OptAI’s on-device LLM solution optimizes and compresses models for mobile NPUs such as Qualcomm Snapdragon and Samsung Exynos, enabling a broad spectrum of AI services including automatic note generation, real-time translation, question answering, and personal assistant features. Free from cloud dependency, it delivers seamless performance with high efficiency and ultra-low latency. With OptAI, your device evolves into a truly intelligent and personalized AI companion.

Side shells, wing shells and fuselage structures are made of CFK, GFK, aluminium or organic sheets and get connected during production. Sealants are used to seal the connection surfaces. These are usually two-component polysulphides, which have to be applied in different geometries. Typical applications are: Fillet sealings, oversealings, interface sealings and seal caps. Due to their properties, polysulfides require very low pressure and shear handling. The compressibility of the fillers contained in the medium requires a high level of expertise and a coherent overall system from material removal to application. With manual application, long production times and high material ejection have a negative influence on the complete process. Complex quality standards are required due to the risk of human error. With the in-house developments of the vipro-DUOMIX from ViscoTec, this process can be depicted fully automatically. The individual nozzle design is also adapted to each application. The result is a controlled dosage in compliance with the specifications and at the same time the highest repeat accuracy.

The IMX-5™ includes Attitude Heading Reference System (AHRS) sensor fusion to estimate roll, pitch, and heading. Adding GNSS input to the IMX-5 enables onboard Inertial Navigation System (INS) sensor fusion for roll, pitch, heading, velocity, and position. Features Tactical Grade IMU Gyro: 1.5 °/hr Bias Instability, 0.16 °/√hr ARW Accel: 19 µg Bias Instability, 0.02 m/s/√hr VRW 0.04° Dynamic Roll/Pitch 0.13° Dynamic Heading Surface Mount Reflowable (PCB Module) Fast Integration with SDK and Example Software Data Logging (SDK and Application Software)

The Glenair next-generation STAR-PAN NG ecosystem incorporates a range of new capabilities in direct response to requests from JTACs, special operations forces, mission commanders, and other military specialists. Design innovations in STAR-PAN NG have resulted in higher current-carrying capabilities, greater versatility in power input support, and real-time plug-and-play USB device integration. The STAR-PAN NG hub and cable series offers a number of interface improvements and circuit board innovation.

It supports both daytime and nighttime monitoring, making it highly versatile in various missions. The drone is optimized for portability, allowing operators to carry and deploy it with ease. Its compact design ensures rapid response capabilities while maintaining reliable performance in the field.

Tescan AMBER integrates BrightBeam™ field-free SEM optics with the Orage™ Ga⁺ FIB and fully automated lamella workflows. Designed for versatility, it supports inverted and planar sample prep, nanoprototyping, and gentle final polishing across a wide range of material types.

High-Reliability Space-grade SRAM memory : 1. Density : 16Mbit (512k x 32bit) SRAM 2. Package Type : 100 Pin CQFP (Ceramic Quad Flat Package) 3. MIL-PRF-38535 Class V Qualified 4. Operating Temperature : -40℃ ~ +125℃ 5. Radiation : TID > 102 krad, SEL LETth > 80.4MeVcm2/mg@ 85℃

A wire harness in military or aerospace applications is an assembly of wires, cables, connectors, and protective components designed to organize and route electrical and signal connections efficiently