The single-board computer developed by Coats Technology is a core component that implements the performance of weapon systems and satisfies high reliability under environmental conditions such as temperature, vibration, shock, and EMI. It also performs data processing, integration and control of various onboard equipment through data buses, and communication functions to automate command and control, communication, computing, and information elements.

R&S®M3SR은 민간, 방위, 해상 지-공-지 통신 솔루션을 위한 최신 고정식 무전기를 대표하는 기기입니다. 로데슈바르즈는 점차 엄격해지는 통신 요구사항에 대해 수년 간의 실무 경험을 기반으로 한 기술 개념으로 대응하고 있습니다. 무전기는 가장 엄격한 품질 측면을 충족하여 최대 RF 성능을 제공합니다. 이 고성능 소프트웨어 정의 무전기는 전 세계 보안 당국과 정부 조직에서 높은 평가를 받고 있습니다.

Key Features Revolutionary speed enabled by advanced LFD technology High-resolution and highly accurate prints Compatible with a wide range of resins including functional and engineering materials Dimensions: 390 × 367 × 554 mm Build Volume: 200 × 125 × 210 mm Weight: 18.3 kg Specifications XY Resolution: 25μm Minimum Layer Thickness: 25μm Maximum Print Speed: 100 mm/hr

CarboNIX NEO is an off-the-shelf separation system available in 8", 15", and 24“, 31.6” and 38.81” sizes. It is scalable to any custom diameter for satellites upwards of 1000 kg. While NEO uses the same lock mechanism and pusher arm subsystems as CarboNIX, NEO employs a new clamp ring system which is stronger, stiffer, can withstand higher loads and launch heavier spacecraft than any other separation system on the market.

The NIDV supports its members in both the national and international markets in as many ways as possible. From participation in international projects, international trade fair visits to programs with government support. You can find more information about these initiatives below. International projects The NIDV organizes various opportunities for its participants to improve their international opportunities. The NIDV facilitates international trade fair participation, matchmaking events with international Original Equipment Manufacturers (OEMs) and meetings about international opportunities. Trade fairs and trade missions Participation in trade fairs takes place in close consultation and collaboration with a number of departments. The Ministries of Foreign Affairs, Defense and Economic Affairs are involved in the activities. For the government part, the RVO is involved in the creation of the Dutch pavilion and hospitality lounge with the help of the Ministry of Economic Affairs and Climate Policy. In addition to trade fairs and trade missions, the NIDV actively participates in various international projects. Partners for International Business (PIB) Partners for International Business (PIB) is a program that allows Dutch companies to realize their international ambitions in a public-private partnership. Doing business abroad is not always easy. You may encounter trade barriers, insufficient knowledge among local governments and companies, or adverse local legislation. Collaborating with other companies in the sector and the Dutch government can ensure that you are in a stronger position. Alliance II The NIDV will participate in EU-ALLIANCE II from 2021 to 2023, this European project aims to support SMEs on the international market in the field of technical textiles, connectivity and advanced materials on “dual use” markets in four target countries , namely: United States, Canada, Japan and Indonesia.

Tescan AMBER integrates BrightBeam™ field-free SEM optics with the Orage™ Ga⁺ FIB and fully automated lamella workflows. Designed for versatility, it supports inverted and planar sample prep, nanoprototyping, and gentle final polishing across a wide range of material types.

The ARTUS Lite’s prowess extends to tele-operation scenarios, particularly within military, nuclear, and bio-pharma applications, where an end-effector that operates with both finesse and confidence is crucial. It provides a safe and precise solution for remote manipulation in hazardous or inaccessible environments, proving vital in environments where the safety and replacement of manual labor are urgent concerns. It excels in machine tending and pick-and-place automation within greenhouses, warehouses, and recycling facilities, enhancing productivity while prioritizing worker safety.

Battlefield's Quick Disconnect technology is a leader in the UAV industry, and is now expanding expanding into ground defense vehicles. With over one million hours of successful flight time, Battlefield's quick disconnects have proven exceptional reliability even in extreme environments. EnduroLink by Battlefield has become the global standard UAV quick disconnects, widely applied across small to mid-sized UAV platforms worldwide. Fully customizable integrated design is available, including materials, size, and various end connect options even in the most demanding conditions.