Key Features Revolutionary speed enabled by advanced LFD technology High-resolution and highly accurate prints Compatible with a wide range of resins including functional and engineering materials Dimensions: 390 × 367 × 554 mm Build Volume: 200 × 125 × 210 mm Weight: 18.3 kg Specifications XY Resolution: 25μm Minimum Layer Thickness: 25μm Maximum Print Speed: 100 mm/hr

PELICAN-D JT is a MWIR detector for missile applications. The FPA is InSb based, having digital Readout Integrated Circuit (ROIC) in a format of 640 x 512 with 15μm pitch. Pelican-D JT has a unique structure of Dewar which enables very fast cool down time and hence quick mission readiness using Joule-Thomson (JT) cooler. Due to the low heat load on the focal plane, the detector achieves long mission duration. The Detector can be supplied with a proximity board which provides Camera Link interface to the customer system. This highly simplifies the integration of the detector to the system.

Dim. : 2"W High strength type 13 webbing 2 rows of 1/2" MOLLE webbing Removable antimicrobial/FR treated spacer mesh pad 2" Cobra® buckle Vertical pull test 6,800 lbs +/-5% Loop/hook selectable at the inner Velcro Composition Material : 500D Cordura® + ARAMID / PV® Size : SMALL 32" - 35.5" MEDIUM 34.5" - 38" LARGE 38" - 41.5" Colors: MC (MultiCam) BMC (Black MultiCam) BK (Black) RG (Ranger Green) CYT (Coyote Brown)

EMCORE’s exclusive photonic integrated chip (PIC) technology delivers improved reliability and repeatability. The precision non-ITAR GEO-FOG 3D Dual features two GNSS antennas on a fixed PTK baseline to offer increased heading, pitch, and roll accuracy for static and dynamic applications where a single antenna system can be problematic. This dual antenna INS is the best choice for systems requiring heading at start-up or in low dynamic conditions. Highlights Data rate 10x faster than other available systems Cutting-edge sensor fusion for dependable, precise navigation in a full array of applications and conditions Six degrees of freedom (DoF) IMU with integrated gyros and accelerometers Technology Details Photonic Integrated Chip Technology EMCORE’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s even more reliable and delivers superior repeatability unit-to-unit. With three of these integrated photonic gyros at its core, the P-1750 IMU enables the GEO-FOG to provide the safe, accurate performance autonomous platforms demand. Learn More DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. GEO•FOG Manager The GEO•FOG Manager is ideal when integrating EMCORE’s GEO•FOG 3D and GEO•FOG 3D Dual INS. Learn More Developer’s Kit for Rapid Integration The KVH FOG/IMU Developer’s Kit includes easy-to-use software to accelerate your IMU and FOG integration, development, and interface efforts.

DIVE (Digital Interactive Virtual Environment) is a GIS-based smart construction management platform jointly developed by ZYX Technology and Korea Expressway Corporation. Designed to meet the growing demand for intelligent infrastructure solutions, DIVE provides real-time integration, monitoring, and analysis of all location-based construction data. By consolidating diverse sources such as design drawings, land maps, aerial imagery, BIM data, drone footage, and CCTV into a single platform, DIVE enables comprehensive, on-site visibility and control. From large-scale infrastructure to complex tunnel projects, all key information can be accessed and compared in real time, allowing for smarter, faster, and more accurate decision-making. The main dashboard provides a live overview of each project site, including tasks, equipment, workers, events, and safety issues. With its daily work management feature, site managers can view exact personnel and equipment allocations for each zone, improving efficiency and minimizing risk. DIVE also supports seamless integration with tunnel monitoring systems, offering real-time access to excavation status, geotechnical sensors, and worker presence inside the tunnel. This ensures enhanced safety and process transparency in high-risk environments. Drone integration further strengthens site management by providing up-to-date aerial visuals, reducing blind spots and enabling rapid response to field changes. In addition, the platform links design drawings with cadastral maps to streamline permitting, track construction progress, and manage change orders with geographic accuracy. Whether you're building roads, tunnels, or complex infrastructure, DIVE empowers construction teams with a powerful digital environment to manage the entire project lifecycle.

Taktic buckle system for quick connect & release Antibacterial/FR treated padded spacer mesh system Poly mesh cummerbund for increased ventilation XFrame® Dynamic Load Carrige® compatible Compatible with our entire accessories line Flush admin chest pocket with internal elastic straps PALS webbing for MOLLE attachment Zipper for DS Assaulter's Zip-On Back Panels QASM buckle system Increased structural integrity and reduced rear deformation Internal plate pocket retention straps accommodate several different plate thickness Soft armor included Composition Material: 500D Cordura® + ARAMID/PV® Size : Small / Medium : 8.5" x 11.5” -9.3" x 12.3" Plate Pocket Front Panel Area of Coverage : Length 13.25” Width 11" Large / XLarge : 10" x 13"- 10.9" x 13.8” Plate Pocket Front Panel Area of Coverage : Length 15" Width 12" Colors: MC (MultiCam) BMC (Black MultiCam) BK (Black) RG (Ranger Green) CYT (Coyote Brown)

항공 전자·소프트웨어 전문 기업으로, 항공기 현대화·통합·시험·인증까지 아우르는 맞춤형 항공전자 솔루션을 OEM·정부·공급사와 협업해 제공합니다.

Micro-D Twinax Connectors (MDTX) offer Twinax blindmate assemblies fitted into a low-profile metalized Micro-D style shell, high speed signalling capable of 100 Ohm differential pair matched impedance, maximum space utilization, ultra miniature size and high vibration capability, extremely light weight and modular with true signal integrity.