The extended range of products offered through AMA is also reflected in the range of services provided. Each company has its own processing capabilities which vary from business to business. In essence, the collective capability of AMA embodies the latest technology to meet the needs of any specific metal processing requirement, including but not limited to: Cutting shape cutting milling surfacing sawing drilling guillotining waterjet cutting USI testing heat-treating or re-tempering forgings machining to near net shape

Tescan AMBER integrates BrightBeam™ field-free SEM optics with the Orage™ Ga⁺ FIB and fully automated lamella workflows. Designed for versatility, it supports inverted and planar sample prep, nanoprototyping, and gentle final polishing across a wide range of material types.

Mini size - Shell size 11
Compatbile With: TE Pro Beam mini, QPC Qmicro, Stratos HMC, Fibreco Mini2

The HXB11 Connectors, featuring expanded beam technology, hermaphroditic connection, rugged construction for field deployment have been designed for harsh environment applications such as military tactical communications, avionics, offshore systems, outside broadcast, mining and plant.

The expanded beam technology uses expanded and collimated beams to couple optical fibers without any contact. It could allow for optics to be used in areas that have been quite restrictive due to presence of damage or contamination at the fiber end. Hermaphroditic connector design enables fast deployment by daisy-chaining multiple cable segments.

FEATURES
· Advanced expanded beam technology
· Rugged field deployable fiber optic connector
· Hermaphroditic interconnection
· 2 to 4 Optical Channels for Singlemode or Multimode
· Custom configurations available
· Environmental sealing (IPX8)
· Very high resistance to vibration, shock, environmental effects, dust, and debris

Interconnect Wire Harness and Cable Assemblies are the connectivity backbone of electronic systems. Fabricated in a factory setting, build-to-print wire harness assemblies enable the OEM manufacturer to reduce the time and expense of in situ interconnection of electronic devices used in complex air, sea, land and space applications.

The Ultra-Light Hydrogen Module Pack provides a high-efficiency, lightweight hydrogen energy solution optimized for aerial applications. It integrates fuel storage, power management, and safety systems in a compact form, enabling long-endurance flight while maintaining exceptional energy-to-weight performance.

In this video, you will learn about the capabilities and performance benefits of our 5G mmWave semiconductor test system, the GENASYS Semi TS-900e-5G. GENASY...

Fast and Intuitive Quality Inspection With precise AR overlay technology, deviations between 3D design data and real-world objects can be identified instantly. This enables fast and accurate quality inspections on the spot. Optimized and Lightweight 3D File Processing Supports the four most popular 3D file formats: FBX, GLTF, OBJ, and STL. Lightweight processing ensures faster matching and smoother inspection workflows. From Inspection to Report — All in One Inspection results can be recorded and documented with image captures, drawings, and notes. Final reports can be exported in PDF, XLS, or CSV formats, making them easy to share and manage.

High design freedom of aluminum die casting and excellent mechanical properties of carbon fiber can be combined to replace high-tensile steel.