POSTECH's optical fiber pin/socket terminals are designed to connect to each other through physical contact. POSTECH's unique alignment technology maximizes optical performance and provides reliability.

The X-BEAM TECH HXB Connectors, featuring expanded beam technology, hermaphroditic connection, rugged construction for field deployment have been designed for harsh environment applications such as military tactical communications, avionics, offshore systems, outside broadcast, mining and plant.

The expanded beam technology uses expanded and collimated beams to couple optical fibers without any contact. It could allow for optics to be used in areas that have been quite restrictive due to presence of damage or contamination at the fiber end. Hermaphroditic connector design enables fast deployment by daisy-chaining multiple cable segments. HXB series connectors also enable transfer of electrical signal or power using hybrid insert configuration.

The member companies of GIFAS employ 195,000 people in their aerospace activities in France. These figures do not include temporary workers or the total number of suppliers and subcontractors; this field is estimated to be responsible for 350,000 jobs in France. Our sector is constantly in demand.

Mission-Driven Interconnect Designs For Ground, Sea, Air, and Space Applications

Dual Narrow Linewidth Amplifier - 3kW per channel

No Coding Required: Create XR content effortlessly with a drag-and-drop interface. Industry-Specific Solutions: Suitable for manufacturing, logistics, energy, and various industries. Multi-Device Compatibility: Works on PCs, tablets, smartphones, and smart glasses (VisionX). Real-Time Collaboration: Multiple users can edit and share content simultaneously.

Kencoa has a presence in the space industry through specialized material supply, high-precision component manufacturing, and strategic investment in New Space technologies.

Designed to deliver the highest level of performance, the non-ITAR TAC-450-360 IMU includes our exclusive photonic integrated chip (PIC) technology. The high-performance TAC-450-360 IMU is designed for applications in which high bandwidth, low latency, and low drift are critical. The TAC-450-360 IMU is integrated with inertial-grade accelerometers and three axes of magnetometers to provide the high accuracy levels that leading autonomous and manned platforms demand. Highlights Designed for ease of integration with flexible interface settings and programmable message outputs Excellent performance in critical applications and the specs that matter most Improved SWaP plus robust performance and survivability Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.