• Arinc connectors • Modular connectors • D-sub / Rectangular connectors • Terminal blocks • Quick junction modules

Plane Windows are used as substrates for a variety of applications, such as laser window, output couplers, beamsplitters, beam combiners, mirrors, dichroic filters and plate polarizers. Considerations in selecting window substrates include transmission range, absorption coefficient, incident laser power density and environmental factors such as pressure, temperature, moisture, abrasion and corrosion. Plane Windows listed under UV / VIS / NIR substrates are specified for applications involving coating wavelengths 193nm ≤ λ〈2.0 μm. Units for these substrates are given in mm. Plane Windows listed under IR substrates are specified for applications involving coating wavelengths λ≥ 2.0 μm. Units for these substrates are given in inches. Refer to the THIN FILM COATINGS section for information on coatings that can be applied to these substrates.

- Compact size with built-in drive, position sensor, DC motor and gear box - Better durability & faster speed under similar rated load comparing to 12Lf series thanks to the bigger 17mm diameter DC motor - Position, current and speed control along with position & current feedback - Easy digital extended I/O control through 4 x Expansion I/O ports (No coding) - 27/37/50/87mm(*) stroke option (*): Each 3mm stroke can be added when adjusting the long stroke limit through Total Manager software. Rated load of 17N~70N depending on the lead angle for each stroke (Speed is inversely proportional to the rated load, so the higher the rated load, the slower the speed.) - RS-485 MODBUS-RTU protocol applied (IR open protocol is not provided) - Action feature which enables user’s motion save & run

Designed to deliver the highest level of performance, the non-ITAR TAC-450-360 IMU includes our exclusive photonic integrated chip (PIC) technology. The high-performance TAC-450-360 IMU is designed for applications in which high bandwidth, low latency, and low drift are critical. The TAC-450-360 IMU is integrated with inertial-grade accelerometers and three axes of magnetometers to provide the high accuracy levels that leading autonomous and manned platforms demand. Highlights Designed for ease of integration with flexible interface settings and programmable message outputs Excellent performance in critical applications and the specs that matter most Improved SWaP plus robust performance and survivability Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.

Localization development for general parts of Naval Logistics Command in progress

This miniaturized system allows, depending on the desired configuration, to move very precisely between 1 and 3 sets of lenses over a stroke of several centimeters. The design has been optimized to ensure perfect alignment of the lenses and to minimize their tilt throughout the movement. This optomechanical system mainly consists of high-precision standard MPS and FAULHABER modules, such as brushless or stepper motors, ground ball screws with double nuts and linear ball bearings. It is particularly recommended for focusing a laser over a long distance, for example for the guidance of unmanned flying objects or for communication between flying objects. The number of lens sets, lens size and stroke can be configured at will.

Yuan Thor platform serves as the computational core for autonomous systems. Powered by NVIDIA® Jetson Thor™ (128GB LPDDR5X, 2560 CUDA cores, 96 Tensor cores), it delivers up to 2070 FP4 TFLOPS of AI performance for real-time sensor fusion, data analytics, and edge decision-making. Thor supports 16× MIPI CSI-2 cameras, audio in/out, CAN Bus, UART, I²C, SPI, and GPIO, enabling precise, low-latency responses for robotics, industrial automation, and autonomous vehicles.

Side shells, wing shells and fuselage structures are made of CFK, GFK, aluminium or organic sheets and get connected during production. Sealants are used to seal the connection surfaces. These are usually two-component polysulphides, which have to be applied in different geometries. Typical applications are: Fillet sealings, oversealings, interface sealings and seal caps. Due to their properties, polysulfides require very low pressure and shear handling. The compressibility of the fillers contained in the medium requires a high level of expertise and a coherent overall system from material removal to application. With manual application, long production times and high material ejection have a negative influence on the complete process. Complex quality standards are required due to the risk of human error. With the in-house developments of the vipro-DUOMIX from ViscoTec, this process can be depicted fully automatically. The individual nozzle design is also adapted to each application. The result is a controlled dosage in compliance with the specifications and at the same time the highest repeat accuracy.