EMCORE’s exclusive photonic integrated chip (PIC) technology delivers improved reliability and repeatability. The precision non-ITAR GEO-FOG 3D Dual features two GNSS antennas on a fixed PTK baseline to offer increased heading, pitch, and roll accuracy for static and dynamic applications where a single antenna system can be problematic. This dual antenna INS is the best choice for systems requiring heading at start-up or in low dynamic conditions. Highlights Data rate 10x faster than other available systems Cutting-edge sensor fusion for dependable, precise navigation in a full array of applications and conditions Six degrees of freedom (DoF) IMU with integrated gyros and accelerometers Technology Details Photonic Integrated Chip Technology EMCORE’s new photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s even more reliable and delivers superior repeatability unit-to-unit. With three of these integrated photonic gyros at its core, the P-1750 IMU enables the GEO-FOG to provide the safe, accurate performance autonomous platforms demand. Learn More DSP Technology EMCORE’s DSP electronics improve FOG performance in critical areas such as scale factor and bias vs. temperature, scale factor linearity, and maximum input rate. EMCORE’s exclusive DSP design overcomes the limitations of analog signal processing, eliminating temperature-sensitive drift and rotation errors. GEO•FOG Manager The GEO•FOG Manager is ideal when integrating EMCORE’s GEO•FOG 3D and GEO•FOG 3D Dual INS. Learn More Developer’s Kit for Rapid Integration The KVH FOG/IMU Developer’s Kit includes easy-to-use software to accelerate your IMU and FOG integration, development, and interface efforts.

We offer service centers and sales offices worldwide. Our service centers’ capabilities extend from specialized cutting to supplying parts cut to specific drawings and specifications, which reduce your labor time and material waste. We can be a partner in your entire material management system. We are continuously expanding our capabilities to increase your operation’s efficiency and shorten your cycle time. Our highly trained staff and technicians are dedicated to providing solutions that exceed your expectations. Some of our processing capabilities and value-added services include:

Whether you need on-demand delivery of finished goods, end-use technical support or a partner with a global presence, Haynes International provides value far beyond the alloys themselves.

- Detects fire through heat sources when installed in areas where optical fire detectors are difficult to apply, such as in the presence of contaminants or obstructed visibility - Capable of detecting fire even if the sensing line is severed - Length can be adjusted depending on the equipment applied

GORE® SKYFLEX® Aerospace Materials are a portfolio of unique, commercially-available material sets, forms and sizes with a wide range of engineered properties and specifications. Gore’s tapes and gaskets are specified by leading civil and defense aircraft OEMs and solve many challenges such as sealing, abrasion, corrosion and gap filling. These materials can also withstand a wide range of temperatures.

We bring all our skills and expertise to bear in product development and in-service support in order to meet our customers' needs: 3D drawings and design Aeroelasticity Thermal, CFD analysis Static and dynamic analysis Electrical/hydraulic/mechanical system design Cost-optimized design, cost-benefit analysis Parametric experiment design Optimization techniques and algorithms Multiphysics modeling Concessions management: control plan, extension of concession, design engineering office, concession justification, impact analysis (FMECA, process/design change, etc.), definition of a repair program, updating of certifications Flight physics Configuration management Design, calculation and modeling Composite or metallic parts

BERNIER designed the CMASD line specially for harsh environments. This line presents the same apreciated characteristics than the CMA connectors in a smaller shell in which can be set up to 8 contacts. Its ergonomics and toughness enhances headsets and handsets use and its construction allows high speed data communication. . Applications RADIOS – ACCESSORIES – INTERCOMS – CRYPTED DATA – OPTRONIC DEVICES – WEAPON SYSTEMS – RUGGED COMPUTERS – TACTICAL EQUIPEMENTS

Neustrelitz is located 100 kilometres north of Berlin. Here, DLR receives data from the German radar missions TerraSAR-X and TanDEM-X, the KOMPSAT satellites of the Korean Aerospace Research Institute (KARI), the European Sentinel fleet and the American Landsat series, among others. The multi-antenna and multi-mission configuration of the ground station allows information products to be delivered to customers within minutes after data reception. These include products for national and European authorities for maritime safety, such as wind and sea state estimates, ice classification, ship navigation through ice-covered waters, detection of navigation irregularities or oil spills as well as the space weather. The Neustrelitz ground station offers data reception in the S, X, and Ka bands as well as data uplink in the S and X bands.

The SC-DSPRTM, a Seedcore Co., Ltd representative product, is a backplane transmission module that performs the I/O function of the DSP282A. When the DSP282A board is plugged into the motherboard(Backplane) in front of the Chassis, you can extend the I/O function of the board by plugging the SC-DSPRTM board into the back of the Backplane. The DSP282A board consists of two computing nodes. To support this, Ethernet, USB, MMCX, and mini-HDMI ports are allocated to each node, and synchronization signal input ports can also be used simultaneously on both nodes.