Key Features Revolutionary speed enabled by advanced LFD technology High-resolution and highly accurate prints Compatible with a wide range of resins including functional and engineering materials Dimensions: 390 × 367 × 554 mm Build Volume: 200 × 125 × 210 mm Weight: 18.3 kg Specifications XY Resolution: 25μm Minimum Layer Thickness: 25μm Maximum Print Speed: 100 mm/hr

Expert sourcing and pricing Cost modeling: Cost per Flight Hour, FFP, EEQ Import/Export classification: ECCN, ITAR, Schedule B Logistics and supply chain analysis Technical review of parts lists and breakdowns Source development and sustainment

The VPX6-C6 which provides a full 6U OpenVPX(VITA65) is a Single Board Computer(SBC) that combines the power, versatility, cost-effectiveness of the 8th generation Intel mobile one-chip processor solution with the reliability. VPX6-C6 is based on the Intel i7-8665UE CPU that has quad cores running at 1.7GHz and providing a 32Gbytes of highbandwidth DDR4 SDRAM. Intel i7 processor includes an integrated Intel UHD 620 graphics engine, providing discrete GPU performance with OpenGL for graphics-intensive applications. For storage application VPX6-C6 provides the built-in 80GB SLC NVMe SSD solution via PCIe x4 lanes as well as the external SATA expansion through VPX site. The VPX6-C6 satisfies the demanding applications ranging from tactical aircraft to armoured vehicles to rugged industrial systems, with its rich complement of features and I/O including Intel Graphics, Integrated Platform Management Interface, Gigabit Ethernet, DIO, Serial channels, USB ports and more.

This system processes threat information across air, surface, and underwater domains, while providing video distribution, recording, and storage functions. It also interfaces with external equipment to enable efficient, fleet-wide operational control. - Compliant with MIL-SPEC standards (shock, vibration, temperature/humidity, EMI/EMC) - Equipped with a liquid-cooling system to protect internal components

1. Certification Status Certified by the Korea Fire Institute (KFI) Certified under the latest KFAC (Korea Fire-fighting Apparatus Certification) CE certification currently in progress 2. Product Description Composition: Backrest, Facepiece, Cylinder Accessories: Auxiliary Mask, Bone Conduction Communication Device (facepiece- or headset-mounted), HUD, etc. 3. Features and Benefits -> Wide Full Face Mask: 360° curvature reduces blind spots. Medical-grade silicone minimizes skin irritation during long-term use. Equipped with a 360° rotating supply valve. -> Type-4 Containers: Internal PET liner prevents contamination. 20% lighter than Type-3 containers. Built-in Excess Flow Valve (EFV) protects against emergency damage in case of container breakage. -> IT-Integrated Backplate: Features a thermal imaging pressure indicator with TIC camera, PASS life-saving alarm, ambient temperature and height display, container pressure and remaining time, visual/audible alarms, Bluetooth connectivity, and NFC-based crew monitoring (entry/exit logs). Includes weight-distributing design and rapid charging function. -> Flexible Pricing: Various models are available with different features and price points, allowing selection based on individual needs.

Hermetic connectors are essential to maintain system integrity in applications where the reliability and performance of electrical connections is critical, such as gas-tight barriers or high-pressures differentials.

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A cost-effective and reliable EO/IR solution designed for unmanned platforms, combining compact design with strong performance. The system integrates QVGA/VGA-class infrared sensors and 2–20 megapixel EO cameras, providing versatile options to meet different operational requirements. o Infrared (IR) Sensor: QVGA/VGA resolution, optimized for detection and recognition in short-to-mid range surveillance o Electro-Optical (EO) Module: 2MP–20MP visible light cameras with high-resolution imaging, adaptable to multiple mission profiles o Design Philosophy: Lightweight, compact, and robust for integration into unmanned aerial vehicles (UAVs), unmanned surface vehicles (USVs), and ground robotics o Key Value: Balances price competitiveness, system reliability, and modular scalability for mass deployment