GENASYS Ultra high-performance mixed signal test platforms deliver a no compromise functional test solution for satellite, airborne electronics, and other mission critical applications. The scalable architecture supports up to 4500 "any resource to any pin" interface test points and features best-in-class digital performance, with preconfigured Benchtop solutions addressing a broad spectrum of lower channel density applications.

Side shells, wing shells and fuselage structures are made of CFK, GFK, aluminium or organic sheets and get connected during production. Sealants are used to seal the connection surfaces. These are usually two-component polysulphides, which have to be applied in different geometries. Typical applications are: Fillet sealings, oversealings, interface sealings and seal caps. Due to their properties, polysulfides require very low pressure and shear handling. The compressibility of the fillers contained in the medium requires a high level of expertise and a coherent overall system from material removal to application. With manual application, long production times and high material ejection have a negative influence on the complete process. Complex quality standards are required due to the risk of human error. With the in-house developments of the vipro-DUOMIX from ViscoTec, this process can be depicted fully automatically. The individual nozzle design is also adapted to each application. The result is a controlled dosage in compliance with the specifications and at the same time the highest repeat accuracy.

· Proven combat ship developed based on the latest warships of the ROK Navy · Expanded VLS capacity for layered air-defense and strike missions · AI-driven CMS for faster threat assessment and multi-domain coordination · Unmatched growth potential for future naval missions with larger deck space and increased displacement

It is suitable for various low voltage and is safe low-voltage motor through thorough quality verification. Applications are AGV, AMR and Medical devices.

r-TWR are digital towers which enable the remote use of air traffic services (ATS) from any location. Being at an airport, air base or at a centralised location, distance is no longer a factor. The r-TWR functions can be integrated to a traditional tower as a hybrid solution, and can support the ramp and apron management using the same information. It can also be deployed and put in place when needed. Through the use of digital camera technology and sensors, operators can effectively conduct and manage various services remotely, based on visual surveillance. This removes the need to be on-site and occupying critical space at an airport, in favour of a chosen location.

The high-reliability DC-DC onverters brings SynQor’s field proven high-efficiency synchronous rectifier technology to the Military/Aerospace industry. SynQor’s innovative QorSeal® packaging approach ensures survivability in the most hostile environments. Compatible with the industry standard format, these converters operate at a fixed frequency, have no opto-isolators, and follow conservative component derating guidelines.

Cool comfort fit and excellent elasticity with Nylon & Span materials Enhanced breathability & moisture absorption with mesh fabrics Applied Velcro® to sleeve for patch attachment V-neck / Round-neck design Long Sleeve / Short Sleeve Composition Material : NY80/PU20 High Gauge Trichord (Nylon & Span) Size 95 ~ 115 Colors BK (Black) RG (Ranger Green) CYT (Coyote Brown)

The new TAC-450-320/340/360 inertial measurement unit (IMU) is a dependable, tactical-grade, non-ITAR inertial system that’s also affordable. It features EMCORE’s exclusive photonic integrated chip (PIC) technology for robust performance and survivability and offers inertial-grade MEMS accelerometers for outstanding FOG-based inertial performance as affordable as MEMS alternatives. The TAC-450-320/340/360 IMU is ideal for autonomous and unmanned commercial and defense applications, mobile mapping and surveying systems, targeting and pointing systems, and guidance and positioning. Highlights Compact and lightweight with high-performance Offered with 16g inertial-grade MEMS accelerometer Robust performance with high bandwidth Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-320/340/360 IMU provides the safe, accurate performance autonomous platforms demand. State-of-the-art Electronics EMCORE’s Dual Core DSP electronics with ARM processor require less power for extended product life and offer higher speed with integrated multi-channel processing. Low-loss optical circuits use less light for greater efficiency. Feature Options Developer’s Kit for Rapid Integration The FOG/IMU Developer’s Kit includes easy-to-use software that accelerates your IMU and FOG integration, development, and interface efforts.