Amphenol stands as one of the world’s largest manufacturers of interconnect products. We specialize in the design, manufacturing, and marketing of a wide range of innovative solutions, including electrical, electronic, and fiber optic connectors. Our product offerings also encompass coaxial and flat-ribbon cables, as well as comprehensive interconnect systems tailored to meet the needs of various industries. With a commitment to quality and cutting-edge technology, Amphenol delivers reliable connectivity solutions that enhance performance and efficiency. Explore our extensive portfolio of interconnect products to find the perfect fit for your application.

1. Fixed Wing Aircraft MRO/Mod./Upgrades area 2. Starting with KAI’s military depot level maintenance program, 3. From providing service to KAI’s indigenous platform, Upon cooperation with global OEMs, KAEMS is capable of delivering various types of military solution with quality. [Military Business] - ROKN P-3CK Depot level maintenance - ROKAF E737 AEWCS Modification - F-16 US Airforce Depot level maintenance - KF-16 ROK Airforce Ram Coating Program - Training Jet T-50 FWD Fuselage Assemble

The SCXMC-AURORA is one of Seedcore’s flagship products, designed for high-speed optical data communication through an XMC interface. Utilizing the Xilinx Aurora 64B/66B protocol, it supports four transmit/receive channels, each operating at 10.3125 Gbps via integrated optical transceivers. A device driver program is required for operation, and the Linux driver can be downloaded from the product information page on Seedcore’s website. This module is deployed in the M-SAM air defense system, providing reliable and high-speed data transfer between mission-critical embedded components.

GENASYS Ultra high-performance mixed signal test platforms deliver a no compromise functional test solution for satellite, airborne electronics, and other mission critical applications. The scalable architecture supports up to 4500 "any resource to any pin" interface test points and features best-in-class digital performance, with preconfigured Benchtop solutions addressing a broad spectrum of lower channel density applications.

Generates 2D electronic map images using a terrain database and transmits them to the mission computer via the ARINC-818 standard. Using Collins Aerospace's TERPROM software, enabling automatic terrain-following flight and terrain collision avoidance functions. - x2 Gigabit Ethernet - x1 MIL-STD-15583B - x4 Discrete Input - x2 Discrete Output - x4 ARINC-818 Transmit - 512GB Solid-State Disk (Digital Moving Map) - 64GB Solid-State Disk (TERPROM) - Size : 135.1x339.0x225.4 mm - Weight : 4.25Kg - Power : MIL-STD-704F (28VDC, 60W) - Environment: MIL-STD-810G - EMI/EMC: MIL-STD-461G

Built with a rugged design and clear display, the TACNAV UMD offers: Highlights Active dot-matrix design, delivering unparalleled flexibility User-friendly interface with easy-to-read icons, messages, and pop-up menus Features Generation III NVG (night vision goggle)-compatible Four “soft keys” for easy operation Interchangeable with both Commander’s and Driver’s Displays, reducing logistics and cost Military standard approved for outstanding performance and reliability Ideal for integration into digital Battle Management Systems Compatible with all existing and future EMCORE TACNAV systems Applications Military vehicle requiring a user-friendly interface for its tactical navigation system The TACNAV UMD is controlled by the Arms Export Control Act (Title 22, USC Sec 2751 et seq.) and the International Traffic in Arms Regulations, ITAR 22 CFR 120-130, and may not be exported from the United States or disclosed to a foreign person in the United States except as authorized by those regulations.

- Interior lighting used by removing it from the upper cockpit mount - Adjust the DIM/BRT brightness by operating the knob switch - NVIS WHITE per MIL-STD-3009

- Form factor: 6U VME64x - Processor: Intel® E3-1505Lv6 2.2GHz 4 Cores and 8 Threads - Memory: 16,000MB DDR4 SDRAM w/ECC, (1) 73GB up NVMe SSD