A REDCOM SVG system consists of one or more REDCOM Sigma® SVG-1200 units and a series of standard production General Dynamics Sectéra vIPer phones. Each REDCOM SVG-1200 can interface with up to 12 vIPer phones, which act as voice encryptors for TDM or VoIP voice networks. The encryptors allow any line, trunk, or conference port to conduct secure voice communications with any SCIP-capable device. If more than 12 secure talk paths are required, multiple SVG-1200 units may be networked together.

1. Battery Pack with Battery Management System (BMS) • High energy density cells, Rapid charge/discharge • State Estimation Technology, Multiple Sensing & Sensor Fusion • Thermal management design, Overcharge/overdischarge protection circuits • Real-time Diagnostics, Safety Compliance through Anomaly Detection 2. Hydrogen Fuel Cell Power Pack (1.6kW/3.5kW) • Patented Core Technology • Smart Energy Blending - High Energy Efficiency • Rapid Hydrogen Fueling 3. Energy Storage System (ESS) • Energy Efficient • Stable Power Supply of the Grid • Sensing & Diagnostics

NVIDIA IGX is a cutting-edge AI platform delivering high-performance, secure, and reliable computing. Built on autonomous-driving expertise, it supports industrial automation and medical devices, with PCIe expansion for extra vision inputs and full-stack enterprise-grade software and long-term support.

Lock Ring & Braid & Backshell

Generates 2D electronic map images using a terrain database and transmits them to the mission computer via the ARINC-818 standard. Using Collins Aerospace's TERPROM software, enabling automatic terrain-following flight and terrain collision avoidance functions. - x2 Gigabit Ethernet - x1 MIL-STD-15583B - x4 Discrete Input - x2 Discrete Output - x4 ARINC-818 Transmit - 512GB Solid-State Disk (Digital Moving Map) - 64GB Solid-State Disk (TERPROM) - Size : 135.1x339.0x225.4 mm - Weight : 4.25Kg - Power : MIL-STD-704F (28VDC, 60W) - Environment: MIL-STD-810G - EMI/EMC: MIL-STD-461G

Supports non-destructive inspection of aircraft composite skin structures and is composed of a piezoelectric layer sensor, data acquisition equipment, and damage analysis software. Utilizes piezoelectric sensors to generate Lamb-wave and acquire signals, collecting data to accurately detect and assess composite damage. Visualizes inspection results on display such as damage location, size and index. - POD Accuracy: 1 inch 90% or more - POD Precision : Position error within 30 mm - 64 channels / 230 path reference detection time within 10 minutes - Sensor : Resonance resistance less than 400kΩ - Sensor : MIL-STD-810G - Sensor : RTCA DO-160 Section 23.0 - DAQ : x128 Piezoelectric sensor interface

Dynamic Load Carriage® system Dim. : 6.5" W PALS webbing for MOLLE attachment Patented Ballistic Vein® Composition Material : 500D Cordura® + ARAMID / PV® Size : SMALL 26" - 30" MEDIUM 29" - 33" LARGE 32" - 36" XLARGE 36" - 40" Colors: MC (MultiCam) BMC (Black MultiCam) BK (Black) RG (Ranger Green) CYT (Coyote Brown)

Our in-vehicle monitoring solution applies VLM-powered indoor and outdoor cameras to deliver real-time driver and passenger awareness. By integrating AI models such as facial landmark and head pose detection, gaze tracking, object recognition, and human pose estimation, the system supports safety features like drowsiness detection, distraction monitoring, and surrounding object awareness. Optimized for automotive SoCs including Qualcomm, and running on QNX RTOS and Linux, our solution combines model compression, embedded optimization, and a streamlined development pipeline. This ensures reliable, low-latency performance tailored for next-generation connected and intelligent vehicles.