The NIDV supports its members in both the national and international markets in as many ways as possible. From participation in international projects, international trade fair visits to programs with government support. You can find more information about these initiatives below. International projects The NIDV organizes various opportunities for its participants to improve their international opportunities. The NIDV facilitates international trade fair participation, matchmaking events with international Original Equipment Manufacturers (OEMs) and meetings about international opportunities. Trade fairs and trade missions Participation in trade fairs takes place in close consultation and collaboration with a number of departments. The Ministries of Foreign Affairs, Defense and Economic Affairs are involved in the activities. For the government part, the RVO is involved in the creation of the Dutch pavilion and hospitality lounge with the help of the Ministry of Economic Affairs and Climate Policy. In addition to trade fairs and trade missions, the NIDV actively participates in various international projects. Partners for International Business (PIB) Partners for International Business (PIB) is a program that allows Dutch companies to realize their international ambitions in a public-private partnership. Doing business abroad is not always easy. You may encounter trade barriers, insufficient knowledge among local governments and companies, or adverse local legislation. Collaborating with other companies in the sector and the Dutch government can ensure that you are in a stronger position. Alliance II The NIDV will participate in EU-ALLIANCE II from 2021 to 2023, this European project aims to support SMEs on the international market in the field of technical textiles, connectivity and advanced materials on “dual use” markets in four target countries , namely: United States, Canada, Japan and Indonesia.

Intel® 14th/13th/12th-Gen Core™ 24C/ 32T 35W/ 65W CPU Affordable IP66-rated design for waterproof and dustproof Up to 96GB DDR5 4800 SODIMM -25°C to 70°C wide-temperature fanless operation 3x 2.5Gb and 1x Gb Ethernet ports via M12 X-coded connectors, with 802.3at PoE+ option 1x waterproof USB3.2 Type-C port supporting alternative mode for DisplayPort and USB3.2 dual output 8V to 48V DC input with built-in ignition power control

We developed and optimized an object detection and tracking solution tailored for edge environments using Intel Atom platforms with OpenVINO. The system combines MobileNetV3-SSDLite for detection and MobileNetV3-Small for tracking, enabling efficient real-time performance on resource-constrained devices. Through model optimization and inference acceleration, we achieved over 2x improvement in FPS and more than 50% enhancement in inference speed, all while maintaining detection and tracking accuracy. This demonstrates the solution’s suitability for lightweight, low-power edge AI applications

This product supports the following transmission standards. Designation Bit Rate ========== ========== CXP-1 1.250 Gbps CXP-2 2.500 Gbps CXP-3 3.125 Gbps CXP-5 5.000 Gbps CXP-6 6.250 Gbps CXP-12 12.500 Gbps The CXR-2C amplifies and transmits image signals from 1/2-channel CoaXPress cameras to a PC frame grabber. Typically, transmission matches the distance between the camera and the device. Transmission distance depends on the coaxial cable type, and due to significant variability, specific distances are not provided.

Key Features - Frequency Range: 8.5 - 10GHz - RX Noise Figure: 3.0dB - RX Small Signal Gain: 21 dB - TX Small Signal Gain: 27dB - TX High Pout: 39dBm - TX High PAE: 37% Chip size: 2.9x2.5x0.1mm  

The SC-SBCRTM, a Seedcore Co., Ltd representative product, is a backplane transmission module that performs the I/O function of the SBC627. When the SBC627 board is plugged into the motherboard(Backplane) in front of the Chassis, you can extend the I/O function of the board by plugging the SC-SBCRTM board into the back of the Backplane.

EMCORE’s exclusive photonic integrated chip (PIC) technology delivers improved reliability and repeatability. The precision non-ITAR GEO-FOG 3D Dual features two GNSS antennas on a fixed PTK baseline to offer increased heading, pitch, and roll accuracy for static and dynamic applications where a single antenna system can be problematic. This dual antenna INS is the best choice for systems requiring heading at start-up or in low dynamic conditions. Highlights Data rate 10x faster than other available systems Cutting-edge sensor fusion for dependable, precise navigation in a full array of applications and conditions Six degrees of freedom (DoF) IMU with integrated gyros and accelerometers Technology Details Photonic Integrated Chip Technology EMCORE’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s even more reliable and delivers superior repeatability unit-to-unit. With three of these integrated photonic gyros at its core, the P-1750 IMU enables the GEO-FOG to provide the safe, accurate performance autonomous platforms demand. Learn More DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. GEO•FOG Manager The GEO•FOG Manager is ideal when integrating EMCORE’s GEO•FOG 3D and GEO•FOG 3D Dual INS. Learn More Developer’s Kit for Rapid Integration The KVH FOG/IMU Developer’s Kit includes easy-to-use software to accelerate your IMU and FOG integration, development, and interface efforts.

DIVE (Digital Interactive Virtual Environment) is a GIS-based smart construction management platform jointly developed by ZYX Technology and Korea Expressway Corporation. Designed to meet the growing demand for intelligent infrastructure solutions, DIVE provides real-time integration, monitoring, and analysis of all location-based construction data. By consolidating diverse sources such as design drawings, land maps, aerial imagery, BIM data, drone footage, and CCTV into a single platform, DIVE enables comprehensive, on-site visibility and control. From large-scale infrastructure to complex tunnel projects, all key information can be accessed and compared in real time, allowing for smarter, faster, and more accurate decision-making. The main dashboard provides a live overview of each project site, including tasks, equipment, workers, events, and safety issues. With its daily work management feature, site managers can view exact personnel and equipment allocations for each zone, improving efficiency and minimizing risk. DIVE also supports seamless integration with tunnel monitoring systems, offering real-time access to excavation status, geotechnical sensors, and worker presence inside the tunnel. This ensures enhanced safety and process transparency in high-risk environments. Drone integration further strengthens site management by providing up-to-date aerial visuals, reducing blind spots and enabling rapid response to field changes. In addition, the platform links design drawings with cadastral maps to streamline permitting, track construction progress, and manage change orders with geographic accuracy. Whether you're building roads, tunnels, or complex infrastructure, DIVE empowers construction teams with a powerful digital environment to manage the entire project lifecycle.