*Perfect automatic camera matching for all types of vision cameras. *Fully supports the Camera Link interface (Area/Line Scan). *User-friendly,No need to modify firmware for frequency compatibility. *Compatible with "10 TAPS@85MHz" internal/external RS232C, all baud retes(20MHz~85MHz),and digital user IO. *Compatible with Base/medium/Full configurations. *Provides camera power from the Tx box. *SFP type module *Works with moving and non-moving fiber cables.

MDCX, multipin coax connectors, offer low VSWR of 1.25:1 (typ) up to 10 GHz (max mated pair), maximum overall diameter of 0.125" fitted into low-profile micro-D housing, with constant 50 Ohm airline impedance. MDCX coaxial contacts are compact in size allowing multiple high density connections in a Micro-D style shell for applications where space and weight savings are important. No cumbersome spring mounts are required. These connectors are also available with locking post mechanisms or blindmate hardware attachment.

Explore nanoscale structure with clarity, speed, and confidence. Tescan’s STEM solutions are purpose-built for advanced materials research, semiconductor analysis, and detailed nanoscale characterization. With integrated 4D-STEM, precession-assisted diffraction, and synchronized EDS workflows, our instruments deliver actionable insight with unmatched usability—whether you're mapping strain, analyzing phases, or accelerating failure analysis and R&D.

Green Optics possess proprietary CVD-based Zinc Sulfide (ZnS) production technology for defense and industrial multi-wavelength optical materials. We have core technological capabilities to manufacture high-quality ZnS products tailored to meet diverse customer requirements. ZnS Material Optical Performance and Processing ZnS materials produced through CVD processes provide high transmittance exceeding 70% in the SWIR wavelength range (8-12 μm). When these materials undergo additional Hot Isostatic Pressing (HIP) treatment, the crystal structure undergoes recrystallization, improving transmission characteristics to achieve over 70% transmittance in the visible (VIS) wavelength range of 0.45-0.8 μm. This process extends the application range of optical materials previously limited to SWIR and LWIR bands, delivering superior optical performance across multi-wavelength regions from VIS to LWIR. Material Specifications: - STD-ZnS (Standard ZnS Material): Manufactured via CVD process, exhibits transmittance exceeding 70% in LWIR wavelengths (8-12 μm) with high physical hardness (Knoop hardness: 210 kgf/mm²). - MS-ZnS (Multispectral ZnS): Converted from STD-ZnS through HIP processing, extends wavelength range into the visible spectrum. While crystal structure recrystallization during this process reduces hardness somewhat (approximately 150 kgf/mm²), it still meets MIL specifications. This dual-processing approach enables comprehensive wavelength coverage while maintaining military-grade durability standards.

Signaty X IR Helmet Strobe is a next‑generation, domestically developed IFF LED device. It features IR plus RGBW color LEDs (red, green, blue, white), all housed under a high‑strength polycarbonate dome. It supports multi‑wireless synchronization via short‑range communication, GPS/RTC, and mesh relay—enabling simultaneous use of RGB LED + IR or RGB LED + white LED, with up to 42 pattern synchronizations (expandable to 252) using 256‑bit encrypted data. Runtime reaches up to 130 hours (LED 130 h / IR 125 h) on a single AA battery. Built to MIL‑STD‑810G and KC standards, it ensures drop, dust, sand, immersion, and temperature resistance. Manufactured in Korea with domestic service support.

In response to USAF IPSAFE contract and developed as part of the LSI’s MACK-5A solution for the modernization of the ACES II Ejection Seat Survival System, the QUAD FIRE™ is LSI’s newest innovative addition to its survival accessory line. This unique survival tool contains four fire starting devices: an arc lighter, a ferro rod and striker, a fresnel lense, and wind/waterproof matches, plus Pyro Putty™ Fireball Tinder.

GE and Safran are evaluating several promising architectures as part of their technology maturation plan. The most ambitious, the one that will yield the gre...

Our firm offers end-to-end GaN production capabilities, including fabrication, packaging, test, and failure analysis to meet custom requirements. To enable customer designs, a process design kit (PDK) is available with a design manual, sample layouts, and a non-linear device model. Options available include fabrication of customer-designed wafers (“PDK foundry service”) or custom design by TransEON and fabrication according to customer specs (“NRE foundry service”). For either option, volume levels available include pilot/engineering runs, multi-project wafers (MPWs), or full production runs.