1. Operation / Full Management L2·L3 Switches - 1G 8 PORT, 12 PORT, 24 PORT - 10G (option) - WEB, CLI, Telnet, SNMP V2/V3 management 2. SWaP / Safety / Network 3. Design and supply customized interfaces according to the specific requirements of each system.

An optical fusion splicer is a device that connects two optical fibers by fusing the ends at high temperatures. This process minimizes optical fiber loss, maintains signal transmission quality, and provides a durable connection. It is an essential tool in optical communication networks, and is particularly utilized in FTTx, data centers, and long-distance optical cable installations. Features - Low loss and high reliability. - Fast and accurate connection. - Small and lightweight equipment. - Compatible with various fibers. - User-friendly interface. - Reduced maintenance costs. Application Area - Data Center - Optical Communication Network Construction

PTO SHAFT, Proven Performance, Realized in Reality CTLA's Power Transmission Shaft (PTO-shaft) is a key component of the aircraft secondary powertrain, transmitting the high-speed rotational power generated by the aircraft engine drive unit (EMAD) to the gearbox (AMAD). By applying high-strength, lightweight titanium material for the first time in the world, we have achieved both weight reduction and durability, while implementing outstanding stability and reliability through our proprietary electron beam welding technology optimized for high-speed rotation and high-speed precision balancing technology. In particular, this product, which is currently being mass-produced and delivered to the KF-21 fighter jet, has demonstrated excellent power transmission performance while minimizing vibration even in extreme environments. CTLA is leading technological innovation in the field of high-speed rotational machinery, spearheading the self-reliance of domestic aircraft components and advancing into the global market.

The SC-SBCRTM, a Seedcore Co., Ltd representative product, is a backplane transmission module that performs the I/O function of the SBC627. When the SBC627 board is plugged into the motherboard(Backplane) in front of the Chassis, you can extend the I/O function of the board by plugging the SC-SBCRTM board into the back of the Backplane.

Spring probes are designed to optimize performance in high reliability, multicycle applications. Smiths Interconnect’s spring probes are compliant which makes them ideal for blind mate applications as they self correct for x, y, z, rotational and angular misalignment of the target. Offered in compressed heights less than 2 mm and utilized on pitches as tight as 0.4 mm, they are well suited for high density, board-to-board, battery contact and high frequency applications. Mixed signals and functionality can be designed into a single connector.

Engineering Design Assistance Material Research & Development Manufacturing

Raytheon Intelligence & Space's ISTAR is a multi-intelligence aircraft that uses artificial intelligence, integrated onboard sensors and advanced processing to provide critical information to military and civilian air and ground crews. Our integrated suite of ISR solutions provide state-of-the-art capabilities for national defense missions.

Designed to deliver the highest level of performance, the non-ITAR TAC-450-360 IMU includes our exclusive photonic integrated chip (PIC) technology. The high-performance TAC-450-360 IMU is designed for applications in which high bandwidth, low latency, and low drift are critical. The TAC-450-360 IMU is integrated with inertial-grade accelerometers and three axes of magnetometers to provide the high accuracy levels that leading autonomous and manned platforms demand. Highlights Designed for ease of integration with flexible interface settings and programmable message outputs Excellent performance in critical applications and the specs that matter most Improved SWaP plus robust performance and survivability Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.