LightIR series key features: • High MTF performance • Extremely compact, light, configurations • Suitable for a wide range of low-SWaP applications • Maintains focus through the entire zoom range • Compatible with major MWIR and LWIR detectors • Designed to withstand harsh environmental conditions

Our electronics business sector has been producing copper cladded laminates of printed circuit boards for over 20 years. To meet high heat dissipation for the newest electronic technology, we have developed metal based laminates and carbon laminates.

The COX640AV embodies COX’s cutting-edge cooled MWIR imaging technology, delivering unparalleled performance for the most demanding applications. Its 640x512 resolution and 15μm pixel pitch InSb sensor achieve thermal sensitivity of less than 20mK, ensuring crystal-clear imaging for precise analysis. Capable of operating across a wide temperature range, the COX640AV supports multiple imaging modes and advanced processing functions including AGC, NUC, and customizable color palettes. This ensures adaptability to a variety of mission-critical environments such as defense, aerospace, scientific research, and industrial inspection. In addition to superior imaging quality, the COX640AV is designed for reliability and operational readiness. With rapid image stabilization after startup and robust construction, it performs consistently in harsh environments where stability is non-negotiable. Its combination of cooled MWIR precision, advanced processing features, and rugged design positions the COX640AV as a trusted solution for customers who require accuracy, speed, and durability. By integrating COX’s proprietary calibration expertise, it not only provides outstanding real-time imaging but also guarantees long-term reliability and service continuity.

GAIN CRITICAL CLARITY WITH SATELLITE TASKING Task ICEYE SAR satellites to access groundbreaking data on any location on Earth – day or night and in any weather. The process is simple and images are usually delivered within 24 to 48 hours of your initial request. ORDERING SAR DATA – MADE SIMPLE We believe access to reliable and timely SAR Earth observation data should be available to all, so we provide access options designed to meet your specific mission needs and collection timeframes. The process begins with defining your area of interest, revisit frequency and other parameters. The first images are usually acquired, downlinked, decoded and processed within 24 hours of the initial request and delivered within 8 hours after that.

The Nebula connector employs the renowned Hypertac hyperboloid contacts as the bedrock of its high reliability providing immunity to shock and vibration fretting and over 100,000 mating cycles. These features combine with current carrying capacity up to 1.5 Amps per contact and low insertion / extraction forces to provide significantly enhanced quality and reliability performance compared with other more commodity connector solutions. Available for direct mounting to PCB, the Nebula Series supports independent function for all its 22 contacts. It also offers optional quarter-turn locking hardware for faster connector securing and to prevent unintentional separation.

ORSKOREA’s centerless grinding machines ensure stable accuracy and durability without the need for chucks or centers. By allowing workpieces to rotate freely between the grinding and regulating wheels, they deliver high-efficiency and uniform machining for shafts, pins, housings, and other cylindrical components used in aerospace, defense, and advanced automotive systems. Key Advantages • High productivity through fast, efficient multi-part processing • ±2μm precision and long-term repeatability • Versatility to handle components from small to large sizes • Hydrostatic slides and spindles minimizing heat and vibration • Proven stability for high-value part manufacturing such as engine components, battery cases, and optical housings By combining productivity, accuracy, and reliability, ORSKOREA’s centerless grinders significantly enhance competitiveness in both defense and civilian applications.

TESCAN SOLARIS X 2 extends FIB physical failure analysis capabilities to large-area applications, making deep cross-sectioning of advanced packaging devices, displays, MEMS, and optoelectronic devices more efficient. Featuring the new generation Mistral™ Xe Plasma FIB column, SOLARIS X 2 offers increased maximum ion beam current and a sharper ion beam profile across the full range, with significantly reduced beam tails. This allows operators to use higher milling and polishing currents, achieving superior surface quality comparable to conventional Plasma FIB, but with greater speed and precision.

EMCORE’s SDI170 IMU is designed as a performance-compatible inertial system that is form, fit, and functional with a legacy RLG-based IMU product, but with superior overall performance, versatility, and a significantly higher MTBF (Mean Time Before Failure) rating over ruggedized environments. The tactical performance of the SDI170 IMU is based on EMCORE’s mature, proven, dependable and accurate quartz MEMS inertial sensor technology in our SDI500 tactical-grade IMU. EMCORE’s quartz technology enables repeatable high-volume production of precisely machined sensor structures combined with the inherent large signal output and thermal stability of quartz materials. The SDI170 IMU is designed for demanding, mission-critical, rugged environments and ideal for continuous use applications with no wear-out components, highly linear accelerometer performance and longer life compared to competing alternatives. It is constructed with EMCORE’s latest generation quartz gyros, quartz accelerometers, and high-speed signal processing to achieve outstanding precision performance. The solid-state quartz sensors and hermetically sealed IMU construction provide reliable MTBF and a 20-year operating and storage life. Continuous Built-in Test (BIT), configurable communications protocols, electromagnetic interference (EMI) protection and flexible input power compatibility make the SDI170 IMU easy to use in a wide range of higher-order integrated commercial and defense system applications.