This cable assembly is applied to various precision and high-function facilities and equipment such as armored vehicles, warships/ship, medical equipment, and communication equipment to perform power connection and electronic signal connection functions. Military cable assemblies are vital for the defense and aerospace industries. Cable assemblies must be built with high-performing materials and components that withstand harsh conditions, such as vibrations, high temperatures, and chemical exposure.

ORSKOREA’s centerless grinding machines ensure stable accuracy and durability without the need for chucks or centers. By allowing workpieces to rotate freely between the grinding and regulating wheels, they deliver high-efficiency and uniform machining for shafts, pins, housings, and other cylindrical components used in aerospace, defense, and advanced automotive systems. Key Advantages • High productivity through fast, efficient multi-part processing • ±2μm precision and long-term repeatability • Versatility to handle components from small to large sizes • Hydrostatic slides and spindles minimizing heat and vibration • Proven stability for high-value part manufacturing such as engine components, battery cases, and optical housings By combining productivity, accuracy, and reliability, ORSKOREA’s centerless grinders significantly enhance competitiveness in both defense and civilian applications.

Contribute the Enhancement of Armed Forces with Continuous Technology Development Designed for replacing the Republic of Korea Army(RoKA)’s aged attack helicopter (500MD, AH-1S), the LAH(Light Armed Helicopter) Project is the one that aims to develop a cutting-edge armed helicopter suitable for the modern battlefield. Through the synergy of maximizing commonality in subsystems and parts with LCH(Light Civil Helicopter), KAI will reduce the development, production, and sustainment cost ultimately to be a bridgehead for a global helicopter market. The first flight of LAH was successfully conducted in 2019. KAI aims to complete the development of LAH in 2023.

Intel® 14th/13th/12th-Gen Core™ 24C/ 32T 35W/ 65W CPU Affordable IP66-rated design for waterproof and dustproof Up to 96GB DDR5 4800 SODIMM -25°C to 70°C wide-temperature fanless operation 3x 2.5Gb and 1x Gb Ethernet ports via M12 X-coded connectors, with 802.3at PoE+ option 1x waterproof USB3.2 Type-C port supporting alternative mode for DisplayPort and USB3.2 dual output 8V to 48V DC input with built-in ignition power control

Continental connectors are manufactured with highest quality materials. Our contacts are machined to close tolerances as opposed to stamped and formed styles. All molding compounds are glass reinforced, flame retardant and able to withstand severe environmental and mechanical requirements. Military connector families conform to the highest Defense Supply center (DSCC) standards, which require qualification testing and continued periodic requalification under the surveillance of government representatives to maintain our Company Qualified Product Listing (QPL)

Maintenance Increase security and productivity to reduce costs and minimize downtime. Willing to provide our customers with high-performance technical assistance, we offer scheduled and unplanned maintenance interventions, as well as periodic verification of measurement channels using our calibration equipments. Our systems allow us to perform these operations internally or at our customers site.

Weibel’s Doppler 3D tracking radars are designed for precise measurements of free-flying objects such as projectiles, artillery rounds, and rockets. The systems are highly effective for detailed debris tracking, range safety tests, missile tests, and space launches. Weibel’s tracking radars are phased array X-band CW, MFCW and FMCW radar systems consisting of state of the art phased array Doppler radar antennas, high performance pedestals, real-time multi-object tracking processors and state of the art waveform generators, all controlled from the operator console.

TESCAN SOLARIS X 2 extends FIB physical failure analysis capabilities to large-area applications, making deep cross-sectioning of advanced packaging devices, displays, MEMS, and optoelectronic devices more efficient. Featuring the new generation Mistral™ Xe Plasma FIB column, SOLARIS X 2 offers increased maximum ion beam current and a sharper ion beam profile across the full range, with significantly reduced beam tails. This allows operators to use higher milling and polishing currents, achieving superior surface quality comparable to conventional Plasma FIB, but with greater speed and precision.