The GRA117S is a rugged 3U VPX SOSA-aligned video graphics and GPGPU card delivering high-performance AI and graphics with the NVIDIA RTX™ 5000 and PCIe Gen-4 connectivity. • NVIDIA RTX™ 5000 (Ada Lovelace) GPU: 16 GB GDDR6 ECC, 9,728 CUDA/76 RT/304 Tensor Cores • PCIe Gen-4 interface, AV1/H.264/H.265 codecs, GPUDirect RDMA • Rugged design: conformal coating, air- & conduction-cooled, −40–71 °C range • SOSA slot profiles 14.6.11 & 14.6.13 compliant • Windows/Linux drivers, CUDA/CUDA-X/OpenCL support

Heat engine that converts combustion energy into mechanical energy. It consists of a compressor, combustion chamber, and turbine, and is widely used in aircraft propulsion.

A ground control system that establishes unmanned aerial vehicle missions, controls aircraft and mission equipment, reads image information, and transmits it to higher-level units.

Side shells, wing shells and fuselage structures are made of CFK, GFK, aluminium or organic sheets and get connected during production. Sealants are used to seal the connection surfaces. These are usually two-component polysulphides, which have to be applied in different geometries. Typical applications are: Fillet sealings, oversealings, interface sealings and seal caps. Due to their properties, polysulfides require very low pressure and shear handling. The compressibility of the fillers contained in the medium requires a high level of expertise and a coherent overall system from material removal to application. With manual application, long production times and high material ejection have a negative influence on the complete process. Complex quality standards are required due to the risk of human error. With the in-house developments of the vipro-DUOMIX from ViscoTec, this process can be depicted fully automatically. The individual nozzle design is also adapted to each application. The result is a controlled dosage in compliance with the specifications and at the same time the highest repeat accuracy.

The SWE450S is a rugged 3U VPX fully managed Layer-2/3 Ethernet switch aligned with the compute-intensive SOSA profile, delivering high-performance 25/100 GbE switching and flexible I/O reconfiguration. • High-performance 2 Tbps switch fabric with wire-speed throughput • Front: up to 2x 100 GBASE-SR4 (MPO); Rear: 25/100 GbE KR4, 100/1000 BASE-T, USB-C, RS-232Reconfigurable fat-pipe to thin-pipe ports, speed downgrading capability • Dual-core ARM + OpenWare™ management, sanitization support • SOSA-aligned (SLT3), rugged air- & conduction-cooled options

Technology research that needs to be developed/secured to efficiently train future combat pilots ETS must have the ability to provide a realistic training environment in which pilots can immerse themselves in training through the use of simulations and CGFs within a real platform. The advantage of ETS is that it provides trainees with a training experience that is close to the real thing and reduces overall system operating costs by replacing real systems and consumables with simulations. Developed countries are already continuing to attempt to apply various core technologies to increase the efficiency of ETS. Hangil C&C Co., Ltd. is the only ETS development company in Korea, and is striving to develop cutting-edge ETS by combining years of research and development experience and its core technologies.

Ultra-High Density: With a pin spacing of 0.025 inches, it achieves maximum miniaturization and lightweight design. Ultimate Reliability: Designed to ensure perfect signal integrity even in harsh environments. Durability: Boasts outstanding environmental resistance that meets military and aerospace standards.

Our firm offers end-to-end GaN production capabilities, including fabrication, packaging, test, and failure analysis to meet custom requirements. To enable customer designs, a process design kit (PDK) is available with a design manual, sample layouts, and a non-linear device model. Options available include fabrication of customer-designed wafers (“PDK foundry service”) or custom design by TransEON and fabrication according to customer specs (“NRE foundry service”). For either option, volume levels available include pilot/engineering runs, multi-project wafers (MPWs), or full production runs.