Input : 24Vdc Output : 270Vdc N+1 System

High-power laser weapons targeting objects at 0.5 ~ 4.0km distances require optical components with sub-nm wavefront error precision. Our Company has successfully developed aspherical polishing and high-power laser coating technologies for Ø300 ~ 550mm optical components through defense project experiences. measurement technology 1) Laser Induced Damage Threshold(LIDT) - The evaluation to confirm the durability of optical components is called LIDT (Laser-Induced Damage Threshold), which is defined as "the maximum amount of laser radiation incident on an optical component when the expected probability of damage is zero" (ISO 21254). In other words, it represents the maximum intensity or power of laser that an optical component can withstand, making it a critical requirement in laser weapon systems. - Our company has established LIDT measurement technology and in-house facilities developed in accordance with ISO 21254 standards. When compared with LIDT test results from domestic and international companies during laser weapon system development, we have demonstrated measurement technology and accuracy that meets or exceeds industry standards. While overseas companies require more than one month for verification processes, our company can immediately provide reliable data through our LIDT system. 2) Cavity Ring Down Spectroscopy(CRDS) - When the reflectivity is 99.997%, this may not present significant issues in low-power laser applications. However, in high-power laser components, even the 0.05% of light that passes through the optical mirror can cause problems in vulnerable parts of the system, including rear optical instruments, bonded lenses, and control cables. Therefore, measurement and evaluation methods for high-reflectivity optical mirrors are extremely important. - Currently, the transmittance and reflectance of optical components are generally measured using spectrophotometers, but measuring reflectance levels of 99.5% or higher is not possible with this method. CRDS (Cavity Ring-Down Spectroscopy) technology is required to achieve measurement resolution beyond that of spectrophotometers, and our company has established this system to measure the reflectance of various optical components. This is a critically important technology for responding to high-power laser weapon system development requirements.

• Arinc connectors • Modular connectors • D-sub / Rectangular connectors • Terminal blocks • Quick junction modules

Based on the KN series MIL-DTL-55302 compliant connectors an ESA version of the KNB/KNC connectors has been created, which also offers signal contacts designed for demanding defense, commercial aerospace and space applications. They also are available in the 2 and 3 row series and offer flexibility not available with other interconnects.

The SBC6511 Rugged Single Board Computer(SBC) from Abaco Systems features the new high performance, highly integrated Intel® Xeon® E processor (‘Coffee Lake Refresh’). Powered by Intel® Xeon® W processors, offering robust computational power. • Supports up to 64 GB DDR4 SDRAM with ECC and up to 256 GB (or in some variants up to 480 GB) NVMe SSD storage • Offers high-throughput networking: Dual 40 GbE data-plane (KR4 “fat pipes”) • Features the Xilinx® Zynq® UltraScale+™ MPSoC FPGA (ZU7EG) for enhanced security

The TAC-450 FOG offers exceptional performance in bias stability, scale factor, and angle random walk, and is available in nine configurations to solve the most challenging design projects. The TAC-450 FOG is ideal for air, land, or maritime stabilization and pointing applications. Due to its versatility, and accurate, reliable output, it can also be utilized in navigation, guidance, and control systems. Highlights Designed for maximum ease of integration with housed or unhoused (for OEM configurations) options Available in nine configurations to solve the most challenging design projects Exceptional performance in bias stability, scale factor, and angle random walk 1-, 2-, or 3-axis configuration, each employing the world’s smallest precision FOG Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.

Phased Array Multi Function Antenna including Radome

Antimicrobial/FR treated padded spacer mesh system Low Profile Shoulder Harness Ultra-light multipurpose loading platform Applied 3 x 8 PALS system for the both cummerbund and 3 x 6 for the back panel 4 magazine pockets inside the cummerbund 2 pockets for 6"x6" hard plate inside the cummerbund Composition Material : 500D Cordura® + ARAMID / PV® Colors: MC (MultiCam) BMC (Black MultiCam) BK (Black) RG (Ranger Green) CYT (Coyote Brown)