The SC-SSGMRTM, a Seedcore Co., Ltd representative product, is a backplane transmission module that performs the I/O function of the SSGM(Synchronous Signal Generation Module). When the SSGM(Synchronous Signal Generation Module) board is plugged into the motherboard(Backplane) in front of the Chassis, you can extend the I/O function of the board by plugging the SC-SSGMRTM board into the back of the Backplane. Three 37-pin Micro D-sub ports are used to send synchronization signals generated by SC-SSGM to the outside or to receive external synchronization signals, Three separate MMCX output ports are prepared to support test equipment such as oscilloscopes, and you can convert them to various signals and output them.

The NSP-5 is an all-weather, multimode, Ku-band radar designed to fly on Group 3-4 Unmanned Airborne Systems (UAS). Its low-Size, Weight, and Power (SWaP) design means ample room for other onboard sensors, such as Electro-Optical and Infrared (EO/IR) cameras. This means users can understand the bigger picture. The NSP-5 is capable of performing spot and stripmap Synthetic Aperture Radar (SAR) and Magnitude Change Detection (MCD), as well as Moving Target Indication (MTI) collections in a variety of maritime and land environments in all weather conditions. This includes smoke, fog and other obscurations where the operators do not have a clear view of the terrain below them. The NSP-5 has a proven track record of reliability and has a recommended maintenance interval of 2,000 hours. Additionally, the modular design makes the NSP-5 easy to integrate onto most platforms.

Supports non-destructive inspection of aircraft composite skin structures and is composed of a piezoelectric layer sensor, data acquisition equipment, and damage analysis software. Utilizes piezoelectric sensors to generate Lamb-wave and acquire signals, collecting data to accurately detect and assess composite damage. Visualizes inspection results on display such as damage location, size and index. - POD Accuracy: 1 inch 90% or more - POD Precision : Position error within 30 mm - 64 channels / 230 path reference detection time within 10 minutes - Sensor : Resonance resistance less than 400kΩ - Sensor : MIL-STD-810G - Sensor : RTCA DO-160 Section 23.0 - DAQ : x128 Piezoelectric sensor interface

1. Comprehensive Manufacturing • Prototyping to serial manufacturing • Structure Assembly and Wire Harness • System Integration - Motors, Flight Control System, Inverter, etc. 2. Multi-Mission Drones • Precise Attack Drone • Heavy Lift Drones ( Cargo/transport) • Firefighting/ Rescue Drone Highlights Experienced in prototyping and manufacturing drones for diverse customer requirements.

Designed and suitable for a wide range of missions. It is light and ruggedized and its multi-purpose capability provides freedom of action for the commander in all environments.

FOBEX 38999 MIL-DTL-38999 An optical connector which is applied to beam expanding optical signal transmission technology into a connector designed according to military standards. It can be used in a variety of adverse conditions such as extreme temperature, vibration, shock, humidity, and dust. It has little impact from outdoor contamination and is easy to maintain, making it easy to use tactically. FOBEX 83526 Ensures stable and reliable data transmission in extreme environments. Designed with a hermaphrodite type for easy connection and disconnection over 3,000 times, the extended beam technology minimizes loss caused by dust or contaminants from outdoors. FOBEX-P Fiber optic ferrules with expandable beam technology, designed to replace 1.6mm military fiber optic ferrules for tactical applications

It is a product produced in Korea and has high performance when used in EO/IR Gimbal for small drones. It can view both VIS and IR images simultaneously and is coupled to a small drone with a small weight to perform operations. Products with manufactured and domestic IR sensors in Korea. we deliver superior technologies that shape the future of defense. Whether supporting ISR missions or enhancing precision in loitering munition operations, MS60 products are designed to ensure operational excellence in the most challenging environments.

TESCAN SOLARIS X 2 extends FIB physical failure analysis capabilities to large-area applications, making deep cross-sectioning of advanced packaging devices, displays, MEMS, and optoelectronic devices more efficient. Featuring the new generation Mistral™ Xe Plasma FIB column, SOLARIS X 2 offers increased maximum ion beam current and a sharper ion beam profile across the full range, with significantly reduced beam tails. This allows operators to use higher milling and polishing currents, achieving superior surface quality comparable to conventional Plasma FIB, but with greater speed and precision.