based on SCD's established XBn technology or Hot Full Midwave (HFM) and incorporates a digital readout circuit developed using an advanced CMOS process. The High Operating Temperature (HOT) Focal Plane Array (FPA) functions efficiently at 150K or 120K, enabling a large-format detector that excels in image quality while maintaining a relatively compact size, weight, and power consumption. SCD continues to lead in innovation.

The engine is suitable for MALE AUVs. Available in pusher and tractor configurations. Digital interface for control and monitoring. Stable operation at high altitudes and high temperatures. Ability to run at cold temperatures below -30°C without preheating.

This miniaturized system allows, depending on the desired configuration, to move very precisely between 1 and 3 sets of lenses over a stroke of several centimeters. The design has been optimized to ensure perfect alignment of the lenses and to minimize their tilt throughout the movement. This optomechanical system mainly consists of high-precision standard MPS and FAULHABER modules, such as brushless or stepper motors, ground ball screws with double nuts and linear ball bearings. It is particularly recommended for focusing a laser over a long distance, for example for the guidance of unmanned flying objects or for communication between flying objects. The number of lens sets, lens size and stroke can be configured at will.

Interconnect Wire Harness and Cable Assemblies are the connectivity backbone of electronic systems. Fabricated in a factory setting, build-to-print wire harness assemblies enable the OEM manufacturer to reduce the time and expense of in situ interconnection of electronic devices used in complex air, sea, land and space applications.