characteristicRear wheel drive type (5 forward speeds, 1 reverse speed) Cable Remote Control Type 2nd and 3rd speed Triple Synchro applied apply2.5-ton trucks and medium-sized buses, 3.5-ton trucks and medium-sized buses

TESCAN SOLARIS X 2 extends FIB physical failure analysis capabilities to large-area applications, making deep cross-sectioning of advanced packaging devices, displays, MEMS, and optoelectronic devices more efficient. Featuring the new generation Mistral™ Xe Plasma FIB column, SOLARIS X 2 offers increased maximum ion beam current and a sharper ion beam profile across the full range, with significantly reduced beam tails. This allows operators to use higher milling and polishing currents, achieving superior surface quality comparable to conventional Plasma FIB, but with greater speed and precision.

This product is a test-rig to test the injection and function of various fuel (diesel oil, gas) objects of the main engine. This product model is made from slide fuel valve types of traditional diesel engines to latest dual fuel gas engines GI, GI, LGIP, LGIM/X-DFM, and ammonia fuel valve engines LGIA and X-DFA types, and we are directly doing everything from design to production. In accordance with the maintenance regulations recommended by Everllence and WIN GD, it is a product that tests the normal functionality of fuel injectors of main engine after disassembling, cleaning and reassembling of fuel injection valves.

Developed as Korea’s first hydrogen-and-battery hybrid propulsion system, this next-generation eco-friendly aircraft uses electric batteries for take-off and hydrogen fuel cells for cruise flight, achieving a new standard in sustainable aviation. Recognized as a world-first intellectual property, this model also became the first hydrogen hybrid Advanced Air Mobility (AAM) aircraft in Korea to receive Special Airworthiness Certification from the Ministry of Land, Infrastructure and Transport in 2024.

The VPX power supplies are compliant with VITA 62, MIL-STD-704, MIL-STD-461 and MIL-STD-810 for 28 Vin DC, 270 Vin DC & Universal AC systems. The VPX delivers up to 1000 W and up to 6 outputs with a typical efficiency of 91%. Offered in VITA approved ruggedized 3U and 6U size packages with internal conduction cooling and high speed backplane connectors.

Amphenol RF is the world's largest manufacturer of coaxial connectors used in radio frequency, microwave, and data transmission system applications. Headquartered in Danbury, Connecticut, USA, Amphenol RF has global sales, marketing, and manufacturing facilities in North America, Asia, and Europe. Its connectors, adapters, cable assemblies, and other RF and microwave solutions are widely used in a wide range of industries and applications, including automotive, broadband broadcasting, instrumentation, medical, and defense wireless equipment. Amphenol RF's industry-leading manufacturing technology and process control enable it to produce high-quality coaxial connectors and cable assemblies at high volumes.

Hybrid wet tantalum capacitors with unique chemistry and construction making it the most power dense capacitor in the industry. DC Storage Power for: • T/R Modules • Electronic Warfare • Directed Energy • High Power Amplifier • Power Interruption (MIL-STD 704/D0-160) Advanced Capacitors for Demanding Applications • High Power 10V to 125V • Low ESR • >100 Amp Discharge • Hermetic • Unlimited Cycle Life • Unlimited Shelf Life • Low Weight/Volume • High Shock and Vibe • >5 Million Hour MTBF • 55°C to 125° C Operation

Designed to deliver the highest level of performance, the non-ITAR TAC-450-360 IMU includes our exclusive photonic integrated chip (PIC) technology. The high-performance TAC-450-360 IMU is designed for applications in which high bandwidth, low latency, and low drift are critical. The TAC-450-360 IMU is integrated with inertial-grade accelerometers and three axes of magnetometers to provide the high accuracy levels that leading autonomous and manned platforms demand. Highlights Designed for ease of integration with flexible interface settings and programmable message outputs Excellent performance in critical applications and the specs that matter most Improved SWaP plus robust performance and survivability Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.