The NIDV supports its members in both the national and international markets in as many ways as possible. From participation in international projects, international trade fair visits to programs with government support. You can find more information about these initiatives below. International projects The NIDV organizes various opportunities for its participants to improve their international opportunities. The NIDV facilitates international trade fair participation, matchmaking events with international Original Equipment Manufacturers (OEMs) and meetings about international opportunities. Trade fairs and trade missions Participation in trade fairs takes place in close consultation and collaboration with a number of departments. The Ministries of Foreign Affairs, Defense and Economic Affairs are involved in the activities. For the government part, the RVO is involved in the creation of the Dutch pavilion and hospitality lounge with the help of the Ministry of Economic Affairs and Climate Policy. In addition to trade fairs and trade missions, the NIDV actively participates in various international projects. Partners for International Business (PIB) Partners for International Business (PIB) is a program that allows Dutch companies to realize their international ambitions in a public-private partnership. Doing business abroad is not always easy. You may encounter trade barriers, insufficient knowledge among local governments and companies, or adverse local legislation. Collaborating with other companies in the sector and the Dutch government can ensure that you are in a stronger position. Alliance II The NIDV will participate in EU-ALLIANCE II from 2021 to 2023, this European project aims to support SMEs on the international market in the field of technical textiles, connectivity and advanced materials on “dual use” markets in four target countries , namely: United States, Canada, Japan and Indonesia.

This plays an important role that connects EMI shielding pieces of connectors and cables when manufacturing EMI shielded cables. It is also applied and used in defense, space, aviation, and industrial equipment. Key features of the military connector adapter: Designed to be compatible with various MS/VG standard connectors and general connectors. Environmental Protection: It is waterproof and dustproof, ensuring stable operation in severe weather and extreme environments. Robustness: It is highly durable against impact, vibration, corrosion, and more to meet military and industrial requirements. EMI shield: Prevent electromagnetic interference (EMI) to maintain signal integrity.

The QRS116 is a compact angular rate sensor ideally suited for applications in tactical, aerospace and mission-critical instrumentation. The QRS116 features exceptionally low noise, fast start-up, and a simple electrical interface, the QRS116 has no moving parts ensuring long service life and high MTBF. System Performance PARAMETERS SPECIFICATIONS Standard Ranges ±100°/sec Input Voltage + 5 Vdc ±5% regulation Short Term Bias Stability (100 sec at const. temp) 3 deg/hr Output Noise ( DC to 100 Hz) ≤ 0.002°/√Hz* * Values Indicated are for ±100°/sec. Range Features Exceptional Bias Stability Unprecedented Low Angle Random Walk Values Superior Vibration Performance Compact Industry-Standard Package (Same as QRS11) Rugged, Compact Package Integrates easily Applications Tank Turret Stabilization Defense Fixed Wing Defense Helicopter Unmanned Aerial Vehicles UGV – Unmanned Ground Vehicle Platform Stabilization Camera Stabilization Antenna Stabilization ROV – Remotely Operated Vehicle

DIVE (Digital Interactive Virtual Environment) is a GIS-based smart construction management platform jointly developed by ZYX Technology and Korea Expressway Corporation. Designed to meet the growing demand for intelligent infrastructure solutions, DIVE provides real-time integration, monitoring, and analysis of all location-based construction data. By consolidating diverse sources such as design drawings, land maps, aerial imagery, BIM data, drone footage, and CCTV into a single platform, DIVE enables comprehensive, on-site visibility and control. From large-scale infrastructure to complex tunnel projects, all key information can be accessed and compared in real time, allowing for smarter, faster, and more accurate decision-making. The main dashboard provides a live overview of each project site, including tasks, equipment, workers, events, and safety issues. With its daily work management feature, site managers can view exact personnel and equipment allocations for each zone, improving efficiency and minimizing risk. DIVE also supports seamless integration with tunnel monitoring systems, offering real-time access to excavation status, geotechnical sensors, and worker presence inside the tunnel. This ensures enhanced safety and process transparency in high-risk environments. Drone integration further strengthens site management by providing up-to-date aerial visuals, reducing blind spots and enabling rapid response to field changes. In addition, the platform links design drawings with cadastral maps to streamline permitting, track construction progress, and manage change orders with geographic accuracy. Whether you're building roads, tunnels, or complex infrastructure, DIVE empowers construction teams with a powerful digital environment to manage the entire project lifecycle.

L14F type liquid level switches

Spring probes provide reliable electro-mechanical performance through hundreds of thousands of cycles. They are available in a variety of sizes, spring forces and terminations. Smiths Interconnect compression mount connectors utilizing spring probe technology offer tremendous advantages in reliability, performance and efficiency in comparison to conventional technologies like stamped metal, wire mesh, pin-and-socket or elastomer. Standard spring probes offering includes battery contact and connector probes designed to optimize contact performance in high-reliability, multiple-cycle interconnect applications.

Tescan AMBER integrates BrightBeam™ field-free SEM optics with the Orage™ Ga⁺ FIB and fully automated lamella workflows. Designed for versatility, it supports inverted and planar sample prep, nanoprototyping, and gentle final polishing across a wide range of material types.