We carry a wide range of aerospace-grade materials in round bar and sheet, including: -Alloy 718 (AMS5596) -Alloy 625 (AMS5599) -Alloy X (AMS5536) There is no minimum order quantity ? we can cut from a single piece and ship within 1?2 days, complete with full material traceability. For non-stock grades, shapes, and standards, we can source materials from suppliers worldwide with a lead time of approximately 2 weeks, also with no minimum order quantity.

The SmartVDO Eye series AI cameras use the NVIDIA® Orin™ NX Super platform, offering a comprehensive, all-in-one AI monitoring solution. The NeuroEye-I series, designed for industrial inspection, features Sony high-resolution, high-sensitivity sensors and supports both rolling and global shutters for capturing detailed, high-quality images. The NeuroEye-S series, built for environmental safety, offers autofocus, auto-aperture, low-light night vision, and IP66 protection, ensuring reliable operation in harsh conditions. Combined with YUAN’s powerful AI development kit, QDEEP, AI models can be rapidly deployed and customized to enhance operational efficiency.

InterGravity Technologies has developed a Type-III Composite Overwrapped Pressure Vessel (COPV) optimized for high-performance small spacecraft propulsion systems. The tank is designed with an aluminum alloy liner for impermeability and a carbon fiber/epoxy composite overwrap for high strength-to-weight ratio. The system is tailored for green propellant storage (C₂H₆, N₂O), offering an exceptionally lightweight yet robust solution for orbital transfer vehicles and CubeSat-class platforms. Technical Specifications - Type : Type-III COPV (Al liner + CFRP wrap) - Volume : 5.3 liters - MEOP : 75 bar - Proof : 230 bar - Burst : 250 bar - Dry Mass : < 1.0 kg

AMD builds on its 30+ years of continuous focus and heritage in Aerospace and Defense, extending the XQ defense-grade portfolio with AMD Versal XQ Series SoCs. Versal adaptive SoCs combine adaptable processing of the programmable logic and acceleration engines with leading-edge memory and interfacing technologies to deliver customized, powerful heterogeneous acceleration for any application.

NVIDIA IGX is a cutting-edge AI platform delivering high-performance, secure, and reliable computing. Built on autonomous-driving expertise, it supports industrial automation and medical devices, with PCIe expansion for extra vision inputs and full-stack enterprise-grade software and long-term support.

Side shells, wing shells and fuselage structures are made of CFK, GFK, aluminium or organic sheets and get connected during production. Sealants are used to seal the connection surfaces. These are usually two-component polysulphides, which have to be applied in different geometries. Typical applications are: Fillet sealings, oversealings, interface sealings and seal caps. Due to their properties, polysulfides require very low pressure and shear handling. The compressibility of the fillers contained in the medium requires a high level of expertise and a coherent overall system from material removal to application. With manual application, long production times and high material ejection have a negative influence on the complete process. Complex quality standards are required due to the risk of human error. With the in-house developments of the vipro-DUOMIX from ViscoTec, this process can be depicted fully automatically. The individual nozzle design is also adapted to each application. The result is a controlled dosage in compliance with the specifications and at the same time the highest repeat accuracy.

The KX1-3046 is an X-band high-power MMIC amplifier fabricated on the GaN-on-SiC process. It operates from 8.0 – 10.5 GHz and typically provides 30W saturated output power with power-added efficiency of 46%. The KX1-3046 can support military and commercial radar systems. It is matched to 50Ω with integrated DC blocking capacitors on both RF input and output ports. The KX1-3046 is 100% DC and RF tested on-wafer. It is available in chip form. **Key Features** - Frequency Range: 8.0-10.5GHz - Small Signal Gain: 28dB - High Pout: 30W - High PAE: 46% - DC bias: Vd=28V @Idq=0.6A - Pulsed Vg: PW=100µs, DC=10% - Chip size: 2.95x3.1x0.1mm  

TESCAN SOLARIS is a fully automated sample prep platform optimized for advanced devices with sub-10 nm features. It integrates the Triglav™ SEM, AutoTEM Pro™ software, and OptiLift™ nanomanipulator to enable hands-free, repeatable lamella prep in planar, inverted, or top-down geometries.