Glenair offers its connector and connector accessory customers every convenience in the provision of contact termination, shield termination, and backshell-to-connector assembly tooling. We are also proud to offer branded solutions from other well-known tool manufacturers such as Daniels (DMC) crimp tools. From pneumatic Earth-Bond tooling for the rail industry, to fiber optic termination and test equipment, Glenair is your most knowledgeable and reliable source for special-purpose interconnect assembly tooling. Our complete selection of manual shield termination and pneumatic bench-mount banding tools are the most prized in the industry. Only Glenair Band-Master ATS offers an integrated counter to ensure reliable, repeatable banding and calibration.

EOTDS is designed for Assault Riffle with our LED illuminating reticle technology. This sight helps user getting the target distance with the bullet drop compensator and is easy to aim properly. It is designed to be utilized with both eyes, providing quick target acquisition and engagement when needed. EOTDS can be used for hunting/recreational purpose.

Features Solid-state, maintenance-free, modular components for optimal mounting of controls, sensor, and display Automatic compensation ensures the highest degree of accuracy (±1º) LCD display with adjustable backlighting for easy viewing in all conditions Variable control of electronic damping for use in rough seas Meets demanding military standards for years of reliable performance Dual compensation for degaussing on and off Applications Naval vessels including aircraft carriers, battleships Smaller naval boats Amphibious craft

Applied for the Localization Development Project of Core Components in Weapon Systems Conducted basic design for the development for mechanical Mine Sweeping Equipment for MSH, followed by submission of a proposal and presentation for in-person evaluation Patent : Mine Sweeping System with loT Based Functional Float

We empower businesses to leverage Extended Reality (XR) for training, skill development, and digital transformation. Whether you need us to develop Virtual Reality (VR), Augmented Reality (AR), or Digital Twin simulations, or prefer to create immersive content independently, WEAVR supports you with the cutting-edge no-code platform. Born from the aerospace industry, WEAVR leverages the same precision and operational excellence required in mission-critical environments to elevate training and simulation across multiple industries. From Manufacturing and Energy to Healthcare, Defense, Safety and beyond, we provide organizations with the next-generation immersive tools to optimize performance, enhance safety, and drive innovation. WEAVR enables organizations to quickly and easily produce, deploy, and manage engaging XR experiences without any coding skills. Designed for scalability and seamless integration, it helps businesses: Enhance training retention and engagement Accelerate skill development Reduce costs and time to deployment Standardize protocols across teams Onboarding program Gain real-time insights for continuous improvement Our goal? Turning your ideas into scalable Extended Reality training solutions. Extended Reality-driven training and innovation are already here.

OZVPX3-410 is Olzetek's flagship 3U product. Olzetek's 3U Platform Family has maximum scalability using Xilinx Zynq® UltraScale +MPSoC, which is capable of a high-performance Arm®-based multi-core and multi-processing system, as well as video signal/packet processing functions, graphics and video pipelines. This is a SoC product designed to meet challenging demands by offloading essential applications to dedicated processing blocks and supporting major peripherals and interfaces. The OZVPX3-410 product is an ideal solution that can be applied to applications requiring Analog Video (PAL/NTSC) encoding and decoding and includes customization options (consignment development) according to specific video inputs, requirements analysis, and design. We also provide consignment development of a complete Video 3U Platform.

TESCAN SOLARIS X 2 extends FIB physical failure analysis capabilities to large-area applications, making deep cross-sectioning of advanced packaging devices, displays, MEMS, and optoelectronic devices more efficient. Featuring the new generation Mistral™ Xe Plasma FIB column, SOLARIS X 2 offers increased maximum ion beam current and a sharper ion beam profile across the full range, with significantly reduced beam tails. This allows operators to use higher milling and polishing currents, achieving superior surface quality comparable to conventional Plasma FIB, but with greater speed and precision.