AI-based Intelligence, Surveillance and Reconnaissance Equipment

We can manufacture products that comply with MIL-PRF and MIL-STD standards, and offer radiation-hardened designs, hermetic packaging, and Class S and Class K screening services. Space Satellite Communication Providing optimized performance in space radiation environments with radiation-hardened semiconductors and hermetic packaging solutions. Deep Space & Earth Observation Ensuring long-term mission reliability with high-reliability power management ICs, RF components, and Class K screening products. Launch Vehicle Electronics Providing rugged packaging and hermetic components that withstand extreme temperatures and shocks. Defense Missile & Precision Guided Munitions Ensuring lightweight and shock-resistant performance with miniaturized, high-reliability semiconductors and customized packaging. Electronic Warfare & Radar Providing high-performance components, including high-frequency RF components, power amplifiers, and high-speed digital ICs. Avionics & Secure Communications Providing EMI/EMC-compliant circuit protection devices and highly reliable power management solutions.

GORE® SKYFLEX® Aerospace Materials are a portfolio of unique, commercially-available material sets, forms and sizes with a wide range of engineered properties and specifications. Gore’s tapes and gaskets are specified by leading civil and defense aircraft OEMs and solve many challenges such as sealing, abrasion, corrosion and gap filling. These materials can also withstand a wide range of temperatures.

Titanium Grade 1 -Strip Titanium Grade 2 -Bars-Sheets and Plates-Tubes and Pipes Titanium Grade 4 -Bars-Sheets and Plates-Wire Titanium Grade 5 (6Al-4V) -Bars-Sheets and Plates Titanium Grade 5 ELI -Bars-Sheets and Plates Titanium Grade 7 -Bars-Sheets and Plates-Tubes and Pipes Titanium Grade 9 (3AL2.5V) -Tubes and Pipes Titanium Ti-6Al-7Nb -Bars

Fast & precise 5-axis exceeds expectations • 15000, 20000 r/min high speed spindle • B-axis/C-axis 0.0001 degree control as standard • Tool change time (C-T-C) 3.8s, 28% faster than previous model • Increased X/Y/Z-axis rapid traverse speed & acc./dec. • Cooling functions as std. on spindle, motor/LM guide/ball screw (X/Y/Z), C-axis table motor • Integrated thermal compensation systems for spindle and structure FURTHER INCREASED MACHINING CAPACITY • Ø630mm dia. 2-axis tilting table, 26% increased compared to previous model • Max. Ø600 x H500mm machining area, 32% increased compared to previous model • Max. 400kg table load capacity with stable table support structure • X/Y/Z axis travel distance 650/520/480mm, up to 20% increased compared to previous model EASY ACCESS, EASIER OPERATION • Easy setup of workpieces with 580mm distance between operator and table center • Easy tool exchange by placing the tool magazine door on the front and applying a tool removal device (Auto Kicking Device) • Improved chip disposal capability with enhanced coolant flood & flushing functions • Grease lubrication system • Compact integrated automation system (AWC)

A device that integrates and displays comprehensive navigation information for submarines, enabling operators to control various navigation sensors and systems while supporting mission execution. - Compliant with MIL-SPEC standards (shock, vibration, temperature/humidity, EMI/EMC) - Mechanically engineered design for improved maintainability

Specification Array Format : 1280 × 1024 Pixel pitch : 10㎛ Spectral range : 0.9㎛ ~ 1.7㎛ (SWIR) Operability : ≥ 99.5% Quantum Efficiency : 70% @ 1550nm Application Near-infrared Imaging Imaging Spectroscopy Surveillance Medical Science and Biology Astronomy and Scientific Material inspection Food inspection Forgery detection