V-BAT은 전투 검증을 마친 플랫폼으로, 유사한 성능의 Group 4 및 5급 대형 무인기 대비 비용과 물류 부담을 획기적으로 절감하면서, 전략 및 전술 수준의 ISR(정보 수집·감시·정찰)과 표적 획득 기능을 제공하는 기동성 중심의 운용 플랫폼입니다. 전자전 환경을 고려해 설계, 시험, 실전 배치된 V-BAT은, GNSS 차단 및 통신 간섭 상황에서도 임무 수행 효과성을 실전에서 입증한 바 있습니다. V-BAT은 미 해안경비대(Maritime UAS Services Program)의 공식 채택 플랫폼으로 선정되었으며, 미 해군의 거의 모든 함정과 해병대 전진기동부대(MEU) 전 편대에 실전 배치되었습니다. 독자적인 설계 및 제어 기술을 통해, 강풍, 혼잡한 비행 갑판, 이동 중인 함정 등에서도 4.6m x 4.6m 수준의 협소한 공간 내 이착륙이 가능합니다.

The SC-SBCRTM-V2 is a Rear Transition Module (RTM) designed to extend the I/O functionality of the SBC6511 single-board computer. Mounted on the rear side of the main VPX backplane, this module provides additional I/O expansion through Micro-D and D-sub connectors for synchronization signals, two Ethernet ports, two Mini-DisplayPort video outputs, two USB interfaces, and MMCX connectors. It enhances system flexibility and connectivity for embedded and radar signal-processing applications.

KNF offers high qualified Aluminium products used in a wide range of markets around the world. *No.1 Stockholding & Qualified Aluminium Supplier *A1XXX/A2XXX/A3XXX/A5XXX/A6XXX/A7XXX Series and more *Business Areas: Aerospace & Defense / Semiconductor & Display / Marine & Silo / Automotive & EV Battery / Others

Chelton’s tuneable and conformal antennas provide a unique capability by combining advanced adaptability with seamless platform integration. Designed to optimise signal coverage across diverse environments, they enable reliable, high-performance connectivity for mission-critical operations. Their low-profile, aerodynamic design reduces drag and weight, while the tuneable technology ensures maximum flexibility across frequencies and operational needs. This combination of innovation and engineering expertise allows Chelton to deliver tailored solutions that outperform conventional antenna designs, supporting customers in achieving dependable communication even in the most challenging and dynamic conditions.

Teledyne FLIR's Tau 2 series offers 40 variants of the most reliable and rugged longwave infrared (LWIR) thermal camera module. Equipped with a simple optica...

Built with a rugged design and clear display, the TACNAV UMD offers: Highlights Active dot-matrix design, delivering unparalleled flexibility User-friendly interface with easy-to-read icons, messages, and pop-up menus Features Generation III NVG (night vision goggle)-compatible Four “soft keys” for easy operation Interchangeable with both Commander’s and Driver’s Displays, reducing logistics and cost Military standard approved for outstanding performance and reliability Ideal for integration into digital Battle Management Systems Compatible with all existing and future EMCORE TACNAV systems Applications Military vehicle requiring a user-friendly interface for its tactical navigation system The TACNAV UMD is controlled by the Arms Export Control Act (Title 22, USC Sec 2751 et seq.) and the International Traffic in Arms Regulations, ITAR 22 CFR 120-130, and may not be exported from the United States or disclosed to a foreign person in the United States except as authorized by those regulations.

Plane Windows are used as substrates for a variety of applications, such as laser window, output couplers, beamsplitters, beam combiners, mirrors, dichroic filters and plate polarizers. Considerations in selecting window substrates include transmission range, absorption coefficient, incident laser power density and environmental factors such as pressure, temperature, moisture, abrasion and corrosion. Plane Windows listed under UV / VIS / NIR substrates are specified for applications involving coating wavelengths 193nm ≤ λ〈2.0 μm. Units for these substrates are given in mm. Plane Windows listed under IR substrates are specified for applications involving coating wavelengths λ≥ 2.0 μm. Units for these substrates are given in inches. Refer to the THIN FILM COATINGS section for information on coatings that can be applied to these substrates.

Rugged 2mm backplane connector system is a compliant PICMG Compact PCI standard solution that provides engineers with an advanced interconnect system to address the requirements of mission-critical applications within commercial aerospace, space and defense market segments.