EMCORE’s SDI170 IMU is designed as a performance-compatible inertial system that is form, fit, and functional with a legacy RLG-based IMU product, but with superior overall performance, versatility, and a significantly higher MTBF (Mean Time Before Failure) rating over ruggedized environments. The tactical performance of the SDI170 IMU is based on EMCORE’s mature, proven, dependable and accurate quartz MEMS inertial sensor technology in our SDI500 tactical-grade IMU. EMCORE’s quartz technology enables repeatable high-volume production of precisely machined sensor structures combined with the inherent large signal output and thermal stability of quartz materials. The SDI170 IMU is designed for demanding, mission-critical, rugged environments and ideal for continuous use applications with no wear-out components, highly linear accelerometer performance and longer life compared to competing alternatives. It is constructed with EMCORE’s latest generation quartz gyros, quartz accelerometers, and high-speed signal processing to achieve outstanding precision performance. The solid-state quartz sensors and hermetically sealed IMU construction provide reliable MTBF and a 20-year operating and storage life. Continuous Built-in Test (BIT), configurable communications protocols, electromagnetic interference (EMI) protection and flexible input power compatibility make the SDI170 IMU easy to use in a wide range of higher-order integrated commercial and defense system applications.

Rugged 2mm backplane connector system is a compliant PICMG Compact PCI standard solution that provides engineers with an advanced interconnect system to address the requirements of mission-critical applications within commercial aerospace, space and defense market segments.

We has built a global partnership with accumulated technology to produce/supply major structures to Boeing and Airbus. By manufacturing large-scale composites that make the fuselarge of an aircraft, automated production technology applying robot concepts, non-destructive inspection technology and flow production line, etc. we are competing with advanced aircraft manufacturers with the best technology, quality and productivity by developing advanced technologies and equipment.

A REDCOM SVG system consists of one or more REDCOM Sigma® SVG-1200 units and a series of standard production General Dynamics Sectéra vIPer phones. Each REDCOM SVG-1200 can interface with up to 12 vIPer phones, which act as voice encryptors for TDM or VoIP voice networks. The encryptors allow any line, trunk, or conference port to conduct secure voice communications with any SCIP-capable device. If more than 12 secure talk paths are required, multiple SVG-1200 units may be networked together.

An optimized Plasma FIB-SEM platform with proprietary gas chemistries for high-quality delayering of the most current semiconductor devices

The NSP-5 is an all-weather, multimode, Ku-band radar designed to fly on Group 3-4 Unmanned Airborne Systems (UAS). Its low-Size, Weight, and Power (SWaP) design means ample room for other onboard sensors, such as Electro-Optical and Infrared (EO/IR) cameras. This means users can understand the bigger picture. The NSP-5 is capable of performing spot and stripmap Synthetic Aperture Radar (SAR) and Magnitude Change Detection (MCD), as well as Moving Target Indication (MTI) collections in a variety of maritime and land environments in all weather conditions. This includes smoke, fog and other obscurations where the operators do not have a clear view of the terrain below them. The NSP-5 has a proven track record of reliability and has a recommended maintenance interval of 2,000 hours. Additionally, the modular design makes the NSP-5 easy to integrate onto most platforms.

Powerful AI Capabilities On-prem LLM and RAG-based AI for fast and accurate information access Voice command support for hands-free control Optimized AR Technology VIRNECT View for AR visualization of work manuals VIRNECT Make for easy content creation and distribution

Our electronics business sector has been producing copper cladded laminates of printed circuit boards for over 20 years. To meet high heat dissipation for the newest electronic technology, we have developed metal based laminates and carbon laminates.