This solution follows a three-step process of input, processing, and output, utilizing imagery, DEM, AT, and spatial data to refine 3D models. The editing-based texturing function allows users to correct shape errors, occlusions, and distortions, while the automated texturing ensures consistency and accuracy through advanced geometric matching. Final outputs are stored in standard formats for broad practical applications.

specialized heat shrink tubing for the defense industry, with international standards such as QPL SAE AS23053, DEF STAN 59-97, VG 95343, and BS G198.

The ACTUS® PARA-3M is a mission-critical magnifier designed for rapid and precise targeting of close- to mid-range threats in high-intensity operational environments. With a 3x magnification, it enhances accuracy and adaptability, ensuring superior performance in dynamic combat situations and supporting both near and long-range precision shooting for mission success.

The PolarFire FPGA and PolarFire SoC families already deliver the industry’s best thermal and power efficiency in the mid-range segment. Optimized for deploying systems with high-compute performance in small form factors, the families have reduced the size and weight of power-constrained systems in applications including industrial imaging, robotics, AI-enabled medical systems and smart defense and aerospace systems.

Designed to support U.S. DoD modernization strategies, REDCOM Sigma is a complete software-based Command & Control solution with voice, video, chat, and conferencing. REDCOM Sigma® increases the warfighter’s operational flexibility while reducing size, weight, and power (SWaP) requirements at the tactical edge. REDCOM Sigma is based on open standards with a focus on interoperability, flexibility, and ease of use, and is listed on the DoDIN Approved Products List (APL). REDCOM Sigma was selected by the U.S. Army’s Program Executive Office Command, Control Communications-Tactical for network modernization at the tactical edge. Sigma is being deployed to multiple programs within the U.S. Army at the battalion level and below.

High-Density Space-grade NAND Flash memory : 1. Density : 128Gbit (2G x 8bit x 8chips) NAND Flash 2. Package Type : 54 Pin SOP (Small Outline Package) 3. Radiation : TID > 60 krad, SEL (TBD)

GIMPO has proactively driven the introduction of UAM to alleviate the traffic congestion and secure future growth engines, thereby preparing for the period of 700,000 GIMPO residents. Equipped with both air routes and infrastructure, GIMPO is optimal location to expand business and generate results in the uncharted UAM market with minimal risk. we will prepare for a UAM-centered future city through the development of the 'GIMPO ENVIRONMENTAL REGENERATION INNOVATION COMPLEX' and 'GIMPO HANGANG 2 COMPACT CITY'. Unlock new opportunities in GIMPO.

an air conditioner mounted inside the tank