This rocket nozzle featuring conformal cooling channels and isogrid ribbing was manufactured using EOS Copper CuCP, a pure copper material optimized for additive manufacturing. The production required approximately 72 hours, taking advantage of the exceptional thermal and electrical conductivity of pure copper to meet demanding aerospace performance requirements. As one of the few companies in Korea capable of performing metal additive manufacturing with pure copper, we provide advanced technical expertise and support OEM production as well as collaborative technology development projects with various industrial partners. The showcased component was designed by nTopology and demonstrates the synergy of advanced design optimization with state-of-the-art copper additive manufacturing.

The French aerospace sector is a leader in Europe and in the world. GIFAS protects this number-one status that enables our country and its industry to assert itself on the international stage. The development of our industry has been possible thanks to a constant dialogue with our international partners.

WPGM0811100M is a 100W Gallium Nitride (GaN) Monolithic Microwave Integrated Circuit (MMIC). WPGM0811100M is useful for high power X-band Radar applications. Spec Frequency : 8-11GHz Saturated Output Power : 100W@9.5GHz PAE : 38.7% Power Gain : 29.5dB@9.5GHz Operating Voltage : 28-32V

Our product forms include strip, sheet, plate, bar, forging stock, wire,welding products, fittings, pipe and tubing.

The X-BEAM TECH HXB Connectors, featuring expanded beam technology, hermaphroditic connection, rugged construction for field deployment have been designed for harsh environment applications such as military tactical communications, avionics, offshore systems, outside broadcast, mining and plant.

The expanded beam technology uses expanded and collimated beams to couple optical fibers without any contact. It could allow for optics to be used in areas that have been quite restrictive due to presence of damage or contamination at the fiber end. Hermaphroditic connector design enables fast deployment by daisy-chaining multiple cable segments. HXB series connectors also enable transfer of electrical signal or power using hybrid insert configuration.

An optimized Plasma FIB-SEM platform with proprietary gas chemistries for high-quality delayering of the most current semiconductor devices

1. Battery Pack with Battery Management System (BMS) • High energy density cells, Rapid charge/discharge • State Estimation Technology, Multiple Sensing & Sensor Fusion • Thermal management design, Overcharge/overdischarge protection circuits • Real-time Diagnostics, Safety Compliance through Anomaly Detection 2. Hydrogen Fuel Cell Power Pack (1.6kW/3.5kW) • Patented Core Technology • Smart Energy Blending - High Energy Efficiency • Rapid Hydrogen Fueling 3. Energy Storage System (ESS) • Energy Efficient • Stable Power Supply of the Grid • Sensing & Diagnostics

MDCX, multipin coax connectors, offer low VSWR of 1.25:1 (typ) up to 10 GHz (max mated pair), maximum overall diameter of 0.125" fitted into low-profile micro-D housing, with constant 50 Ohm airline impedance. MDCX coaxial contacts are compact in size allowing multiple high density connections in a Micro-D style shell for applications where space and weight savings are important. No cumbersome spring mounts are required. These connectors are also available with locking post mechanisms or blindmate hardware attachment.