Building on an unsurpassed legacy of success, GE continues to execute on bold technical initiatives to ensure even more demonstrable support to the warfighter and those in need of humanitarian relief.

The PolarFire FPGA and PolarFire SoC families already deliver the industry’s best thermal and power efficiency in the mid-range segment. Optimized for deploying systems with high-compute performance in small form factors, the families have reduced the size and weight of power-constrained systems in applications including industrial imaging, robotics, AI-enabled medical systems and smart defense and aerospace systems.

Robotic technology that combines IoT and autonomous driving technologies provides key solutions for future mobility manufacturing. Main Functions Innovative manufacturing system using Collaborative Robot and Autonomous Mobile Robot ptimize production processes and provide logistics flexibility Ensuring Optimal Production Process Using AI Application Site HMGICs : Flexible Production Cells (smart manufacturing) Targeted to supply to global manufacturing sites

Developed in 2002 as a single-soldier, short-range, anti-tank weapon system, we continue to work with soldiers to provide the weaponry needed to succeed. Backed by nearly two decades of experience, the resurgence of the tank in battle validates our expertise in this field. It’s the same old story – and David still beats Goliath.

EMCORE’s exclusive photonic integrated chip (PIC) technology delivers improved reliability and repeatability. The precision non-ITAR GEO-FOG 3D Dual features two GNSS antennas on a fixed PTK baseline to offer increased heading, pitch, and roll accuracy for static and dynamic applications where a single antenna system can be problematic. This dual antenna INS is the best choice for systems requiring heading at start-up or in low dynamic conditions. Highlights Data rate 10x faster than other available systems Cutting-edge sensor fusion for dependable, precise navigation in a full array of applications and conditions Six degrees of freedom (DoF) IMU with integrated gyros and accelerometers Technology Details Photonic Integrated Chip Technology EMCORE’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s even more reliable and delivers superior repeatability unit-to-unit. With three of these integrated photonic gyros at its core, the P-1750 IMU enables the GEO-FOG to provide the safe, accurate performance autonomous platforms demand. Learn More DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. GEO•FOG Manager The GEO•FOG Manager is ideal when integrating EMCORE’s GEO•FOG 3D and GEO•FOG 3D Dual INS. Learn More Developer’s Kit for Rapid Integration The KVH FOG/IMU Developer’s Kit includes easy-to-use software to accelerate your IMU and FOG integration, development, and interface efforts.

Design and fabric considering activity and comfort WR Coated water-repellent finish Excellent breathability achieved with spandex mesh lining in armpits and pockets Adjustable hood size with string and stopper Use of reliable materials including YKK zippers, etc. Composition Material : Nylon, Cotton, Polyurethane Size 95 ~ 115 Colors BK (Black) CYT (Coyote Brown)

We can manufacture products that comply with MIL-PRF and MIL-STD standards, and offer radiation-hardened designs, hermetic packaging, and Class S and Class K screening services. Space Satellite Communication Providing optimized performance in space radiation environments with radiation-hardened semiconductors and hermetic packaging solutions. Deep Space & Earth Observation Ensuring long-term mission reliability with high-reliability power management ICs, RF components, and Class K screening products. Launch Vehicle Electronics Providing rugged packaging and hermetic components that withstand extreme temperatures and shocks. Defense Missile & Precision Guided Munitions Ensuring lightweight and shock-resistant performance with miniaturized, high-reliability semiconductors and customized packaging. Electronic Warfare & Radar Providing high-performance components, including high-frequency RF components, power amplifiers, and high-speed digital ICs. Avionics & Secure Communications Providing EMI/EMC-compliant circuit protection devices and highly reliable power management solutions.

Glenair Signature Interconnect Innovations for Land, Sea, Air, and Space Applications