We distribute high-end military and aerospace connectors that meet the highest standards of reliability and durability, even in the most demanding conditions. Our portfolio includes a wide range of connectors and accessories for the defense industry, aviation, space applications, and other demanding industrial sectors.

High-quality aerospace-grade aluminum forgings, produced from 6000 and 7000 series ingots sourced from reputable foundries. Our company specializes in forging and heat-treating to meet specific customer requirements, including ring and plate shapes, for defense industry applications.

The AGTR-NEO is engineered for dynamic applications, offering a high sampling rate for single-channel measurements and efficient multi-channel acquisition. Its DO-160G qualification underscores its suitability for aerospace integration. Key Features: - 8 Optical Channels, sequential sampling - 19.2 kHz Single-Channel Sampling, 50 Hz for 8 channels - DO-160G Qualified - Onboard Data Processing and Storage: Integrated miniature single board computer for efficient data handling. - Compact and Lightweight - Flexible Mounting: Designed for easy installation with multiple M4 mounting points. - Ethernet Communication: Supports TCP or UDP protocols. - ARINC 801 Optical Interface: Ensures compatibility with aerospace communication standards.

Founded in 1849, Ducommun is the oldest company in California, USA. Currently located in Carson, near Los Angeles, the company began as a hardware supply store in Los Angeles during the California Gold Rush and now designs and manufactures aerospace, RF coaxial switches, switch matrices, and millimeter-wave components. - Microwave Products (available from DC to 46GHz SPST through the SP10T range) - Switch Matrices (product design and customization to meet individual customer requirements) - Ducommun RF products cover the DC range up to 110GHz - Coaxial Switches available up to 40GHz - Low Noise / High Power RF Products - Space-Grade Products

Wing shells, side shells and fuselage sections are usually made of carbon fibre composites and glued together during the production process. With many components, a groove or an open edge remains after the bonding process, which must be filled or sealed. A modified two-component epoxy resin is often mixed and then applied manually. This often entails long production times and complex quality controls. Equally high material costs due to the processing of materials from cartridges. ViscoTec defies short pot life and materials that are difficult to handle: Thanks to a coherent overall system from material removal to material application, this process can be automated. The two components are taken separately from cartridges, hobbocks or drums and fed via hose lines to a two-component dosing system. Only at the very end of the process they are mixed in a static mixing tube and applied to the substrate (e.g. via a nozzle). The process is controlled and monitored by pressure sensors.

- Compact size with built-in drive, position sensor, DC motor and gear box - Better durability & faster speed under similar rated load comparing to 12Lf series thanks to the bigger 17mm diameter DC motor - Position, current and speed control along with position & current feedback - Easy digital extended I/O control through 4 x Expansion I/O ports (No coding) - 27/37/50/87mm(*) stroke option (*): Each 3mm stroke can be added when adjusting the long stroke limit through Total Manager software. Rated load of 17N~70N depending on the lead angle for each stroke (Speed is inversely proportional to the rated load, so the higher the rated load, the slower the speed.) - RS-485 MODBUS-RTU protocol applied (IR open protocol is not provided) - Action feature which enables user’s motion save & run

The Pulse-80 is a premium tactical-grade MEMS IMU, engineered for applications demanding compact size and minimal weight without any compromise on performance.

We have taken the standard housing configuration of the P1 & P3 mounting dimensions while incorporating true differential pair contacts within the P1 & P3 dimensional constraints. P1 connector housing contains 21 position true differential pair blind mate contacts allowing board designers to carry high density differential pair signals from the LRU via motherboard to daughter-card plug in modules with a single connector P1 type housing.