Flow Switches

< Frequency Range > ● LB-400: 400 ~ 460MHz ● LB-900: 800~928MHz ● MB-1500: 1300~1500MHz ● MB-2400: 2400 ~ 2500MHz ● HB-5.2: 5150 ~ 5250MHz ● HB-5.8: 5725 ~ 5875MHz < TX path output Power (at antenna port) > ● Normal mode: 35dBm [min] ● On each antenna port 2x 35dBm ● Interference mode: 40dBm [min] < TX path maximum Input Power > ● +20 dBm < RX path Gain > ● 25dB typ. < RX path Noise figure > ● Low bands: 3dB max. ● High bands 3.5dB max. < RX path IIP3 > ● -10dBm typ. < RX IP1dB compression point > ● 15dBm typ. < Power Supply > ● +24V ± 1 Vdc

This Ka-band antenna and data transmission device incorporates electronic beam steering antenna technology and software-defined radio technology as part of the Ka-band downlink system for satellites. It serves as a key component of data downlink systems within the satellite payload, supporting high-speed data transmission. The device enables system optimization through miniaturization, lightweight design, and single-unit modularization.

Powering front-line fighters globally and backed by a continuous infusion of new technology, the F110 remains the engine of choice around the world.

EMCORE’s exclusive photonic integrated chip (PIC) technology delivers improved reliability and repeatability. The precision non-ITAR GEO-FOG 3D Dual features two GNSS antennas on a fixed PTK baseline to offer increased heading, pitch, and roll accuracy for static and dynamic applications where a single antenna system can be problematic. This dual antenna INS is the best choice for systems requiring heading at start-up or in low dynamic conditions. Highlights Data rate 10x faster than other available systems Cutting-edge sensor fusion for dependable, precise navigation in a full array of applications and conditions Six degrees of freedom (DoF) IMU with integrated gyros and accelerometers Technology Details Photonic Integrated Chip Technology EMCORE’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s even more reliable and delivers superior repeatability unit-to-unit. With three of these integrated photonic gyros at its core, the P-1750 IMU enables the GEO-FOG to provide the safe, accurate performance autonomous platforms demand. Learn More DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. GEO•FOG Manager The GEO•FOG Manager is ideal when integrating EMCORE’s GEO•FOG 3D and GEO•FOG 3D Dual INS. Learn More Developer’s Kit for Rapid Integration The KVH FOG/IMU Developer’s Kit includes easy-to-use software to accelerate your IMU and FOG integration, development, and interface efforts.

Haigh-Farr offers a family of low-cost Blade antennas covering frequencies from 300 MHz to 8 GHz. These antennas have been in use for over 30 years in airborne applications, and most models are available for off-the-shelf delivery. Haigh-Farr also offers a series of broadband blade antennas covering a variety of frequency ranges.

Aviation electrical system services As Korea's largest and most advanced wire harness and cable assembly manufacturer, Huneed Technologies produces simple to highly complex wire harness and electrical panel assemblies for global OEMs. Huneed Technologies provides cost-effective solutions for aviation electrical systems requirements and specializes in a wide range of low-volume production lines. With state-of-the-art equipment capable of laser wire marking, Huneed Technologies ensures high quality and cost competitiveness for system control, electrical conduction, testing and support for numerous aircraft and equipment platforms. Huneed Technologies provides Built-to-Print service that meets specifications for products of any size.

Based on our state-of-the-art facilities, the semi-conductor machinery component sector manufatctures parts including Chamber assembly, and Main Frame Assembly.