A Main Generator installed in the K2 main engine that supplies power to the system.

It is an UAV recovery system that lands a fixed-wing UAV even in mountainous terrain where there is no sufficient runway for landing. The UAV is damping through a net mounted on the vehicle and lands on an air-cushion mat. It has the advantage of being easy to deploy in places where vehicles can enter and exit. But the type of the aircraft capable of stable landing is limited.

Your Benefits: Stunning Image Quality SWaP-Optimized, Smallest Shape, IP69K Protection Ultra-Low Latency G2G (Glass-to-Glass) Frame Rate: 60 Hz Increased Optical Resolution 2.1 MP, 1920 x 1080 Dynamic Range: 120 dB Integrated Heater for De-Icing / De-Misting FoV 53°, Alternatives tbd

The AGTR-NEO is engineered for dynamic applications, offering a high sampling rate for single-channel measurements and efficient multi-channel acquisition. Its DO-160G qualification underscores its suitability for aerospace integration. Key Features: - 8 Optical Channels, sequential sampling - 19.2 kHz Single-Channel Sampling, 50 Hz for 8 channels - DO-160G Qualified - Onboard Data Processing and Storage: Integrated miniature single board computer for efficient data handling. - Compact and Lightweight - Flexible Mounting: Designed for easy installation with multiple M4 mounting points. - Ethernet Communication: Supports TCP or UDP protocols. - ARINC 801 Optical Interface: Ensures compatibility with aerospace communication standards.

TESCAN SOLARIS X 2 extends FIB physical failure analysis capabilities to large-area applications, making deep cross-sectioning of advanced packaging devices, displays, MEMS, and optoelectronic devices more efficient. Featuring the new generation Mistral™ Xe Plasma FIB column, SOLARIS X 2 offers increased maximum ion beam current and a sharper ion beam profile across the full range, with significantly reduced beam tails. This allows operators to use higher milling and polishing currents, achieving superior surface quality comparable to conventional Plasma FIB, but with greater speed and precision.

The KX1-3046 is an X-band high-power MMIC amplifier fabricated on the GaN-on-SiC process. It operates from 8.0 – 10.5 GHz and typically provides 30W saturated output power with power-added efficiency of 46%. The KX1-3046 can support military and commercial radar systems. It is matched to 50Ω with integrated DC blocking capacitors on both RF input and output ports. The KX1-3046 is 100% DC and RF tested on-wafer. It is available in chip form. **Key Features** - Frequency Range: 8.0-10.5GHz - Small Signal Gain: 28dB - High Pout: 30W - High PAE: 46% - DC bias: Vd=28V @Idq=0.6A - Pulsed Vg: PW=100µs, DC=10% - Chip size: 2.95x3.1x0.1mm  

High density, lightweight signal connector specifically designed for applications where space and weight is at a premium for board to board interconnections. The HDLP series meets the requirement of space-constrained applications that require low mating force, a high number of mating cycles, low and stable contact resistance, and excellent fretting corrosion resistance.

Our firm offers end-to-end GaN production capabilities, including fabrication, packaging, test, and failure analysis to meet custom requirements. To enable customer designs, a process design kit (PDK) is available with a design manual, sample layouts, and a non-linear device model. Options available include fabrication of customer-designed wafers (“PDK foundry service”) or custom design by TransEON and fabrication according to customer specs (“NRE foundry service”). For either option, volume levels available include pilot/engineering runs, multi-project wafers (MPWs), or full production runs.