This rocket nozzle featuring conformal cooling channels and isogrid ribbing was manufactured using EOS Copper CuCP, a pure copper material optimized for additive manufacturing. The production required approximately 72 hours, taking advantage of the exceptional thermal and electrical conductivity of pure copper to meet demanding aerospace performance requirements. As one of the few companies in Korea capable of performing metal additive manufacturing with pure copper, we provide advanced technical expertise and support OEM production as well as collaborative technology development projects with various industrial partners. The showcased component was designed by nTopology and demonstrates the synergy of advanced design optimization with state-of-the-art copper additive manufacturing.

Main Features of CLS-30T3 Camera Link Compatibility: Supports all Camera Link types (Area Scan / Line Scan). Video Distribution: 1:3 distribution capability supporting Base, Medium, and Full configurations. Power over Camera Link (PoCL): Performs PoCL Bypass functionality. Pixel Frequency: Supports a pixel frequency range of 20 MHz to 85 MHz. Transmission Quality: Ensures lossless video signal transmission. Power Connector: Equipped with a lockable DC power jack (Molex connector). Interface: Supports MDR-26 type connectors. Control Signal Support: Supports all standard RS-232 communication speeds.

A heavy-duty, high-strength Actuator Assembly for UAV flap actuation.

Brazing is bonding two or more pieces of metal by means of flowing a filler metal between the joint interfaces at a temperature below the melting point of the base metal. The filler metal, upon cooling to the solid state, forms a strong metallic bond throughout the joined area. Through Dip-Brazing, RF Systems manufacture 1. Brazed Antennas 2. Brazed Waveguides 3. Brazed Divider / Combiner

The 100W High Power Amplifier is an L-band amplifier that delivers 100W output across two channels with a 60% duty cycle. It offers a gain of over 50 dB, with output flatness of 2 dB depending on the input signal level. The amplifier provides an ACLR performance of -20 dBc at maximum output. Equipped with an output-stage bandpass filter (BPF), it achieves excellent harmonic suppression of -70 dBc. Built-in monitoring functions include output signal and temperature monitoring.

The Nebula connector employs the renowned Hypertac hyperboloid contacts as the bedrock of its high reliability providing immunity to shock and vibration fretting and over 100,000 mating cycles. These features combine with current carrying capacity up to 1.5 Amps per contact and low insertion / extraction forces to provide significantly enhanced quality and reliability performance compared with other more commodity connector solutions. Available for direct mounting to PCB, the Nebula Series supports independent function for all its 22 contacts. It also offers optional quarter-turn locking hardware for faster connector securing and to prevent unintentional separation.

The EXOpod is the most advanced cubesat deployment system on the market. It is available in 6U/8U, 12U and 16U sizes which can be broken down into smaller slots to accommodate cubesats of any size. EXOpod Nova, the latest generation of the EXOpod line, is rapidly expanding what the cubesat design standard (CDS) is capable of – cubesats launching with Nova can now increase the volume of their lateral protrusions by 400% and their mass by 30%, enabling a wider and more powerful array of satellite designs and use cases.

A cost-effective and reliable EO/IR solution designed for unmanned platforms, combining compact design with strong performance. The system integrates QVGA/VGA-class infrared sensors and 2–20 megapixel EO cameras, providing versatile options to meet different operational requirements. o Infrared (IR) Sensor: QVGA/VGA resolution, optimized for detection and recognition in short-to-mid range surveillance o Electro-Optical (EO) Module: 2MP–20MP visible light cameras with high-resolution imaging, adaptable to multiple mission profiles o Design Philosophy: Lightweight, compact, and robust for integration into unmanned aerial vehicles (UAVs), unmanned surface vehicles (USVs), and ground robotics o Key Value: Balances price competitiveness, system reliability, and modular scalability for mass deployment