GE Aviation and Safran launched on June 14, 2021, a bold technology development program targeting more than 20 percent lower fuel consumption and emissions c...

The GSG-8 GNSS Simulator is an advanced software-powered turnkey simulator, supporting multi-constellation, multi-frequency, and hundreds of satellite signals. With an incredible 1000 Hz iteration rate, the GSG-8 GPS Simulator is ideal for space trajectories, custom PNT signals, hardware-in-the-loop, and any type of all-in-view satellites simulation. With the GSG-8 Simulator, you can generate RF signals to simulate how your receiver device will react in the real world, under the simulation parameters that you set. Control every aspect of your simulation, including 6 Degrees of Freedom (DoF) receiver trajectories, multi-vehicle simulation, multi-path signals, jamming and spoofing, as well as atmospheric interferences. The GSG-8 is the most popular positioning, navigation, and timing test solution offered through Safran’s GSG family of Skydel-based simulators. It was developed to deliver the highest standard of Global Navigation Satellite System (GNSS) signal testing and sensor simulation performance in an easy to use, upgradable and scalable platform.

Dovetail Connector Series features C Series Spring Probes, renowned for their incomparable shock and vibration performance, housed in a patented block design. These connectors make it easy to explore the benefits of spring probe technology without the investment associated with custom tooling.

The SCXMC-AURORA is one of Seedcore’s flagship products, designed for high-speed optical data communication through an XMC interface. Utilizing the Xilinx Aurora 64B/66B protocol, it supports four transmit/receive channels, each operating at 10.3125 Gbps via integrated optical transceivers. A device driver program is required for operation, and the Linux driver can be downloaded from the product information page on Seedcore’s website. This module is deployed in the M-SAM air defense system, providing reliable and high-speed data transfer between mission-critical embedded components.

Today, space satellites are moving away from RF Analog based payloads providing low speed telecommunication signaling, to a new Digital Transparent Processor architecture for high throughput satellites. Those architectures increase the demand for rugged and higher speed connectivity. To meet those industry needs, Smiths Interconnect has developed the NXS Series, an advanced high speed, high density interconnect to provide next generation data on demand. Equipped with the Hypertac® hyperboloid contact technology the NXS system can withstand data rate application up to 50 Gbps (per channel) requirements, including extreme levels of vibration, shock and climatic testing above 2100 g. The NXS Series is designed in a robust construction with 4 or 12 high speed quadrax (dual-twinax) modules. The recent EMI Flange addition provides the extra benefit of reducing electromagnetic interference. Each ultra-high density quadrax module contains 2 dual twinax at 100 Ω each pair. It is blind mateable, hot pluggable, with ultra-low mating forces and low outgassing materials. In addition, the solderless PCB mount design reduces the customer’s risk and cost of ownership. The connector is mounted after reflow and has no impact on nearby components.

The GCS is an all-in-one portable Ground Control System designed to command swarm UAVs in diverse field environments such as military operations or outdoor performance venues. Depending on the operator’s mission environment and purpose, three type options are offered: HardCase, Shelter, and Tablet. The HardCase GCS is optimized for outdoor operations, featuring a 1,000 cd/m² high-brightness touch monitor with anti-glare and anti-fingerprint (AG + AF) coatings for enhanced usability. Dual monitors are equipped as standard for multi-UAV control, with the option to expand to additional displays. It integrates a high-capacity internal battery, 220 VAC power output, real-time system monitoring, and an automatic cooling system, enabling stable operation without additional setup in any environment. Furthermore, multiple interface ports—including USB, USB-C, and HDMI—provide broad compatibility with diverse devices.

Explore nanoscale structure with clarity, speed, and confidence. Tescan’s STEM solutions are purpose-built for advanced materials research, semiconductor analysis, and detailed nanoscale characterization. With integrated 4D-STEM, precession-assisted diffraction, and synchronized EDS workflows, our instruments deliver actionable insight with unmatched usability—whether you're mapping strain, analyzing phases, or accelerating failure analysis and R&D.

FSI is an authorized stocking distributor for Avdel/Pop, AVK, Cherry Aerospace, Gesipa USA, Huck, Sioux, Makita Assembly Tools and Zephyr Tool Group, Monobolt and Magna-Lok