The focus on buy-to-fly ratios highlights the contributing role that near net shape processing can offer. This has undoubtedly been a driver in increasing this service offering from AMA. As a major contributor in the aircraft manufacturing supply chain, this is a key area of development for AMA and its companies. Customers are increasingly looking to optimise their production processes. This is primarily driven by the need to maximise their own spindle time for core business activities, with AMA therefore undertaking some of the machining processes. It can take many forms, from simple cutting to more intricate processing in which near net shape pieces are supplied. Even in AMA businesses whose business is predominantly transactional (so called ‘spot business’) rather than contractual, the processing element is increasing. Pre-machined kits of parts to individual specifications are becoming more commonplace. In addition to freeing up time for customers and OEMs to focus on more profitable final processing, near net shape processes can improve product quality, reduce variability and enhance component design functionality. As the industry continues to search for ways to lower buy-to-fly ratios and reduce the amount of waste, near net shape processing will have a greater role to play.

The new TAC-450-320/340/360 inertial measurement unit (IMU) is a dependable, tactical-grade, non-ITAR inertial system that’s also affordable. It features EMCORE’s exclusive photonic integrated chip (PIC) technology for robust performance and survivability and offers inertial-grade MEMS accelerometers for outstanding FOG-based inertial performance as affordable as MEMS alternatives. The TAC-450-320/340/360 IMU is ideal for autonomous and unmanned commercial and defense applications, mobile mapping and surveying systems, targeting and pointing systems, and guidance and positioning. Highlights Compact and lightweight with high-performance Offered with 16g inertial-grade MEMS accelerometer Robust performance with high bandwidth Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-320/340/360 IMU provides the safe, accurate performance autonomous platforms demand. State-of-the-art Electronics EMCORE’s Dual Core DSP electronics with ARM processor require less power for extended product life and offer higher speed with integrated multi-channel processing. Low-loss optical circuits use less light for greater efficiency. Feature Options Developer’s Kit for Rapid Integration The FOG/IMU Developer’s Kit includes easy-to-use software that accelerates your IMU and FOG integration, development, and interface efforts.

From precise control of various optical components(laser/detector/amplifier) & laser beam alignment(QD/FSM), a data rate of 10G can be achieved over distances of several thousand kilometers.

FINISHED THE DEVELOPING / INTEGRATED THE 2CH. FORJ Specification MODEL: SREM-1466-012 APPLICATION: SONAR WINCH SIZE: Φ140(O.D) / 664(H) NO. OF RINGS: 128RINGS TYPE: END ROTATING: CW/CCW

Many U.S. companies of all sizes grow their businesses by exporting products and services to buyers around the world. If you want to start or expand your int...

Additive manufacturing: - enables custom electronics cooling solutions, providing precise heat management, compact designs, and improved reliability for high-density electronic components. - battery coolers offer optimized thermal management, extending battery life, enhancing energy efficiency, and ensuring compact integration in electric vehicle systems. - allows for tailored cooling solutions for electric motors, improving heat dissipation, enhancing performance, and reducing system weight for efficient operation.

Hybrid wet tantalum capacitors with unique chemistry and construction making it the most power dense capacitor in the industry. DC Storage Power for: • T/R Modules • Electronic Warfare • Directed Energy • High Power Amplifier • Power Interruption (MIL-STD 704/D0-160) Advanced Capacitors for Demanding Applications • High Power 10V to 125V • Low ESR • >100 Amp Discharge • Hermetic • Unlimited Cycle Life • Unlimited Shelf Life • Low Weight/Volume • High Shock and Vibe • >5 Million Hour MTBF • 55°C to 125° C Operation

Wing shells, side shells and fuselage sections are usually made of carbon fibre composites and glued together during the production process. With many components, a groove or an open edge remains after the bonding process, which must be filled or sealed. A modified two-component epoxy resin is often mixed and then applied manually. This often entails long production times and complex quality controls. Equally high material costs due to the processing of materials from cartridges. ViscoTec defies short pot life and materials that are difficult to handle: Thanks to a coherent overall system from material removal to material application, this process can be automated. The two components are taken separately from cartridges, hobbocks or drums and fed via hose lines to a two-component dosing system. Only at the very end of the process they are mixed in a static mixing tube and applied to the substrate (e.g. via a nozzle). The process is controlled and monitored by pressure sensors.