Today, space satellites are moving away from RF Analog based payloads providing low speed telecommunication signaling, to a new Digital Transparent Processor architecture for high throughput satellites. Those architectures increase the demand for rugged and higher speed connectivity. To meet those industry needs, Smiths Interconnect has developed the NXS Series, an advanced high speed, high density interconnect to provide next generation data on demand. Equipped with the Hypertac® hyperboloid contact technology the NXS system can withstand data rate application up to 50 Gbps (per channel) requirements, including extreme levels of vibration, shock and climatic testing above 2100 g. The NXS Series is designed in a robust construction with 4 or 12 high speed quadrax (dual-twinax) modules. The recent EMI Flange addition provides the extra benefit of reducing electromagnetic interference. Each ultra-high density quadrax module contains 2 dual twinax at 100 Ω each pair. It is blind mateable, hot pluggable, with ultra-low mating forces and low outgassing materials. In addition, the solderless PCB mount design reduces the customer’s risk and cost of ownership. The connector is mounted after reflow and has no impact on nearby components.

This EGR-Cooler prototype, developed in collaboration with Hyundai Motor Company, was fabricated using EOS Stainless Steel 316L, renowned for its excellent corrosion resistance and mechanical properties in demanding automotive applications. The part was additively manufactured over a period of 64 hours, demonstrating the advanced capabilities of metal 3D printing for precision and reliability. Unlike conventional designs, this innovative component integrates 14 separate parts into a single, unified structure, greatly simplifying assembly while enhancing operational efficiency. The implementation of a Triply Periodic Minimal Surface (TPMS) structure within the cooler significantly improves heat exchange performance and enables substantial weight reduction, meeting next-generation thermal management requirements. Partners Lab stands as a leader in Korean additive manufacturing technology, offering cutting-edge capabilities in OEM production and collaborative technical development for various industrial sectors. This EGR-Cooler, designed by nTopology, exemplifies our engineering expertise and commitment to delivering high-performance thermal products for automotive and beyond.

Our products serve the clients in military and aerospace industries, who require high performance with strength and ability to perform at extreme temperatures and pressures.

The MAGIC1A is a rugged 3U VPX SWaP-C3 high-performance embedded computer combining an Intel Xeon E3-1505M v6 CPU and NVIDIA Quadro P2000 GPU, offering strong compute performance, broad I/O, rugged resilience, and flexible software support. • Xeon E3-1505M v6 quad-core CPU + Quadro P2000 GPU → ~2.3 TFLOPS • Ethernet, USB, serial, MIL-STD-1553, ARINC 429, DisplayPort/DVI, GPIO; up to 8 TB removable SSD with fast-purge • MIL-STD rated, baseplate or fan cooling; −40 °C to +65 °C range • Supports Linux/Windows/VxWorks & CUDA/OpenCL/DirectX/OpenGL; includes AXIS software toolkit

Designed to deliver the highest level of performance, the non-ITAR TAC-450-360 IMU includes our exclusive photonic integrated chip (PIC) technology. The high-performance TAC-450-360 IMU is designed for applications in which high bandwidth, low latency, and low drift are critical. The TAC-450-360 IMU is integrated with inertial-grade accelerometers and three axes of magnetometers to provide the high accuracy levels that leading autonomous and manned platforms demand. Highlights Designed for ease of integration with flexible interface settings and programmable message outputs Excellent performance in critical applications and the specs that matter most Improved SWaP plus robust performance and survivability Technology Details Photonic Integrated Chip Technology EMCORE’s photonic integrated chip (PIC) technology* reimagines FOG technology by replacing individual fiber components with an innovative integrated planar optic chip. This results in a FOG with PIC Inside™ that’s reliable and robust. With three of these integrated photonic gyros at its core, the TAC-450-360 IMU provides the safe, accurate performance autonomous platforms demand.

The PNT500 is a rugged 3U VPX Assured Position Navigation and Timing(A-PNT) module aligned with the SOSA profile, offering multi-constellation QinetiQ Q40 GNSS, PTP Grandmaster timing, OCXO/CSAC fallback, and ruggedized reliability. • QinetiQ Q40 multi-GNSS receiver with anti-jamming/spoofing • IEEE 1588 PTP Grandmaster; OCXO or CSAC timing fallback, 1 PPS and reference outputs • Rugged single-slot 3U VPX, SOSA-aligned

Engine Start Begins with ATS. The Air Turbine Starter (ATS) is a key component of an aircraft's secondary power system, driven by Bleed Air supplied from the Auxiliary Power Unit (APU) to accelerate the engine up to approximately 8,900 RPM, enabling engine start. Through the in-house development and localization of the ATS, we have incorporated power generation, optimal design of the shear section with consideration of failure, Containment functionality, as well as lubrication and power transmission systems. In addition, we have secured manufacturing and assembly technologies and continue development aimed at successful operation and the establishment of a mass production system.

SkyNaute™ hybrid inertial/GNSS navigation system meets all the safety and reliability requirements for airplanes, helicopters and drones. Thanks to the HRG Crystal™, SkyNaute™ is the most competitive aeronautical navigation system on the market. The best in safe performance SkyNaute™ Inertial Navigation System relies on mature and proven technologies such as HRG Crystal™ Hemispherical Resonator Gyroscopes. Combining high performance and integrity in all circumstances, SkyNaute™ shows exceptional physical features compared to competing INS with similar performance.