High-power laser weapons targeting objects at 0.5 ~ 4.0km distances require optical components with sub-nm wavefront error precision. Our Company has successfully developed aspherical polishing and high-power laser coating technologies for Ø300 ~ 550mm optical components through defense project experiences. measurement technology 1) Laser Induced Damage Threshold(LIDT) - The evaluation to confirm the durability of optical components is called LIDT (Laser-Induced Damage Threshold), which is defined as "the maximum amount of laser radiation incident on an optical component when the expected probability of damage is zero" (ISO 21254). In other words, it represents the maximum intensity or power of laser that an optical component can withstand, making it a critical requirement in laser weapon systems. - Our company has established LIDT measurement technology and in-house facilities developed in accordance with ISO 21254 standards. When compared with LIDT test results from domestic and international companies during laser weapon system development, we have demonstrated measurement technology and accuracy that meets or exceeds industry standards. While overseas companies require more than one month for verification processes, our company can immediately provide reliable data through our LIDT system. 2) Cavity Ring Down Spectroscopy(CRDS) - When the reflectivity is 99.997%, this may not present significant issues in low-power laser applications. However, in high-power laser components, even the 0.05% of light that passes through the optical mirror can cause problems in vulnerable parts of the system, including rear optical instruments, bonded lenses, and control cables. Therefore, measurement and evaluation methods for high-reflectivity optical mirrors are extremely important. - Currently, the transmittance and reflectance of optical components are generally measured using spectrophotometers, but measuring reflectance levels of 99.5% or higher is not possible with this method. CRDS (Cavity Ring-Down Spectroscopy) technology is required to achieve measurement resolution beyond that of spectrophotometers, and our company has established this system to measure the reflectance of various optical components. This is a critically important technology for responding to high-power laser weapon system development requirements.

KVPX+ Series is an embedded interconnect system that provides unrivaled performance in harsh environments while adapting to the VITA standard design requirements. KVPX+ Series is a shielded, high-density, high-speed, modular interconnect system optimized for differential pair architectures on a 1.8mm x 1.35mm grid.

Our electronics business sector has been producing copper cladded laminates of printed circuit boards for over 20 years. To meet high heat dissipation for the newest electronic technology, we have developed metal based laminates and carbon laminates.

Features - Excellent absorption performance (Max: -25 dB, Avg: -10 dB) - Withstands 00 minutes at 000 °C - Easily applicable to complex structures, including curved surfaces, gaps, and protrusions - Low dry density and specific gravity - Reduced number of coating layers (improving workability) - Passed environmental resistance and durability tests according to the operating conditions of guided missiles. - Insulating properties to minimize the effects of lightning

Designed to deliver the highest level of performance, the non-ITAR TAC-450-360 IMU includes our exclusive photonic integrated chip (PIC) technology. The high-performance TAC-450-360 IMU is designed for applications in which high bandwidth, low latency, and low drift are critical. The TAC-450-360 IMU is integrated with inertial-grade accelerometers and three axes of magnetometers to provide the high accuracy levels that leading autonomous and manned platforms demand. Highlights Designed for ease of integration with flexible interface settings and programmable message outputs Excellent performance in critical applications and the specs that matter most Improved SWaP plus robust performance and survivability Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.

Today, space satellites are moving away from RF Analog based payloads providing low speed telecommunication signaling, to a new Digital Transparent Processor architecture for high throughput satellites. Those architectures increase the demand for rugged and higher speed connectivity. To meet those industry needs, Smiths Interconnect has developed the NXS Series, an advanced high speed, high density interconnect to provide next generation data on demand. Equipped with the Hypertac® hyperboloid contact technology the NXS system can withstand data rate application up to 50 Gbps (per channel) requirements, including extreme levels of vibration, shock and climatic testing above 2100 g. The NXS Series is designed in a robust construction with 4 or 12 high speed quadrax (dual-twinax) modules. The recent EMI Flange addition provides the extra benefit of reducing electromagnetic interference. Each ultra-high density quadrax module contains 2 dual twinax at 100 Ω each pair. It is blind mateable, hot pluggable, with ultra-low mating forces and low outgassing materials. In addition, the solderless PCB mount design reduces the customer’s risk and cost of ownership. The connector is mounted after reflow and has no impact on nearby components.

Integrated logistics support division, a Vendor Item Tool Manager, Consumables & Special Cutting Tools, Fixed and Rotary Wing String Lighting.

High impedance D-Sub connectors are designed to ground the outer shield of a twinax or quadrax contact directly to the shell of the connector. A multi-finger ground spring fixed around the shell provides a multi-point contact engagement that affords superior EMI shielding. The end result is an extremely low contact resistance when measured from the contact outer body to the connector flange, ensuring minimal RF noise and high durability of over 500 mating cycles.