Real-Time Visual is leading technology in the field of defense simulation and digital twin and is expanding its accumulated technology and experience to services such as digital twin cloud services and metaverse in the private/industrial sectors.

Giraffe 1X is an ideal air surveillance component in the Ground Based Air Defence (GBAD) domain that provides ground based air defence commanders with engagement quality target data, drone detection and Counter-Artillery, Rocket and Mortar (C-RAM) sense and warn within a single solution. It is the ideal main sensor for a Very Short Range Radar (VSHORAD) system and can be used as a gap filler that complements larger GBAD systems, or as a Counter-UAS (C-UAS) solution.

Taktic buckle system for quick connect & release Antibacterial/FR treated padded spacer mesh system Poly mesh cummerbund for increased ventilation XFrame® Dynamic Load Carrige® compatible Compatible with our entire accessories line Flush admin chest pocket with internal elastic straps PALS webbing for MOLLE attachment Zipper for DS Assaulter's Zip-On Back Panels QASM buckle system Increased structural integrity and reduced rear deformation Internal plate pocket retention straps accommodate several different plate thickness Soft armor included Composition Material: 500D Cordura® + ARAMID/PV® Size : Small / Medium : 8.5" x 11.5” -9.3" x 12.3" Plate Pocket Front Panel Area of Coverage : Length 13.25” Width 11" Large / XLarge : 10" x 13"- 10.9" x 13.8” Plate Pocket Front Panel Area of Coverage : Length 15" Width 12" Colors: MC (MultiCam) BMC (Black MultiCam) BK (Black) RG (Ranger Green) CYT (Coyote Brown)

ORSKOREA’s high frequency grinding spindles, operating at speeds up to 120,000 rpm—the highest level in Korea—are engineered for ultra-precision and durability in critical defense and aerospace applications. In addition to belt-driven, built-in motor, hydrostatic, and hydrodynamic types widely used in semiconductor and precision equipment, our spindles are customized to deliver the exact speed and power output required by customers. With over 25 years of expertise in repairing and retrofitting leading Japanese, German, and Swiss brands such as TOYO, KOYO, OKUMA, GMN, and Fischer, and with multiple proprietary patents including joint developments with Schaeffler Korea, ORSKOREA ensures proven reliability. These spindles are ideal for machining high-value defense components such as armored vehicle gears, drone actuators, aircraft engine parts, multispectral sensor housings, and advanced optical or communication devices, supporting the competitiveness of both defense and civilian manufacturers.

- Compact size with built-in drive, position sensor, DC motor and gear box - Better durability & faster speed under similar rated load comparing to 12Lf series thanks to the bigger 17mm diameter DC motor - Position, current and speed control along with position & current feedback - Easy digital extended I/O control through 4 x Expansion I/O ports (No coding) - 27/37/50/87mm(*) stroke option (*): Each 3mm stroke can be added when adjusting the long stroke limit through Total Manager software. Rated load of 17N~70N depending on the lead angle for each stroke (Speed is inversely proportional to the rated load, so the higher the rated load, the slower the speed.) - RS-485 MODBUS-RTU protocol applied (IR open protocol is not provided) - Action feature which enables user’s motion save & run

Designed to deliver the highest level of performance, the non-ITAR TAC-450-360 IMU includes our exclusive photonic integrated chip (PIC) technology. The high-performance TAC-450-360 IMU is designed for applications in which high bandwidth, low latency, and low drift are critical. The TAC-450-360 IMU is integrated with inertial-grade accelerometers and three axes of magnetometers to provide the high accuracy levels that leading autonomous and manned platforms demand. Highlights Designed for ease of integration with flexible interface settings and programmable message outputs Excellent performance in critical applications and the specs that matter most Improved SWaP plus robust performance and survivability Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.

Antimicrobial/FR treated padded spacer mesh system Low Profile Shoulder Harness Ultra-light multipurpose loading platform Applied 3 x 8 PALS system for the both cummerbund and 3 x 6 for the back panel 4 magazine pockets inside the cummerbund 2 pockets for 6"x6" hard plate inside the cummerbund Composition Material : 500D Cordura® + ARAMID / PV® Colors: MC (MultiCam) BMC (Black MultiCam) BK (Black) RG (Ranger Green) CYT (Coyote Brown)

Low Size, Weight and Power (SWaP) at only 297g. Up to 100 TOPS GPU by NVIDIA® Jetson Orin™ NX Supports multiple camera and sensor interfaces 2x GbE and 2x USB3 for RGB/ Infrared/ hyperspectral cameras and lidar/ radar 2x GMSL2 for HDR/ 3D cameras Built-in UART and CAN to interact with flight controller 1x M.2 2230 for storage and 4G/5G communication ready Supports 4S-14S drone battery pack Compatible GMSL2 cameras with pre-built drivers